3.4.2
Component placement .......................................................................................................................... 25
3.4.3
Layout and manufacturing ................................................................................................................... 25
3.6 Thermal guidelines........................................................................................................................................... 27
3.7 ESD guidelines................................................................................................................................................... 27
3.8 Design-in checklists......................................................................................................................................... 28
3.8.1
Schematic checklist................................................................................................................................ 28
3.8.2
Layout checklist ....................................................................................................................................... 28
4
Software ..................................................................................................................................... 29
4.1 SDK for Open CPU modules .......................................................................................................................... 29
4.2.1
4.2.2
Setup path to ESP-IDF ........................................................................................................................... 30
4.2.3
Build and flash .......................................................................................................................................... 30
4.2.4
ESP-IDF partition table .......................................................................................................................... 31
4.2.5
4.3 Output power configuration .......................................................................................................................... 32
4.3.1
NORA-W10 series.................................................................................................................................... 32
5
Handling and soldering ............................................................................................................ 33
5.1 ESD handling precautions ............................................................................................................................. 33
5.3 Reflow soldering process ............................................................................................................................... 34
5.3.1
Cleaning ...................................................................................................................................................... 35
5.3.2
Other remarks........................................................................................................................................... 35
6
Regulatory compliance ............................................................................................................ 36
6.1 Country approvals ............................................................................................................................................ 36
6.2.1
6.2.2
6.2.3
6.3.1
6.4 FCC/ISED compliance ..................................................................................................................................... 37
6.4.1
FCC compliance statements................................................................................................................ 37
6.4.2
6.4.3
Operating frequencies ........................................................................................................................... 39
6.4.4
RF exposure statement ......................................................................................................................... 39
6.4.5
6.4.6
6.4.7
End-product compliance ....................................................................................................................... 41
6.5.1
Compliance statement .......................................................................................................................... 42
UBX-22005601 - R04
C1-Public
NORA-W10 series - System integration manual
Contents
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