Mechanical And Environmental Specifications - Advantech SKY-MXM-A2000 User Manual

2.7

Mechanical and Environmental Specifications

Table 2.3 describes the mechanical characteristics of the packages.
Table 2.3: DVI-I DDC Mapping
Symbol Parameter
Maximum allowable pres-
P
sure during PCA, system
cont
assembly, and operation.
Maximum allowable package
Tpkg
temperature during device
operation.
Maximum allowable strain
e
during PCA, system assem-
max
bly, or operation.
Note! 1.
2.
3.
SKY-MXM-A2000 User Manual
Min.
-
-
This specification is based on the following conditions:
a. This specification is based on solder ball deformation and die
chips and cracks. Additional requirements may be needed to meet
the thermal performance and/or long-term reliability as to a specific
application.
b. When a compliant thermal interface is used between die and
heat sink, the bond line thickness must have less than 20% varia-
tion.
c. The pressure should be measured on the top of the die surface
by an instrument equipped with pressure sensors. See details in
"GPU Load Distribution Measurement Application Note".
d. Nominal pressure is the total force divided by the die surface
area. Since the pressure may have variations across all the sur-
faces, the following additional requirement is applied.
i. The pressure has to be measured from the top of the die surface
with a grid resolution of 1x1 mm² for the pressure sensor.
e. Both the nominal and maximum pressure requirements must be
met.
Maximum package temperature allowed. It includes device case
and/or junction temperature.
Strain measurement shall follow IPC-9704, particularly on the fol-
lowing items:
a. The strain shall be measured on the top side of the PCB close to
the four corners of the package. A rigid PCB is assumed.
b. For generic applications, the max. allowable strain must be no
more than 500 μstrains for a board thickness from 1.0 to 3.2 mm. A
separate requirement may be specified and the qualification test
should be performed if:
i. A sensitive PCB laminate and buildup structure is used where the
pad cratering occurs at a PCB strain of 500 μstrains or below.
ii. A weak surface finish on the PCB is used where a cracked solder
joint has been observed at a PCB strain of 500 μstrains or below.
iii. The strain rate is too high (.5000 μstrains/second) during PCB
operation.
c. For a PCB thickness of less than 1.0 mm, the max. allowable
strain shall follow IPC 9704.
14
Nominal Max. Units
≤60
≤80 (die
psi
edge)
≤ TBD °C
≤ 500 μstrains
Notes
1
2
3