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10. Welding operation guidance
10.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
)
)
Minimum preheating
Preheat Temperature min
(Tsmin)
100°C
150°C
temperature
Maximum
preheating
Preheat temperature max (Tsmax)
150°C
200°C
temperature
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3°C/second max
3°C/second max
Liquidous Temperature (TL)
Liquid phase temperature
183°C
217°C
Time
(tL) Maintained Above
(TL)
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
(Tp)
Peak temperature
220-235°C
230-250°C
Aveage ramp-down rate (Tp to Tsmax)
Average descent rate
6°C/second max
6°C/second max
Time 25°C to peak temperature
Time
of 25
° C
to
peak
temperature
6 minutes
max
8 minutes
max
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