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u-blox NINA-B1 Series Manual

Stand-alone bluetooth low energy modules
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NINA-B1 series
Stand-alone Bluetooth low energy
modules
System Integration Manual
Abstract
This document describes the system integration of NINA-B1 series
stand-alone Bluetooth low energy modules.
Bluetooth low energy profiles and services, these modules are
tailored for OEMs who wish to embed their own application on top
of
the
available
BLE
services/attributes on top of the integrated software stack and tools
using ARM mbed IDE.
www.u-blox.com
UBX-15026175 - R06
With embedded
stack
and/or
to
embed
Bluetooth

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Summary of Contents for u-blox NINA-B1 Series

  • Page 1 Stand-alone Bluetooth low energy modules System Integration Manual Abstract This document describes the system integration of NINA-B1 series stand-alone Bluetooth low energy modules. With embedded Bluetooth low energy profiles and services, these modules are tailored for OEMs who wish to embed their own application on top...
  • Page 2 This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com. Copyright © 2017, u-blox AG. u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in the EU and other countries.

  • Page 3: Table Of Contents

    NINA-B1 series - System Integration Manual Contents Contents ..........................3 System description ....................... 5 Overview and applications ........................5 1.1.1 Module architecture ........................6 1.1.2 Hardware options .......................... 6 1.1.3 Software options ........................... 6 Pin configuration and function ......................6 1.2.1...
  • Page 4 NINA-B1 series - System Integration Manual 3.2.1 RF transmission line design (NINA-B111 only) ................28 3.2.2 Antenna design (NINA-B111 only) ....................30 3.2.3 On-board antenna design (NINA-B112 only) ................32 Supply interfaces ..........................33 3.3.1 Module supply design ......................... 33 Data communication interfaces ......................

  • Page 5: System Description

    1 System description 1.1 Overview and applications The NINA-B1 series modules are small stand-alone Bluetooth low energy modules featuring Bluetooth v4.2 (software upgradeable to Bluetooth 5), a powerful Cortex M4F processor, and state-of-the-art power performance. The embedded low power crystal improves the power consumption by enabling optimal power save modes.

  • Page 6: Module Architecture

    1.1.3 Software options The NINA-B1 series module can be used either together with the preflashed u-blox connectivity software or as an Open CPU module where you can run your own application developed with either ARM mbed, Nordic SDK or Wirepas development environment inside the NINA-B1 module.

  • Page 7: Pin Description

    The pin-out described in Figure 2 is an example pin-out that demonstrates the most commonly used interfaces. A = Analog function capable pin Figure 2: NINA-B1 series pin assignment (top view) The grey pins in the center of the modules are GND pins. The outline of NINA-B111 ends at the dotted line as shown in Figure 2, where the antenna area of NINA-B112 begins.
  • Page 8 NINA-B1 series - System Integration Manual Do not apply an NFC field to the NFC pins when they are configured as GPIOs. Doing so may cause permanent damage to the module. When driving different logic levels on these pins in GPIO mode, a small current leakage will occur, make sure they are set to the same logic level before entering into any power saving modes.
  • Page 9 NINA-B1 series - System Integration Manual nR52 Function Pin Name Pin No. Type Description u-blox connectivity software Power Module supply input 1.7-3.6V range VCC_IO IO Voltage supply input Must be connected to VCC on NINA-B1 6, 12, 14, Module ground...

  • Page 10: Supply Interfaces

    1.3.2 Digital I/O interfaces reference voltage (VCC_IO) On the NINA-B1 series modules, the I/O voltage level is the same as the supply voltage and VCC_IO is internally connected to the supply input VCC. UBX-15026175 - R06...

  • Page 11: Vcc Application Circuits

    Level shifters might be needed depending on the I/O voltage of the host system. 1.3.3 VCC application circuits The power for NINA-B1 series modules is provided through the VCC pins, which can be one of the following: •...

  • Page 12: Serial Interfaces

    The u-blox connectivity software adds the DSR and DTR pins to the UART interface. These pins are not used as originally intended, but to control the state of the NINA-B1 module. Depending on the current configuration, the DSR can be used to: •...

