Chapter 13 Welding Work Instructions; Reflow Soldering Temperature - Ebyte E29-T Series User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

Chapter 13 Welding Work Instructions

13.1 Reflow soldering temperature

Reflow Soldering Profile Characteristics
Min. Temperature（
Preheat/keep
Max. Temperature（T
warm
Time（T
Average ramp-up rate
Liquidous Temperature（T
Time（tL）Maintained Above
Package peak temperature T
The time (Tp) within 5°C of the specified
classification temperature (Tc), see the
figure below
Aveage ramp-down rate
Time from 25℃ to peak temperature
※The peak temperature (Tp) tolerance definition of the temperature profile is an upper limit for the user
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Tsmin
）
）
smax
~T
smin smin
）
~T
（T ）
p
L
）
L
Should not exceed the
temperature indicated on the
p
product's label of "Moisture
Sensitivity".
（T p ~T
）
L
Sn-Pb Assembly
100℃
150℃
60-120s
3℃/s, Maximum
183℃
60~90s
20s
6℃/s, Maximum
6min，Maximum
E29-400TXXX product data sheet
Pb-Free Assembly
150℃
200℃
60-120s
3℃/s, Maximum
217℃
60~90s
Should not exceed the
temperature indicated on the
product's label of "Moisture
Sensitivity".
30s
6℃/s, Maximum
8min，Maximum
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