Quectel FCM561D-P Hardware Design page 7

5.3.1. Pin Antenna Interface (ANT_WIFI/BT) ............................................................................ 40
5.3.1.1. Reference Design .................................................................................................... 40
5.3.1.2. Antenna Design Requirements ............................................................................... 40
5.3.1.3. RF Routing Guidelines ............................................................................................ 41
5.3.2. FCM561D-P PCB Antenna .............................................................................................. 43
6 Electrical Characteristics & Reliability ............................................................................................... 45
6.1. Absolute Maximum Ratings ......................................................................................................... 45
6.2. Power Supply Ratings .................................................................................................................. 45
6.3. Power Consumption ..................................................................................................................... 46
6.3.1. Wi-Fi Power Consumption ................................................................................................. 46
6.3.2. Bluetooth Power Consumption .......................................................................................... 46
6.4. Digital I/O Characteristics ............................................................................................................ 47
6.5. ESD Protection ............................................................................................................................ 47
7 Mechanical Information ....................................................................................................................... 48
7.1. Mechanical Dimensions ............................................................................................................... 48
7.2. Recommended Footprint ............................................................................................................. 50
7.3. Top and Bottom Views ................................................................................................................. 51
8 Storage, Manufacturing & Packaging ................................................................................................. 52
8.1. Storage Conditions ...................................................................................................................... 52
8.2. Manufacturing and Soldering ....................................................................................................... 53
8.3. Packaging Specifications ............................................................................................................. 55
8.3.1. Carrier Tape ....................................................................................................................... 55
8.3.2. Plastic Reel ........................................................................................................................ 56
8.3.3. Mounting Direction ............................................................................................................. 56
8.3.4. Packaging Process ............................................................................................................ 57
9 Appendix References ........................................................................................................................... 58
FCM561D-P_Hardware_Design
61
Wi-Fi&Bluetooth Module Series
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