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7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
2.2. Service caution based on legal restrictions
2.2.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the
printed circuit boards used for this equipment in considering the globally environmental
conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is
the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead
free solder is higher approx.30 degrees C (86°F) more than that of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of "PbF" is printed either foil side or components side on the PCB
using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
- The lead free solder has to be used when repairing the equipment
for which the lead free solder is used.
(Definition: The letter of "PbF" is printed on the PCB using the lead
free solder.)
- To put lead free solder, it should be well molten and mixed with the
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