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Chengdu Ebyte Electronic Technology Co.,Ltd.
12 Welding Operation Instructions
12.1 Reflow soldering temperature
Reflow Soldering Profile Characteristics
Minimum
( Tsmin )
Preheat
/
Maximum
keep warm
( Tsmax )
Time ( Tsmin~Tsmin )
Heating slope ( TL~Tp )
Liquidus temperature ( TL )
Hold time above TL
Package peak temperature Tp
The time ( Tp ) within 5 ° C of the
specified classification temperature ( Tc ) ,
see the figure below
Cooling slope ( Tp~TL )
Time from room temperature to peak
temperature
※ The peak temperature ( Tp ) tolerance definition of the temperature curve is the upper limit of the user
12.2 Reflow Soldering Curve
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
leaded process assembly
temperature
100 °C
temperature
150 °C
60-120 seconds
3 °C / sec, max
183 °C
60~90 seconds
Users should
temperature
product's "Moisture Sensitivity"
label.
20 seconds
6 °C / sec, max
6 minutes, maximum
Lead-free process assembly
150 °C
200 °C
60-120 seconds
3 °C / sec, max
217 °C
60~90 seconds
not exceed
the
Users
indicated
on
the
temperature
product's
label.
30 seconds
6 °C / sec, max
8 minutes, maximum
E22-xxxTxxE User Manual
should
not
exceed
the
indicated
on
the
"Moisture
Sensitivity"
27
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