Specifications; Common Specifications - Nagano Keiki ZT11 User Manual

Pressure sensor for semiconductor industry
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3. SPECIFICATIONS

■ 3.1 Common Specifications
Measuring fluid
Fitting type
Thread
Dead volume
Pressure sensor sealing
Pressure range
Supply voltage
Load resistance
Output
Transmission system
Accuracy
Temperature Coefficient
(Zero/ Span)
Operating temp. range
Storage temp. range
Insulation resistance
CE marking
UKCA marking
Electrical connection
Case material
Protection class
Zeroing mechanism
Mass
Various semiconductor process gases
Single end and flow through integrated (forged)
1/4VCR
and 1/2 (3/8) VCR
®
Approx. 0.9 cm
3
(will vary for single end and 1/4UJR
by welding
0 to 0.3, 0.5, 1, 2, 3.5, 5, 10 and 20 MPa
Gauge
pressure
- 0.1 to 0.3, 0.5, 1, 2, 3.5, 5, 10 and 20 MPa
Absolute
0 to 0.3, 0.5, 1, 2, 3.5, 5, 10, 20 MPa abs.
pressure
10 to 30V DC
*See the following equation for the relationship bet. the supply voltage
and load resistance.
R max. (Ω) = 50E − 500 (E: supply voltage)
4 to 20 mA DC
2-wire system
+/- 0.25%F.S. (at 23 deg. C)
(including linearity, hysteresis and repeatability)
+/- 0.02%F.S./ deg. C
- 20 to 70 deg. C (no freezing or condensation)
- 30 to 80 deg. C (no freezing or condensation)
100 MΩ or more (50V DC collectively for fitting to input-output terminal)
EMC Directive
*1
, RoHS Directive
EMC SI 2016 No.1091
M12 connector (4 pins)
SUS305, PBT
IP67 (IEC 60529) *M12-connector cable in a mated state
Side access (at case side surface)
Approx. 70 g (will vary for single end depending on the fitting type)
< Table 3-1 >
8
compatible, 1/4UJR
®
depending on the fitting type)
*1
, RoHS SI 2012 No.3032
TY-ZT11-004A Ver. 3

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