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[CD]
eevTe
Chengdu
3. Size and pin definition
16.0+0.1mm
3.23£0.1mm
|
2.00
12
n
I
n
12
1.27
13
10
| |
10
13
14
9
1
9
14
15
8
1
8
15
16
7
1
7
16
I=
17
6
1
6
17
£E
=
p=
18
5
|
5
18
pd
19
4
I
4
19
12
20
3
|
3
20
H
127
21
IPX
2
| | |
2
2
22
1
1
22
TT
[140
0.50
0.90
Top pad: 0501=)] [0.80
Bottom pad: 0.501_)
| ] 0.80
Weight: 2.0g
Pad quantity ; 22
Unit:
mm
No.
Name
Direction
Function
1
GND
Module ground wire
2
GND
Module ground wire
3
GND
Module ground wire
4
GND
Module ground wire
5
MO
Input (pull up when |
Cooperate with M1 to determine 4 operating modes of the module(can be lifted
it's weak)
floating, the module contains pull-up resistor)
.
ML
Input (pull up when |
Cooperate with MO to determine 4 operating modes of the module(can be lifted
it's weak)
floating, the module contains pull-up resistor)
7
RXD
Input
TTL serial input, connect to external TX) output pin,
8
TXD
Output
TTL serial input, connect to external RXD output pin,
Used to indicate the working status of the module; the user wakes up the external
9
AUX
Output
)
oo
MCU and outputs a low level during the power-on self-test initialization
Module
power supply
positive reference, voltage range: 2.6V ~ 5.5V DC
10
vee
p
ppLy p
2
g
11
GND
Module ground wire
12
NC
13
GND
Module ground wire
14
NC
15
NC
16
NC
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Chengdu Ebyte Electronic Technology Co.,Ltd.
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