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Quectel FC64E Hardware Design

Wi-fi&bluetooth module
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FC64E
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.1
Date: 2021-09-08
Status: Preliminary

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Summary of Contents for Quectel FC64E

  • Page 1 FC64E Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2021-09-08 Status: Preliminary...
  • Page 2 Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of information, advertising, commercial offers, products, services, and materials on third-party websites and third-party resources. Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved. FC64E_Hardware_Design 2 / 53...

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
  • Page 5 Wi-Fi&Bluetooth Module Series metal powders. FC64E_Hardware_Design 4 / 53...

  • Page 6: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description 2021-01-19 Soni RAO/Lucas HUANG Creation of the document 1.0.0 2021-01-19 Soni RAO/Lucas HUANG Preliminary Preliminary: 1.0.1 2021-09-08 Soni RAO/Lucas HUANG Updated power consumption data. Updated RF indicators. FC64E_Hardware_Design 5 / 53...

  • Page 7: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ............................5 Contents ................................ 6 Table Index ..............................8 Figure Index ..............................9 Introduction ............................10 1.1. Special Mark ..........................14 Product Overview ..........................15 2.1. General Description ........................15 2.2. Key Features ..........................15 2.3.
  • Page 8 Wi-Fi&Bluetooth Module Series 4.5.1. Power Consumption in Low Power Modes ..............40 4.5.2. Power Consumption .......................40 4.6. RF Performances ........................42 4.6.1. Conducted RF Output Power ..................42 4.6.2. Conducted RF Receiving Sensitivity ................44 4.7. Bluetooth RF Performances ...................... 45 4.7.1. Conducted RF Output Power ..................45 4.7.2.
  • Page 9 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ..........................14 Table 2: Key Features ..........................15 Table 3: I/O Parameters Definition ......................21 Table 4: Pin Description ..........................21 Table 5: Definition of Power Supply and GND Pins ..................24 Table 6: Pin Definition of WLAN_EN ......................26 Table 7: Pin Definition of PCIe Interface .....................
  • Page 10 Figure 20 : Module Bottom Dimension (Bottom View) ................48 Figure 21 : Recommended Footprint (Top View) ..................49 Figure 22 : Top & Bottom View of FC64E ....................50 Figure 23 : Recommended Reflow Soldering Thermal Profile ..............52 Figure 24 : Carrier Tape Dimension Drawing ....................54 Figure 25 : Plastic Reel Dimension Drawing ....................54...

  • Page 11: Introduction

    Wi-Fi&Bluetooth Module Series Introduction This document defines the FC64E module and describes its air interfaces and hardware interfaces which are connected with your application. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
  • Page 12 Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.
  • Page 13 Wi-Fi&Bluetooth Module Series Radiation Exposure Statement: This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un environnement non contrôlé.
  • Page 14 Wi-Fi&Bluetooth Module Series maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains IC: 10224A-2022FC64E”. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs.

  • Page 15: Special Mark

    Wi-Fi&Bluetooth Module Series band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; iii. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated.

  • Page 16: Product Overview

    Bluetooth low energy technologies. With a low-power PCIe Gen 3 interface for WLAN, a UART and PCM* interface for Bluetooth, FC64E can provide WLAN and Bluetooth functions. 2.2. Key Features The following table describes the key features of the module.
  • Page 17 Wi-Fi&Bluetooth Module Series Compliant with IEEE 802.11a/b/g/n/ac/ax  Dual band 2.4/5 GHz chains: 20/40 MHz channel bandwidth for 2.4 GHz  and 20/40/80 MHz channel bandwidth for 5 GHz Supports 2 × 2 Multi-User Multiple-Input Multiple-Output (MU-MIMO), Dual  Band Simultaneous (DBS) with dual MAC, up to 1783 Mbps data rate (2 × 2 + 2 ×...

  • Page 18: Functional Diagram

    Wi-Fi&Bluetooth Module Series ANT_WIFI0, ANT_WIFI1, ANT_BT  RF Antenna Interfaces 50 Ω impedance  Size: (18 ±0.15) mm × (19.9 ±0.15) mm × (2.1 ±0.2) mm  Physical Package: LCC  Characteristics Weight: TBD  Operating temperature range: -30 °C to +75 °C ...