  • Page 13: Gpio Pins

    1.7 GPIO pins The NINA-B1 series module can provide up to 19 pins, which can be configured as general purpose input or output. 7 GPIO pins are capable of handling analog functionality. All pins are capable of handling interrupt.

  • Page 14: Antenna Interfaces

    Table 7: Possible uses of analog pin 1.8 Antenna interfaces The antenna interface is different for each module variant in the NINA-B1 series. 1.8.1 Antenna pin – NINA-B111 The NINA-B111 is equipped with an RF pin. The RF pin has a nominal characteristic impedance of 50 Ω and must be connected to the antenna through a 50 Ω...

  • Page 15: Integrated Antenna - Nina-B112

    1.8.3 NFC antenna The NINA-B1 series modules include a Near Field Communication interface, capable of operating as a 13.56 MHz NFC tag at a bit rate of 106 kbps. As an NFC tag, data can be read from or written to the NINA-B1 modules using an NFC reader;...

  • Page 16: Software

    NINA-B1 series - System Integration Manual 2 Software The NINA-B1 series module can be used either with the preflashed u-blox connectivity software or as an Open CPU module where you can run your own application developed with either ARM mbed, Nordic SDK or Wirepas development environment inside the NINA-B1 module.
  • Page 17 2.2.1.1 Getting started on the Nordic SDK To work with the Nordic SDK on the NINA-B1 series module, follow the steps mentioned below: 1. Get started with the Nordic Semiconductor toolchain and examples: a. Download and install the nRFgo Studio, which includes the nRF Tools package: JLinkARM, JLink CDC, nRFjprog, and mergehex from www.nordicsemi.com.
  • Page 18 NINA-B1 series - System Integration Manual #ifndef BOARD_CUSTOM_H #define BOARD_CUSTOM_H #ifdef __cplusplus extern "C" #endif #include "nrf_gpio.h" // In this case PIN 16 is used as button SW1, if the green led // should be used it is possible to defined that one instead.

  • Page 19: Mbed Os

    NINA-B1 series - System Integration Manual 2.2.2 mbed OS ARM mbed OS is an open source embedded operating system designed specifically for the "things" in the Internet of Things. It includes all the features to develop a connected product, including security, connectivity, an RTOS, and drivers for sensors and I/O devices.
  • Page 20 NINA-B1 series - System Integration Manual "EVK_NINA_B1": { "supported_form_factors": ["ARDUINO"], "inherits": ["MCU_NRF52"], "macros_add": [ "BOARD_PCA10040", "NRF52_PAN_12", "NRF52_PAN_15", "NRF52_PAN_58", "NRF52_PAN_55", "NRF52_PAN_54", "NRF52_PAN_31", "NRF52_PAN_30", "NRF52_PAN_51", "NRF52_PAN_36", "NRF52_PAN_53", "S132", "CONFIG_GPIO_AS_PINRESET", "BLE_STACK_SUPPORT_REQD", "SWI_DISABLE0", "NRF52_PAN_20", "NRF52_PAN_64", "NRF52_PAN_62", "NRF52_PAN_63"], "device_has": [ "ANALOGIN", "ERROR_PATTERN", "I2C", "I2C_ASYNCH", "INTERRUPTIN", "LOWPOWERTIMER",...
  • Page 21 NINA-B1 series - System Integration Manual #ifndef MBED_PINNAMES_H #define MBED_PINNAMES_H #include "cmsis.h" #ifdef __cplusplus extern "C" #endif typedef enum PIN_INPUT, PIN_OUTPUT } PinDirection; #define PORT_SHIFT typedef enum // nRF52 pin names p0 = 0, p1 = 1, p2 = 2,...
  • Page 22 NINA-B1 series - System Integration Manual //NINA-B1 module pin names NINA_B1_GPIO_1 = p8, NINA_B1_GPIO_2 = p11, NINA_B1_GPIO_3 = p12, NINA_B1_GPIO_4 = p13, NINA_B1_GPIO_5 = p14, NINA_B1_GPIO_7 = p16, NINA_B1_GPIO_8 = p18, NINA_B1_GPIO_16 = p28, NINA_B1_GPIO_17 = p29, NINA_B1_GPIO_18 = p30,...

