Chapter 12 Welding Operation Instructions; Reflow Temperature; Reflow Soldering Profile - Ebyte E22-400T30S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

Chapter 12 Welding Operation Instructions

12.1 Reflow Temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

12.2 Reflow Soldering Profile

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Curve Feature
Solder paste
Min. preheat temperature
Max. preheating temperature
Preheat time
Average rate of ascent
Liquidus temperature
Time above liquidus
Peak temperature
Average rate of decline
Time from 25°C to peak temperature
E22-400T30S_User Manual _EN
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max