  • Page 19: Evb

    Bluetooth dedicated antenna is optional according to the module order code. 2.4. EVB To help customers develop applications with FC64E module conveniently, Quectel supplies the evaluation board (FC6xE-M.2), Antenna cable, antenna and others to control or test the module. For more details, see document [1] and document [2].

  • Page 20: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 3.1. General Description The module is equipped with 52 LCC pins and 28 LGA pins. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module: Power supply  WLAN application interfaces ...

  • Page 21: Pin Assignment

    Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE VDD_3V3 is optional according to module OC. Please keep all RESERVED pins open. FC64E_Hardware_Design 20 / 53...

  • Page 22: Pin Description

    Wi-Fi&Bluetooth Module Series 3.3. Pin Description The following tables show the pin description of FC64E module. Table 3: I/O Parameters Definition Type Description Analog Input Analog Input Analog Input/Output Digital Input Digital Output Power Input Table 4: Pin Description Power Supply Pin Name Pin No.
  • Page 23 Wi-Fi&Bluetooth Module Series Provide 3.3 V for Vmin = 3.0 V the module’s If unused, keep this VDD_3V3 Vnom = 3.3 V discrete pin open. Vmax = 3.6 V Bluetooth part 3, 6, 15, 25, 27, 29–31, 33–35, 37–39, 46, 49, 50, 53, 54, 57, 58, 60–64, 67–80 WLAN Application Interface Pin Name Pin No.
  • Page 24 Wi-Fi&Bluetooth Module Series PCM_CLK* PCM clock PCM_DOUT* PCM data output max = 0.45 V Bluetooth UART min = 1.35 V BT_RTS request to send min = -0.3 V Bluetooth UART max = 0.63 V BT_CTS clear to send min = 1.17 V max = 2.1 V Bluetooth UART max = 0.45 V...

  • Page 25: Power Supply

    Wi-Fi&Bluetooth Module Series RESERVED Interfaces Pin Name Pin No. Comment RESERVED 9, 55, 56, 59, 65, 66 Keep them open. 3.4. Power Supply The following table shows the power supply pins and ground pins of the module. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No.

  • Page 26: Wlan Application Interface

    The following figure shows the WLAN application interface connection between the module and the host. If you need WLAN wakeup function, connect the pin 9 of module with the host corresponding pin first and contact Quectel Technical Support if necessary. Figure 5: WLAN Application Interface Connection 3.5.1.

  • Page 27: Pcie Interface

    Wi-Fi&Bluetooth Module Series Table 6: Pin Definition of WLAN_EN Pin Name Pin No. Description Comment 1.8 V power domain. WLAN function enable WLAN_EN Active high. control Do not float this pin. 3.5.2. PCIe Interface The module provides a PCIe interface with key features listed as below: PCI Express Specification Revision 3.0 compliance.

  • Page 28: Bluetooth Application Interface

    Wi-Fi&Bluetooth Module Series Figure 6: PCIe Interface Connection To ensure the signal integrity of PCIe interface, C1 and C2 should be placed close to the module, and C3 and C4 should be placed close to the host. The extra stubs of traces must be avoided. The following principles of PCIe interface design should be complied with, so as to meet PCIe Gen3 specifications.

  • Page 29: Bt_En

    Wi-Fi&Bluetooth Module Series Figure 7: Block Diagram of Bluetooth Application Interface Connection NOTE The GPIO1 connected to BT_WAKEUP_HOST must be interruptible. 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of the module. Bluetooth function will be enabled when BT_EN is at high level.

  • Page 30: Bt_Wakeup_Host* And Host_Wakeup_Bt

    Wi-Fi&Bluetooth Module Series Bluetooth UART request to BT_RTS send BT_CTS Bluetooth UART clear to send 1.8 V power domain. BT_TXD Bluetooth UART transmit BT_RXD Bluetooth UART receive The module provides 1.8 V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3 V UART interface.