  • Page 23: Wirepas Connectivity Software

    “mbed compile –t GCC_ARM –m EVK_NINA_B1” 2.2.3 Wirepas connectivity software The NINA-B1 series module can also be used together with the Wirepas software stack. This will enable the NINA-B1 module to be used in a big scale true mesh environment.
  • Page 24 NINA-B1 series - System Integration Manual 2.3.1.1 s-center To flash the module using s-center, 1. Select Tools > Firmware Update as shown in the following screenshot: 2. Select the file that contains the bootloader and SoftDevice. 3. Set the correct COM port and the desired speed and click Update button.

  • Page 25: Swd Flashing

    NINA-B1 series - System Integration Manual 2.3.1.2 nRFgo Studio The Nordic tool nRFgo Studio can also be used to reflash the NINA-B1 module over UART. See the Nordic Semiconductor Infocenter [14] for information about the tool. 1. Start the nRFgo Studio and open the tab called Device Manager/nRF5x Bootloader 2.
  • Page 26 Go to the respective tabs and flash the following files in the below-mentioned order: 1) SoftDevice 2) Bootloader (if applicable) 3) Application 4) Application validation file (only applicable for u-blox connectivity software) In the software deliveries on the u-blox webpage, the .hex files for the u-blox connectivity software are available: • SoftDevice (s132_nrf52_xxx.hex) •...
  • Page 27 +UMLA: D4CA6EB00613 2.3.2.3 Restoring the Bluetooth device address When the new u-blox connectivity software is flashed to the module, it is important to restore the Bluetooth device address as well. Step 1: To enable writing of the Bluetooth device address, execute the following command and wait for the startup...

  • Page 28: Design-In

    3 Design-in 3.1 Overview For an optimal integration of NINA-B1 series modules in the final application board, it is recommended to follow the design guidelines stated in this chapter. Every application circuit must be properly designed to guarantee the correct functionality of the related interface, however a number of points require high attention during the design of the application device.
  • Page 29 NINA-B1 series - System Integration Manual Figure 10: Transmission line trace design To properly design a 50 Ω transmission line, the following remarks should be taken into account: • The designer should provide enough clearance from surrounding traces and ground in the same layer; in general, a trace to ground clearance of at least two times the trace width should be considered and the transmission line should be ‘guarded’...

  • Page 30: Antenna Design (Nina-B111 Only)

    RF compliance of the device integrating NINA-B1 module with all the applicable required certification schemes heavily depends on the radiating performance of the antennas. The designer is encouraged to consider one of the u-blox suggested antenna part numbers and follow the layout requirements.
  • Page 31 NINA-B1 series - System Integration Manual Table 8 summarizes the requirements for the antenna RF interface. Item Requirements Remarks Impedance 50 Ω nominal characteristic impedance The impedance of the antenna RF connection must match the 50 Ω impedance of the ANT pin.

  • Page 32: On-Board Antenna Design (Nina-B112 Only)

    NINA-B1 series - System Integration Manual Consider that SMT connectors are typically rated for a limited number of insertion cycles. In addition, the RF coaxial cable may be relatively fragile compared to other types of cables. To increase application ruggedness, connect U.FL connector to a more robust connector such as SMA fixed on panel.

  • Page 33: Supply Interfaces

    NINA-B1 series - System Integration Manual It is recommended to place the NINA-B112 module so that the internal antenna is in the corner of the host PCB (Pin 15/16 should be in the corner) as shown in Figure 12. The antenna side (short side closest to the antenna), positioned along one side of the host PCB ground plane is the second best option.

  • Page 34: Serial Peripheral Interface (Spi)

    These general design guidelines are considered as best practices and are valid for any bus present in the NINA-B1 series modules; the designer should prioritize the layout of higher speed busses. Low frequency signals are generally not critical for layout.

