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Quectel FC66E Series Hardware Design

Quectel FC66E Series Hardware Design

Wi-fi&bluetooth module
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FC66E Series
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.1
Date: 2023-02-09
Status: Preliminary

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  • Page 1 FC66E Series Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.1 Date: 2023-02-09 Status: Preliminary...
  • Page 2 Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description Soni RAO/ 2020-12-30 Creation of the document Michael DU Soni RAO/ 1.0.0 2022-12-30 Preliminary Michael DU Preliminary: Deleted the relevant information of FC65E. Added the relevant information of FC66E-B. Updated the power supply voltages (Table 1&3&4).

  • Page 6: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 Product Overview ..........................15 2.1. General Description ......................... 15 2.2. Key Features ..........................15 2.3.
  • Page 7 Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures ..................41 4.5. Power Consumption ......................... 42 4.5.1. Power Consumption in Low Power Modes ..............42 4.5.2. Power Consumption in Non-signaling Mode ..............43 4.6. RF Performances ........................45 4.6.1. Wi-Fi RF Performances ....................45 4.6.2.
  • Page 8 Wi-Fi&Bluetooth Module Series Table Index Table 1: Key Features ..........................15 Table 2: I/O Parameters Definition ......................21 Table 3: Pin Description ..........................21 Table 4: Definition of Power Supply and GND Pins................... 25 Table 5: Pin Definition of WLAN_EN ......................26 Table 6: Pin Definition of PCIe Interface ....................
  • Page 9 Wi-Fi&Bluetooth Module Series Figure Index Figure 2: Pin Assignment (Top View) ......................20 Figure 3: Power-up and Power-down Timing .................... 25 Figure 4: Wi-Fi Application Interface Connection ..................26 Figure 5: PCIe Interface Connection ......................27 Figure 6: Bluetooth Application Interface Connection ................28 Figure 7: Reference Circuit with a Voltage-level Translator ..............

  • Page 10: Introduction

    Wi-Fi&Bluetooth Module Series Introduction This document defines the FC66E series modules and describes their air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
  • Page 11 5.84dBi (Ant0); 5.89dBi (Ant1); • The product is provided with an approved antenna. Use only supplied or approved antenna by Quectel. Any changes or modifications to the Antenna may void the regulatory approvals obtained for the product. • Host device must comply with FCC Part 15 antenna requirements •...
  • Page 12 Wi-Fi&Bluetooth Module Series As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product.
  • Page 13 Wi-Fi&Bluetooth Module Series interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
  • Page 14 Wi-Fi&Bluetooth Module Series d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada.
  • Page 15 Wi-Fi&Bluetooth Module Series d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par la technologie. Avertissement: Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal; lorsqu’il y a lieu, les types d’antennes (s’il y en a plusieurs), les numéros de modèle de l’antenne et les pires angles d’inclinaison nécessaires pour rester conforme à...

  • Page 16: Product Overview

    Product Overview 2.1. General Description FC66E series are Wi-Fi and Bluetooth modules with low power consumption. They are single-die Wi-Fi and Bluetooth combo solutions supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz, 5 GHz and 6 GHz Wi-Fi standards and Bluetooth 5.2 standard, which enables seamless integration of Wi-Fi and Bluetooth low energy technologies.
  • Page 17 Wi-Fi&Bluetooth Module Series ⚫ Adaptive frequency hopping (AFH) for reducing radio frequency interference ⚫ Compliant with Bluetooth Core Specification Version 5.2 with provisions Bluetooth Features for supporting future specifications ⚫ Supports Bluetooth Class 1 or Class 2 transmitting power ⚫ Supports 2 Mbps Bluetooth Low Energy (BLE), BLE Long Range ⚫...
  • Page 18 Wi-Fi&Bluetooth Module Series ⚫ BR (GFSK): 7 dBm (Typ.) ⚫ EDR (π/4-DQPSK): 4 dBm (Typ.) Bluetooth Transmitting ⚫ EDR (8-DPSK): 4 dBm (Typ.) Power ⚫ BLE (1 Mbps): 7 dBm (Typ.) ⚫ BLE (2 Mbps): 7 dBm (Typ.) ⚫ Bluetooth Operation Classic Bluetooth (BR + EDR) ⚫...

  • Page 19: Evb Kit

    Wi-Fi&Bluetooth Module Series 2.3. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (FC6xE M.2) to control or test the module. For more details, see document [1]. FC66E_Series_Hardware_Design 18 / 63...

  • Page 20: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 3.1. General Description The module is equipped with 52 LCC pins and 28 LGA pins. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module: ⚫ Power supply ⚫...

