Absolute Maximum Ratings; Thermal Resistance; Esd Caution; Changes To Absolute Maximum Ratings Section - Analog Devices ADM1063 Manual

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter
Voltage on VH Pin
Voltage on VPx Pins
Voltage on VXx Pins
Voltage on A0, A1 Pins
Voltage on REFIN, REFOUT Pins
Voltage on VDDCAP, VCCP Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Voltage on DxN, DxP Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
Storage Temperature Range
Lead Temperature,
Soldering Vapor Phase, 60 sec
ESD Rating, All Pins
Rating
16 V
7 V
−0.3 V to +6.5 V
−0.3 V to +7 V
5 V
6.5 V
16 V
7 V
−0.3 V to +0.3 V
−0.3 V to +5 V
±5 mA
±20 mA
max) 150°C
J
−65°C to +150°C
215°C
2000 V
Rev. C | Page 9 of 32
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

THERMAL RESISTANCE

θ is specified for the worst-case conditions, that is, a device
JA
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
40-Lead LFCSP
48-Lead TQFP

ESD CAUTION

ADM1063
θ Unit
JA
25 °C/W
50 °C/W