  • Page 31: Other Interfaces

    Wi-Fi&Bluetooth Module Series Table 11: Pin Definition of PCM Interface Pin Name Pin No. Description Comment PCM_DIN PCM data input PCM_SYNC PCM data frame sync 1.8 V power domain. PCM_CLK PCM clock PCM_DOUT PCM data output The following figure shows the PCM interface connection between the module and the host. Figure 9: PCM Interface Connection 3.7.

  • Page 32: Sw_Ctrl

    Wi-Fi&Bluetooth Module Series Figure 10: Requirements of WLAN_SLP_CLK Table 12: Parameter of WLAN_SLP_CLK Parameter Comments Unit t(xoh) Sleep-clock logic high 4.58 4.58 25.94 μs t(xol) Sleep-clock logic low 4.58 4.58 25.94 μs Sleep-clock period 30.5208 μs Sleep-clock frequency 32.7645 (F = 1/T) Peak-to-peak voltage 3.7.2.

  • Page 33: Operating Frequency

    Bluetooth 2.402–2.480 3.8.2. Reference Design FC64E provides three RF antenna interfaces for antenna connection. The following reference circuit design shows an example with ANT_WIFI0. For other RF antenna interfaces, the reference design is the same. It is recommended to reserve a Π-type matching circuit for better RF performance, and the Π-type matching components (C1, C2, R1) should be placed as close to the antenna as possible.

  • Page 34: Reference Design Of Rf Routing

    Wi-Fi&Bluetooth Module Series Figure 11: Reference Circuit for RF Antenna Interfaces 3.8.3. Reference Design of RF Routing For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
  • Page 35 Wi-Fi&Bluetooth Module Series Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to ...

  • Page 36: Requirements For Antenna Design

    Wi-Fi&Bluetooth Module Series For more details about RF layout, see document [3]. 3.8.4. Requirements for Antenna Design The following table shows the requirements for antennas. Table 16: Antenna Requirements Type Requirements 2.400–2.4835 GHz Frequency Range 5.180–5.825 GHz VSWR < 2:1 (Recommended) Gain 1 dBi (Typ.) Max.
  • Page 37 Wi-Fi&Bluetooth Module Series Figure 16: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 17: Mechanicals of U.FL-LP Connectors (Unit: mm) The following figure describes the space factor of mated connector. FC64E_Hardware_Design 36 / 53...
  • Page 38 Wi-Fi&Bluetooth Module Series Figure 18: Space Factor of Mated Connector (Unit: mm) For more details, visit http://www.hirose.com. FC64E_Hardware_Design 37 / 53...

  • Page 39: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 4.1. General Description This chapter mainly introduces electrical and radio characteristics of FC64E module. The details are listed in the subsequent chapters. 4.2. Electrical Characteristics The following table shows the absolute maximum ratings.

  • Page 40: I/O Interface Characteristics

    Wi-Fi&Bluetooth Module Series Table 18: Recommended Operating Conditions Parameter Min. Typ. Max. Unit VDD_CORE_VL 0.95 VDD_CORE_VM 1.35 1.42 VDD_CORE_VH 1.85 1.95 2.05 VDD_IO 1.71 1.89 VDD_RF VDD_3V3 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified).

  • Page 41: Operating And Storage Temperatures

    Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures Table 20: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range ºC Storage Temperature Range ºC 4.5. Power Consumption The following tables show the power consumption of the module in different modes. 4.5.1.
  • Page 42 Wi-Fi&Bluetooth Module Series 2G 802.11g 299.17 136.37 93.61 2.92 352.65 6Mbps 2G 802.11n HT20 300.62 136.09 93.35 345.94 (MCS0) 2G 802.11ax HE40 322.96 143.7 92.72 2.83 304.95 (MCS11) 5G 802.11a 316.01 162.62 107.6 2.64 312.3 6Mbps 5G 802.11n HT20 309.07 163.07 104.23 2.83...

  • Page 43: Rf Performances

    324.69 228.4 2.92 1111 HE40 + 5G HE80 4.6. RF Performances The following tables summarize the transmitting and receiving performances of FC64E. 4.6.1. Conducted RF Output Power Table 23: Conducted RF Output Power at 2.4 GHz Description Min. Typ. Unit 802.11b @ 1 Mbps...
  • Page 44 Wi-Fi&Bluetooth Module Series 802.11ax, HE20 @ MCS0 802.11ax, HE20 @ MCS11 802.11ax, HE40 @ MCS0 802.11ax, HE40 @ MCS11 Table 24: Conducted RF Output Power at 5 GHz Description Min. Typ. Unit 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS0 802.11n, HT20 @ MCS7 802.11n, HT40 @ MCS0...