  • Page 21: Pin Assignment

    Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment VDD_3V3 VDD_RF VDD_RF BT_WAKE_HOST SW_CTRL PCM_SYNC COEX_RXD/ HOST_WAKE_BT COEX_TXD BT_TXD PCM_DOUT PCM_DIN BT_RXD PCM_CLK BT_CTS LAA_TXEN BT_RTS WLAN_TXEN LAA_RX VDD_CORE_VH BT_EN VDD_CORE_VM WLAN_SLP_CLK PA_MUTE VDD_IO VDD_CORE_VL WLAN_EN VDD_CORE_VL PCIE_WAKE_N Power Wi-Fi Bluetooth COEX Others RESERVED Figure 1: Pin Assignment (Top View) NOTE...

  • Page 22: Pin Description

    Wi-Fi&Bluetooth Module Series 3.3. Pin Description Table 2: I/O Parameters Definition Type Description Analog Input Analog Input Analog Input/Output Digital Input Digital Output Power Input Table 3: Pin Description Power Supply Pin Name Pin No. Description Comment Characteristics Provides 1.0 V for Vmin = 0.9 V It must be provided the module’s main...
  • Page 23 Wi-Fi&Bluetooth Module Series Provides 3.3 V for the module’s Unused pin. VDD_3V3 discrete Keep it open. Bluetooth part. 3, 6, 15, 25, 27, 29–31, 33–35, 37–39, 46, 49, 50, 53, 54, 57, 58, 60–64, 67–80 Wi-Fi Application Interfaces Pin Name Pin No.
  • Page 24 Wi-Fi&Bluetooth Module Series Do not pull down when Bluetooth PCM_DOUT PCM data output function is being enabled. DCE request to BT_RTS send signal to DTE DCE clear to send BT_CTS signal from DTE Bluetooth UART BT_RXD receive If unused, keep them open.
  • Page 25 Wi-Fi&Bluetooth Module Series LTE & Wi-Fi/ COEX_RXD/ Bluetooth HOST_WAKE_BT coexistence receive LTE & Wi-Fi/ Bluetooth COEX_TXD coexistence transmit When it goes high, module places the LAA_TXEN 5 GHz receiver in a protected state. Module asserts it If unused, keep them VDD_IO to high state when open.

  • Page 26: Power Supply

    Wi-Fi&Bluetooth Module Series 3.4. Power Supply The following table shows the power supply and ground pins of the module. Table 4: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit Provides 1.0 V for the VDD_CORE_VL 51, 52 1.05...

  • Page 27: Wi-Fi Application Interfaces

    Wi-Fi&Bluetooth Module Series 3.5. Wi-Fi Application Interfaces The following figure shows the Wi-Fi application interface connection between the module and the host. PCIe PCIe Module Host WLAN_EN WLAN_EN Figure 3: Wi-Fi Application Interface Connection 3.5.1. WLAN_EN WLAN_EN is used to control the Wi-Fi function of the module. Wi-Fi function will be enabled when WLAN_EN is at high level.
  • Page 28 Wi-Fi&Bluetooth Module Series PCIE_TX_M PCIe transmit (-) PCIE_TX_P PCIe transmit (+) PCIE_RX_M PCIe receive (-) PCIE_RX_P PCIe receive (+) PCIE_CLKREQ_N PCIe clock request PCIE_RST_N PCIe reset Active low. PCIE_WAKE_N PCIe wake up The following figure shows the PCIe interface connection between the module and the host. PCIE_CLKREQ_N PCIE_CLKREQ PCIE_WAKE_N...

  • Page 29: Bluetooth Application Interfaces

    Wi-Fi&Bluetooth Module Series ⚫ Space between PCIe signals and all other signals should be four times the trace width. ⚫ Do not route signal traces under crystals, oscillators, magnetic devices, or RF signal traces. It is important to route the PCIe differential traces in inner-layer of the PCB and surround the traces with ground on that layer and with ground planes above and below.

  • Page 30: Uart Interface

    Wi-Fi&Bluetooth Module Series 3.6.2. UART Interface The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The module supports an HCI UART as defined in Bluetooth Core Specification Version 4.0. The UART supports hardware flow control, and it is used for data transmission with host.

  • Page 31: Bt_Wake_Host And Host_Wake_Bt

    Wi-Fi&Bluetooth Module Series 3.6.3. BT_WAKE_HOST and HOST_WAKE_BT Table 9: Pin Definition of BT_WAKE_HOST and HOST_WAKE_BT Pin Name Pin No. Description Comment BT_WAKE_HOST Bluetooth wakes up host If unused, keep them open. COEX_RXD/ Host wakes up Bluetooth HOST_WAKE_BT 3.6.4. PCM Interface The PCM interface is used for Bluetooth audio.

