Summary of Contents for ON Semiconductor NCL30082SMRTGEVB
Page 1
Start Up Time (from Enable On) < 1 ms EMI (Conducted) Class B FCC/CISPR (Bottom View) Key Features Figure 1. NCL30082SMRTGEVB • Single Mains Evaluation Board • Integrated Auto-Recovery Fault Protection (Can be Latched by Choice of Options) Over Temperature on Board (a PCB Mounted NTC) ♦...
NCL30082SMRTGEVB THEORY OF OPERATION Power Stage CrM Timing The power stage for the demo board is a non-isolated In the off time, the voltage on the transformer/inductor coupled SEPIC converter. The controller has a built in forward biases D and D9. When the current in the control algorithm that is specific to the flyback transfer magnetic has reached zero, the voltage collapses to zero.
Page 3
NCL30082SMRTGEVB Thermal Protection Programmable OVP There is an internal current source from the SD pin. While the SD pin has a current source for the OTP, it can Placing an NTC from the SD pin to ground will allow the be overcome raising the voltage on the SD pin.
Page 4
NCL30082SMRTGEVB Interface Control Signals the power on startup time to be longer than 0.5 s since power on timing is now a one-time event. In this case, R START On/Off Control are optimized for low power consumption rather START1 The on/off control defaults to “on” if left open. Grounding than an optimized startup time.
Page 5
NCL30082SMRTGEVB SCHEMATIC DAMP 180 W +HVDC AC_L FUSE 1.5 mH 10 mF 100 nF 200 V − 250 V 1.5 mH AC_N ABS10 Figure 3. Input Circuit MM5Z15VT1G 56 kW 4.7 mF 100 V MMBTA06LT1G NDD02N60Z Figure 4. Main Schematic...
Page 9
NCL30082SMRTGEVB All Wire 6″ ±0.5″. Strip Ends 0.5″ Wire 3 Red Wire 1 White Wire 4 Black Place the Label on Top of T1 “NCL30082SMRTGEVB” “Rev( )” Wire 2 White L2 Mounts Horizontally Figure 9. Assembly Notes Top Bevel Edge of D4 Indicates Polarity J7 on the Solder Side Figure 10.
Page 10
NCL30082SMRTGEVB CIRCUIT BARD FABRICATION NOTES 11. Size tolerance of plated holes: ±0.003″: non-plated 1. Fabricate per IPC−6011 and IPC6012. Inspect to IPA−A−600 Class 2 or updated standard. holes ±0.002″. 2. Printed Circuit Board is defined by files listed in 12. All holes shall be ±0.003″ of their true position fileset.
NCL30082SMRTGEVB TEST PROCEDURE Equipment Needed Test Connections • 1. Connect the LED load to the red(+) and black(−) AC Source – 90 to 135 V ac 50/60 Hz minimum 500 W leads through the ammeter shown in Figure 14. capability Caution: Observe the correct polarity or the load •...
Page 14
NCL30082SMRTGEVB TEST DATA Figure 15. Efficiency over Load Figure 16. Regulation over Line www.onsemi.com...
Page 15
NCL30082SMRTGEVB Figure 17. Cross Regulation Effect of +3.3 Load on Output Current Figure 18. Cross Regulation Effect of Output Current on +3.3 V Output www.onsemi.com...
Page 16
NCL30082SMRTGEVB Figure 19. Standby Power Consumption over Line Figure 20. Start Up with AC Applied 120 V Maximum Load Figure 21. Start Up with Enable www.onsemi.com...
NCL30082SMRTGEVB BILL OF MATERIALS Table 3. NCL30082SMRTGEVB BILL OF MATERIALS Substitution Qty. Reference Part Manufacturer Manufacturer Part Number PCB Footprint Allowed C13, C15, C 4.7 mF Taiyo Yuden EMK107ABJ475KA-T 4.7 mF, 100 V 12061Z475KAT2A 1206 C3, C5 100 nF, 250 V...
Page 18
onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.
Need help?
Do you have a question about the NCL30082SMRTGEVB and is the answer not in the manual?
Questions and answers