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Replaceable Parts- -Modet 6l+5fiA
Table
6-1.
neference Designators and Abbreviations
REFEFENCE DESIGNATORS
MP
P
o
R
RT
s
T
TB
TP
F
FL
rc
J
K
L
LS
A
a
BT
c
CP
CR
DL
os
E
=
assembly
= molor
=
batlery
= capaciior
=
coupler
= diode
= delay line
= device signaling
(lamp)
M
=
misc
electronic
part
MK
=
amperes
=
aulomatic Irequency
control
=
amplirier
= luse
=
filter
=
integrated
circuit
= jack
=
relay
= inductor
=
loud speaker
= meler
= microphone
=
hexagonal
=
mercury
=
hour{s)
=
herlz
=
intermediate freq
=
impregnated
=
incandesceni
=
include(s)
=
insulation(ed)
:
internal
=
mechanical part
=
plug
= transislor
=
resistor
=
thermislor
= switch
= transformer
=
terminal
board
= test
point
U
=
integrated
circuil
V
= vacuum, tube, neon
bulb, photocell, etc
VR
= voltage regulator
W
=
cable
X
= socket
Y
=
crystal
Z
= tuned cavity network
RMO
=
rack mount
only
BMS
=
root-mean square
BWV
=
reverse working
voltage
S-B
=slow-blow
SCR
=
screw
SE
= selenium
SECT
=
section(s)
SEMICON
=semiconductor
Sl
=
silicon
SIL
= silver
SL
= slide
SPG
= spring
SPL
= special
SST
= stainless steel
SR
=
split
ring
STL
= steel
TA
:
tantalum
TD
=
time
delay
TGL
=
toggle
THD
= thread
Tl
=
litanium
TOL
= tolerance
TRIM
=
trimmer
TWT
= traveling wave tube
u
=
micro=10_6
VAR
:
variable
VDCW
= dc
working
volts
Wl
=
with
W
= watts
WIV
= working
inverse
voltage
WW
=
wirewound
w/O
=
without
ABBREVIATIONS
CCW
=
eounter-clockwise
CER
= ceramic
CirO
=
cabinet mount
only
COEF
= coelicient
COM
=
common
COUP
:
composition
COMPL
=
complete
CONN
=
connector
CP
=
cadmium plate
ChT
= cathode-ray tube
\
CW
=
clockwise
DEPC
=
deposited carbon
DR
= drive
ELECT
= electrolytic
ENCAP
=
encapsulated
EXT
=
external
F
=
tarads
FH
=
flat
head
FILH
=fillisterhead
FXD
=
fixed
6
= giga
(10s)
GE
= germanium
cL
:
glasg
GRD
= ground(ed)
INCD
INCL
tNs
INT
K
=
kilo=1000
Lll
= lelt
hand
LIN
=
linear taper
LK
WASH
=
lock washer
LOG
= logarithmic
taper
LPF
=
low pass
filter
M
=
miili=.tol
MEG
=
meg=106
MET
FLM
=
metal film
MET
OX
=
metallic oxide
MFR
=
manutacturer
MHZ
=
mega hertz
MINAT
= minialure
MOM
=
momenlary
MOS
=
metal oxide substrate
UTG
=
mounting
MY
=
"mylar"
N
=
nano
(10-e)
N/C
= normally
closed
NE
=
neon
Nl
PL
= nickel
plate
N/O
=
normally open
NOM
-
nominal
NPO
= negative positive zero
(zero temperature
coefricient)
NPN
:
negative-positive-
negalive
NRFR
= not
recommended
for
field
replacement
NSR
=
not separately
replaceable
OBD
=
order
by description
OH
= oval head
OX
= oxide
,
=
peak
PC
=
printed
circuit
PF
:
picofarads=
10-12
farads
PH
BnZ
=
phosphor bronze
pHL
= phiilips
PIV
=
peak inverse voltage
PNP
=
positive-negative-
positive
plg
=
part
of
POLY
=
polystyrene
PORC
=
porcelain
POS
=
position(s)
POT
=
potentiometer
pp
=
peak-to-peak
pT
=
point
PWV
=
peak
working
voltage
nECY
= rectitier
RF
=
radio frequency
RH
=
round
head
or
right
hand
A
AFC
AMPL
H
=
henries
HDW
=
hardware
HEX
HG
BFO
=
beat frequency
oscillator
HR
BE
CU
= beryllium
copper
HZ
BH
= binder
head
BP
=
bandpass
ARS
=
brass
lF
BWO
=
backward wave
oscillator
IMPG
6-3
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