  • Page 32: Coexistence Interfaces

    Wi-Fi&Bluetooth Module Series 3.7. Coexistence Interfaces The module supports 2.4 GHz LTE & Wi-Fi/Bluetooth coexistence and 5 GHz and 6 GHz WWAN & Wi-Fi coexistence. The following table shows the pin definition of coexistence interfaces. Table 11: Pin Definition of Coexistence Interfaces Pin Name Pin No.

  • Page 33: Other Interfaces

    Wi-Fi&Bluetooth Module Series 3.8. Other Interfaces 3.8.1. WLAN_SLP_CLK The WLAN_SLP_CLK is 32.768 kHz sleep clock which is used in low power modes, such as IEEE power saving mode and sleep mode. It serves as a timer in various power saving schemes, and can maintain basic logic operations when the module is in sleep mode.

  • Page 34: Sw_Ctrl

    Wi-Fi&Bluetooth Module Series 3.8.2. SW_CTRL SW_CTRL can be used to control external VDD_RF power supply chip. The following table shows the pin definition of SW_CTRL. Table 14: Pin Definition of SW_CTRL Pin Name Pin No. Description Comment Active high. SW_CTRL VDD_RF switch control If unused, keep it open.

  • Page 35: Rf Antenna Reference Design

    Wi-Fi&Bluetooth Module Series 3.9.2. RF Antenna Reference Design The module provides three RF antenna interfaces for antenna connection. The following reference design shows an example with ANT_WIFI0. For other RF antenna interfaces, the reference design is the same. It is recommended to reserve a π-type matching circuit for better RF performance, and the π-type matching components (C1, C2, R1) should be placed as close to the antenna as possible.
  • Page 36 Wi-Fi&Bluetooth Module Series Figure 11: Coplanar Waveguide Design on a 2-layer PCB Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...

  • Page 37: Antenna Design Requirements

    Wi-Fi&Bluetooth Module Series connected to ground. ⚫ The distance between the RF pins and the RF connector should be as short as possible, and all the right-angle traces should be changed to curved ones. The recommended trace angle is 135°. ⚫...
  • Page 38 Wi-Fi&Bluetooth Module Series Figure 14: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 15: Specifications of Mated Plugs FC66E_Series_Hardware_Design 37 / 63...
  • Page 39 Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connectors. Figure 16: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FC66E_Series_Hardware_Design 38 / 63...

  • Page 40: Reliability, Radio And Electrical Characteristics

    Wi-Fi&Bluetooth Module Series Reliability, Radio and Electrical Characteristics 4.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital pins of the module are listed in the following table. Table 18: Absolute Maximum Ratings (Unit: V) Parameter Min.

  • Page 41: Power Supply Ratings

    Wi-Fi&Bluetooth Module Series 4.2. Power Supply Ratings Table 19: Module Power Supply Ratings (Unit: V) Parameter Min. Typ. Max. VDD_CORE_VL 1.05 VDD_CORE_VM VDD_CORE_VH 1.85 VDD_IO 1.71 1.89 VDD_RF 4.3. Digital I/O Characteristics Table 20: VDD_IO I/O Requirements (Unit: V) Parameter Description Min.

  • Page 42: Operating And Storage Temperatures

    Wi-Fi&Bluetooth Module Series 4.4. Operating and Storage Temperatures Table 21: Operating and Storage Temperatures (Unit: ºC ) Parameter Min. Typ. Max. Operating Temperature Range Storage Temperature Range Within the operating temperature range, the module’s related performance meets IEEE and Bluetooth specifications. FC66E_Series_Hardware_Design 41 / 63...

  • Page 43: Power Consumption

    Wi-Fi&Bluetooth Module Series 4.5. Power Consumption The following tables show the power consumption of the module in different modes. 4.5.1. Power Consumption in Low Power Modes Table 22: Power Consumption of the Module (Low Power Modes, Unit: mA) Module State Wi-Fi State VDD_CORE_VL VDD_CORE_VM...

  • Page 44: Power Consumption In Non-Signaling Mode

    Wi-Fi&Bluetooth Module Series 4.5.2. Power Consumption in Non-signaling Mode Table 23: Tx Power Consumption (Unit: mA) Mode Condition VDD_CORE_VL VDD_CORE_VM VDD_CORE_VH VDD_IO VDD_RF 2.4 GHz 802.11b @ 1 Mbps 300.42 136.38 93.6 2.93 366.89 2.4 GHz 802.11g @ 6 Mbps 299.17 136.37 93.61...
  • Page 45 Wi-Fi&Bluetooth Module Series 5 GHz 802.11ax HE80 @ MCS 11 583.84 268.09 151.57 2.95 540.68 5 GHz 802.11ax HE80 @ MCS 0 563.83 273.32 153.62 2.91 630.2 802.11n HT20 @ MCS 0 417.56 303.69 222.21 2.92 1336 802.11n HT40 @ MCS 7 526.4 316.91 218.83...

