Processors
Supports an Intel Xeon D-1700 series processor with a thermal design power (TDP) of up to 67W
Note: Please refer to the motherboard specifications pages on our website for updates to supported processors.
BIOS
256Mb SPI Flash with AMI BIOS®
Memory
Up to 256GB of ECC and Non-ECC RDIMM/UDIMM DDR4 memory with speeds of up to 2933MHz in four memory slots
Storage Drive
Supports one 2.5" drive of 7mm height
One M.2 PCIe 3.0 x4 or SATA 3.0 slot (M-Key 2280) populated in the connector JMD1
Expansion Slots
Three connectors (JMD1 populated; JMD2 and JMD3 unpopulated):
JMD1: M.2 PCIe 3.0 x4 or SATA 3.0 slot (M-Key 2280)
JMD2: M.2 PCIe 3.0 x2 or SATA 3.0 or USB 3.0 Slot (B-Key 2280/3042/3052)
JMD3: M.2 PCIe 3.0 x1 or USB 2.0 slot (E-Key 2230)
Networking
One dedicated IPMI LAN port
Four Gigabit Ethernet ports
Two 25G SFP28 ports
Motherboard
X12SDV-4C/8C-SP6F
Dimensions: Mini-ITX form factor (6.7" x 6.7") (170.18mm x 170.18mm)
Chassis
CSE-E302iL
Dimensions: 11.6" x 2.9" x 8.1" (W x H x D) (295 x 73 x 205mm)
System Cooling
Fanless
Power Supply
180W 12V Lockable DC Power Adapter
Weight
Gross Weight: 7.5lbs (3.4kg)
Net Weight: 3.45lbs (1.56kg)
Operating Environment
Operating Temperature:
SYS-E302-12D-4C: 0°C - 40°C
SYS-E302-12D-8C: 0°C - 35°C
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Regulatory Compliance
FCC, ICES, CE, UKCA, VCCI, RCM, NRTL, CB
Appendix B
System Specifications
91
Appendix B: System Specifications
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