Chatper 5 Welding Operation Guidance; Reflow Soldering Temperature - Ebyte ESP32-S3-MINI-1 User Manual

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Chatper 5 Welding Operation Guidance

Reflow soldering temperature

5.1
Reflow soldering curve characteristics
Minimum temperature（Tsmin）
Preheat/keep
Maximum temperature（Tsmax）
warm
Time（Tsmin~Tsmin）
Heating slope（TL~Tp）
Liquidous Temperature（TL）
Holding time above TL
Package peak temperature Tp
The time (Tp) within 5℃ of the specified
classification temperature (Tc), see the figure
below
Cooling slope（Tp~TL）
Time from room temperature to peak
temperature
※ The peak temperature (Tp) tolerance definition of the temperature profile is an upper limit for the user
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Lead-based process assembly
100℃
150℃
60-120 seconds
3℃/seconds，maximum
183℃
60~90 seconds
It should not exceed the temperature
indicated on the product's "Moisture
Sensitivity" label.
20 seconds
6℃/seconds，maximum
6 minutes，maximum
ESP32-S3-MINI series user manual
Lead-free process assembly
150℃
200℃
60-120 seconds
3℃/seconds，maximum
217℃
60~90 seconds
It should not exceed the temperature
indicated on the product's "Moisture
Sensitivity" label.
30 seconds
6℃/seconds，maximum
8 minutes，maximum
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