  • Page 46: Rf Performances

    Wi-Fi&Bluetooth Module Series 4.6. RF Performances The following tables summarize the transmitting and receiving performances of the module. 4.6.1. Wi-Fi RF Performances Table 24: Wi-Fi Tx Power at 2.4 GHz Condition Typ. (dBm) Tolerance (dB) 802.11b @ 1 Mbps ±2 802.11b @ 11 Mbps ±2 802.11g @ 6 Mbps...
  • Page 47 Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS 7 ±2 802.11n, HT40 @ MCS 0 14.5 ±2 802.11n, HT40 @ MCS 7 11.5 ±2 802.11ac, VHT20 @ MCS 0 ±2 802.11ac, VHT20 @ MCS 8 11.5 ±2 802.11ac, VHT40 @ MCS 0 14.5 ±2 802.11ac, VHT40 @ MCS 9...
  • Page 48 Wi-Fi&Bluetooth Module Series 802.11ax, HE20 @ MCS 11 ±2 802.11ax, HE40 @ MCS 0 13.5 ±2 802.11ax, HE40 @ MCS 11 ±2 802.11ax, HE80 @ MCS 0 ±2 802.11ax, HE80 @ MCS 11 ±2 802.11ax, HE160 @ MCS 0 12.5 ±2 802.11ax, HE160 @ MCS 11 ±2...
  • Page 49 Wi-Fi&Bluetooth Module Series 802.11a @ 6 Mbps ±2 802.11a @ 54 Mbps ±2 802.11n, HT20 @ MCS 0 ±2 802.11n, HT20 @ MCS 7 ±2 802.11n, HT40 @ MCS 0 ±2 802.11n, HT40 @ MCS 7 ±2 802.11ac, VHT20 @ MCS 0 ±2 802.11ac, VHT20 @ MCS 8 ±2...

  • Page 50: Bluetooth Rf Performances

    Wi-Fi&Bluetooth Module Series 802.11a @ 6 Mbps ±2 802.11a @ 54 Mbps ±2 802.11ax, HE20 @ MCS 0 ±2 802.11ax, HE20 @ MCS 11 ±2 802.11ax, HE40 @ MCS 0 ±2 802.11ax, HE40 @ MCS 11 ±2 802.11ax, HE80 @ MCS 0 ±2 802.11ax, HE80 @ MCS 11 ±2...

  • Page 51: Esd Protection

    Wi-Fi&Bluetooth Module Series 4.7. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.

  • Page 52: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions Figure 17: Module Top and Side Dimensions FC66E_Series_Hardware_Design 51 / 63...
  • Page 53 Wi-Fi&Bluetooth Module Series Figure 18: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FC66E_Series_Hardware_Design 52 / 63...

  • Page 54: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 19: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FC66E_Series_Hardware_Design 53 / 63...

  • Page 55: Top And Bottom Views

    Figure 20: Top & Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FC66E_Series_Hardware_Design 54 / 63...

  • Page 56: Storage, Manufacturing And Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing and Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 57: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 58 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

  • Page 59: Packaging Specifications

    Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 6.3.1.

  • Page 60: Plastic Reel

    Wi-Fi&Bluetooth Module Series 6.3.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing Table 34: Plastic Reel Dimension Table (Unit: mm) ø D1 ø D2 44.5 6.3.3. Mounting Direction Figure 24: Mounting Direction FC66E_Series_Hardware_Design 59 / 63...

  • Page 61: Packaging Process

    Wi-Fi&Bluetooth Module Series 6.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

  • Page 62: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 35: Related Documents Document Name [1] Quectel_FC6xE_M.2_User_Guides [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note Table 36: Terms and Abbreviations Abbreviation Description Adaptive Frequency Hopping Access Point BPSK Binary Phase Shift Keying Bluetooth Low Energy Complementary Code Keying Clear To Send DBPSK Differential Binary Phase Shift Keying...
  • Page 63 Wi-Fi&Bluetooth Module Series Evaluation Board GFSK Gauss frequency Shift Keying Ground Host Controller Interface High Efficiency High Throughput IEEE Institute of Electrical and Electronics Engineers Input/Output License Assisted Access Leadless chip carrier Land Grid Array Long Term Evolution Medium Access Control Mbps Megabits per second Modulation and Coding Scheme...
  • Page 64 Wi-Fi&Bluetooth Module Series Request To Send Receive Surface Mount Technology SSID Service Set Identifier Station Transmit UART Universal Asynchronous Receiver/Transmitter Very High Throughput Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless-Fidelity WLAN Wireless Local Area Network FC66E_Series_Hardware_Design 63 / 63...

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