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Ⅵ Welding Operation Guidance
6.1 Reflow temperature
Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
6.2 Reflow soldering curve
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Curve characteristics
Tin paste
Minimum preheating temperature
Maximum preheating temperature
Preheat time
Average ascent rate
Liquidus temperature
Time above liquidus
Peak temperature
Average rate of descent
Time from 25℃ to peak temperature
ESP32-WROOM-32UE User Manual
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
60-120 sec
3℃/second max
3℃/second max
183℃
60-90 sec
30-90 sec
220-235℃
230-250℃
6℃/second max
6℃/second max
6 minutes max
8
minutes max
150℃
200℃
217℃
11
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