  • Page 35: General Considerations For Schematic Design And Pcb Floor-Planning

    PCB, the ground ring must then be connected to other layers through vias. 3.7 Module footprint and paste mask The mechanical outline of the NINA-B1 series module can be found in the NINA-B1 series Data Sheet [2]. The proposed land pattern layout reflects the pads layout of the module.

  • Page 36: Thermal Guidelines

    3.8 Thermal guidelines The NINA-B1 series modules have been successfully tested in -40 °C to +85 °C. The NINA-B1 series module is a low power device and will generate only a small amount of heat during operation. A good grounding should still be observed for temperature relief during high ambient temperature.

  • Page 37: Handling And Soldering

    4.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and storage, as well as drying for preconditioning refer to NINA-B1 series Data Sheet [2] and u-blox Package Information Guide [1]. 4.2 Handling The NINA-B1 series modules are Electro-Static Discharge (ESD) sensitive devices and require special precautions during handling.

  • Page 38: Cleaning

    NINA-B1 series - System Integration Manual The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. The optimal soldering profile used has to be trimmed for each case depending on the specific process and PCB layout.

  • Page 39: Other Remarks

    NINA-B1 series - System Integration Manual • Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.

  • Page 40: Qualifications And Approvals

    NINA-B1 series - System Integration Manual 5 Qualifications and approvals For regulatory information, see the NINA-B1 series Datasheet [2]. UBX-15026175 - R06 Qualifications and approvals Page 40 of 48...

  • Page 41: Product Testing

    OEM manufacturer production test As the testing is already done by u-blox, an OEM manufacturer does not need to repeat firmware tests or measurement of the module’s RF performance or tests over analog and digital interfaces in their production test.

  • Page 42: Go/No Go" Tests For Integrated Devices

    A basic RF functional test of the device including the antenna can be performed with standard Bluetooth low energy devices as remote stations. The device containing the NINA-B1 series module and the antennas should be arranged in a fixed position inside an RF shield box to prevent interferences from other possible radio devices to get stable test results.

  • Page 43: Appendix

    NINA-B1 series - System Integration Manual Appendix A Glossary Name Definition Analog to Digital Converter Automatic Test Equipment Bluetooth Low Energy Clear To Send Dual-Data Rate Electro-Magnetic Compatibility Electro Magnetic Interference Electro Static Discharge Federal Communications Commission FOAT Firmware update Over AT-command...

  • Page 44: B Antenna Reference Designs

    PCB layout must be identical to the one provided by u-blox, please implement one of the reference designs included in this section or contact u-blox. • The designer must use the stack-up provided by u-blox. RF traces on the carrier PCB are part of the certified design. The available designs are presented in this section.

  • Page 45: Floor Plan

    NINA-B1 series - System Integration Manual B.1.1 Floor plan This section describes where the critical components and copper traces are positioned on the reference design. Figure 17: NINA-B111 antenna reference design Reference Part Manufacturer Description NINA-B111 u-blox NINA-B111 module U.FL-R-SMT-1(10) Hirose Coaxial Connector, 0 –...
  • Page 46 NINA-B1 series - System Integration Manual Item Value See Figure 19 280 µm Soldermask: 20 +/- 10 µm Copper film and plating/surface coating: 35 +/- 15 µm 150 +/- 20 µm ε 3.77 +/- 0.5 Table 14: Coplanar micro-strip specification Figure 19 displays the minimum required GND trace required around the RF trace and pins.

  • Page 47: Related Documents

    [13] JESD51 – Overview of methodology for thermal testing of single semiconductor devices [14] Nordic Semiconductor Infocenter - http://infocenter.nordicsemi.com/index.jsp For regular updates to u-blox documentation and to receive product change notifications, register on our website (http://www.u-blox.com). Revision history Revision Date...

  • Page 48: Contact

    NINA-B1 series - System Integration Manual Contact For complete contact information visit us at www.u-blox.com. u-blox Offices North, Central and South America Headquarters Asia, Australia, Pacific Europe, Middle East, Africa u-blox America, Inc. u-blox Singapore Pte. Ltd. u-blox AG Phone:...

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