  • Page 45: Conducted Rf Receiving Sensitivity

    Wi-Fi&Bluetooth Module Series 4.6.2. Conducted RF Receiving Sensitivity Table 25: Conducted RF Receiving Sensitivity at 2.4 GHz Description Receiving Sensitivity (Typ.) 802.11b @ 1 Mbps -96 dBm 802.11b @ 11 Mbps -87.5 dBm 802.11g @ 6 Mbps -91.5 dBm 802.11g @ 54 Mbps -72.5 dBm 802.11n, HT20 @ MCS0 -92 dBm...

  • Page 46: Bluetooth Rf Performances

    802.11ax, HE80 @ MCS0 -84 dBm 802.11ax, HE80 @ MCS11 -55 dBm 4.7. Bluetooth RF Performances The following tables summarize the transmitting and receiving performances of FC64E. 4.7.1. Conducted RF Output Power Table 27: Conducted RF Output Power Description Min.

  • Page 47: Conducted Rf Receiving Sensitivity

    Wi-Fi&Bluetooth Module Series 4.7.2. Conducted RF Receiving Sensitivity Table 28: Conducted RF Receiving Sensitivity at 2.4 GHz Description Receiving Sensitivity (Typ.) GFSK Π/4-DQPSK 8-DQPSK BLE_1M BLE_2M 4.8. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent.

  • Page 48: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Pin1 Figure 19: Module Top and Side Dimensions (Top and Side View) FC64E_Hardware_Design 47 / 53...
  • Page 49 Wi-Fi&Bluetooth Module Series Pin1 Figure 20: Module Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC64E_Hardware_Design 48 / 53...

  • Page 50: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Pin1 Figure 21: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. To keep the reliability of the mounting and soldering, keep the motherboard thickness as at least 1.2 mm.

  • Page 51: Top And Bottom Views

    Figure 22: Top & Bottom View of FC64E NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FC64E_Hardware_Design 50 / 53...

  • Page 52: Storage, Manufacturing And Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 53: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.

  • Page 54: Packaging Specifications

    4. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 5. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 55: Carrier Tape

    Wi-Fi&Bluetooth Module Series The module adopts carrier tape packaging and details are as follow: 6.3.1. Carrier Tape Dimension details are as follow: Figure 24: Carrier Tape Dimension Drawing Table 31: Carrier Tape Dimension Table (Unit: mm) 18.5 20.5 20.2 1.75 6.3.2.

  • Page 56: Packaging Process

    Wi-Fi&Bluetooth Module Series Table 32: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 6.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.

  • Page 57: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 33: Related Documents Document Name Quectel_Wi-Fi-M.2_EVB_User_Guide Quectel_FC6xE_M.2_User_Guides Quectel_RF_Layout_Application_Note Quectel_Module_Secondary_SMT_Application_Note Table 34: Terms and Abbreviations Abbreviation Description Adaptive Frequency Hopping Access Point BPSK Binary Phase Shift Keying Bluetooth Bluetooth Complementary Code Keying Clear To Send Dual Band Simultaneous Electrostatic Discharge Evaluation Board...
  • Page 58 Wi-Fi&Bluetooth Module Series High Throughput IEEE Institute of Electrical and Electronics Engineers Input Leakage Current Input/Output Leadless chip carrier Land Grid Array Long Term Evolution Medium Access Control Mbps Megabits per second Modulation and Coding Scheme MU-MIMO Multi-User Multiple-Input Multiple-Output Power Amplifier Printed Circuit Board Pulse Code Modulation...
  • Page 59 Wi-Fi&Bluetooth Module Series Maximum High-level Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Maximum Low-level Output Voltage Minimum Output High-level Output Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless-Fidelity WLAN Wireless Local Area Network FC64E_Hardware_Design 58 / 53...

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