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Ins
tallat
ion-
-Mode
L
6\553A
SECTION
II
INSTATTATION
2.L.
I}ITRODUEfION.
2-2' This section
contains
information for
installing
and
removing
the
Model 5l+653A. rncruded are initial
inspection pro".J*res and instructions
for
repacking
the
instrument
for
shipment.
2.3.
I}IITIAL
INSPECTIO$.
2-L.Inspect
the shipping container for damage. If
the
shipping
container
or
cushioning
material is
damaged,
it
should
be kept until
contents
of
the
shipment have been checked
for
compJ-eteness
and the
instrument has
been
checked mechanically
and
e1ectriea11y.
Procedures
for
checking
eleetrical
performance
are given
in
Section
IV.
If
the
contents
are
incomplete,
if
there
is
mechanical
damage
or defect, or if the
instrument does
not pass
the
Performanee
Tests, notify the nearest
Hewlett-Packard
office.
Keep
the
shipping materials
for earrier's inspection.
The IIP
office will ,,""urr!. for
repair or
replacement
at
HP's option without waiting for
claim
settlement.
2.5.
INSTATLATION.
2-6. rnstallation in
tlne
6\65o4 General purpose preprocessor.
a,
Remove
power from
the
5I+OOO
station.
b.
Connect
W6
from
the
small
General Purpose Preprocessor
eard
to
JI+
on
the Interface
Card.
c.
Connect
W3
from the
Large General
Furpose Preproeessor
card
to
J3
on
the fnterface
Card
d.
Lower
the Interface
Card
into the
Preprocessor
so
that the
component
slde
fits
inside the
pod.
e. Fit the
Pod Cover
hinges into hinge slots on the
General
purpose
Preprocessor
pod.
Lower
the
cover over
the Interface
Card and fasten
dovun
with
screws.
To
avoid possible
damage
from
statie
discharge,
always
eonnect assembly
(Wl+)
from
the
Preprocessor endcap
to J!
on
the Interface
Card.
2-L
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