Ⅹ Welding Work Guide; Reflow Temperature - Ebyte E49-400T30D Specifications

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Ⅹ Welding work guide

10.1 reflow temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature
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曲线特征 Curve feature
solder paste
Minimum preheat
temperature
maximum preheat
temperature
Preheat time
average rate of ascent
liquidus temperature
time above liquidus
peak temperature
average rate of descent
Time from 25°C to peak
temperature
E49-400T30D Specifications
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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