Chengdu Ebyte Electronic Technology Co., Ltd.
12. Welding Operation Guidance
12 .1 Reflow soldering temperature
Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Aveage ramp-down rate (Tp to Tsmax)
Time 25℃ to peak temperature
12.2 Reflow soldering curve
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Curve characteristics
solder paste
Minimum preheat
temperature
Maximum preheating
temperature
Preheat time
average rate of rise
liquidus temperature
time above liquidus
peak temperature
average rate of decline
Time from 25℃ to peak
temperature
E48-XXXT20S User Manual
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6℃/second max
6 minutes max
8 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
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