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The DRV2605L is a haptic driver designed for linear resonant actuators (LRA) and eccentric rotating mass
(ERM) motors. It provides many features, which help eliminate the design complexities of haptic motor
control including:
•
Reduced solution size
•
High-efficiency output drive
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Closed-loop motor control
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Quick device startup
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Embedded waveform library
•
Auto-resonance frequency tracking
The DRV2605LDGSEVM-M is a breakout board that allows the user to gain access to each pin of the
MSOP package type for quick evaluation of haptic driver. The board must be paired with a processor,
microcontroller, MSP430 launchpad, or a DRV2605LEVM-CT to control the driver through I
The user guide contains instructions to setup and operate the DRV2605LDGSEVM-M.
Evaluation Kit Contents:
•
DRV2605LDGSEVM-M breakout board
SLOU396 – August 2014
Submit Documentation Feedback
DRV2605LDGS Haptic Driver Mini Board
Copyright © 2014, Texas Instruments Incorporated
User's Guide
SLOU396 – August 2014
2
C commands.
DRV2605LDGS Haptic Driver Mini Board
1
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Summary of Contents for Texas Instruments DRV2605LDGSEVM-M
- Page 1 • Auto-resonance frequency tracking The DRV2605LDGSEVM-M is a breakout board that allows the user to gain access to each pin of the MSOP package type for quick evaluation of haptic driver. The board must be paired with a processor, microcontroller, MSP430 launchpad, or a DRV2605LEVM-CT to control the driver through I C commands.
- Page 2 Overview www.ti.com Overview The DRV2605LDGSEVM-M is a breakout board that allows the user to have access to all of the pins on the DRV2605L MSOP package type. Figure 1 shows the pin out of the part. NOTE: The pin out of the part does not correspond directly to the pin out of the headers. VREG is replaced by VIO on the headers.
- Page 3 DRV2605LEVM-CT Figure 3. DRV2605LDGSEVM-M Connection to DRV2605LEVM-CT 1. Connect the DRV2605LDGSEVM-M to the DRV2605LEVM-CT with IC test hook lead cables as shown Figure 3. If VIO header pin is not being used, it can be left floating. Connect a separate actuator to the OUTP and OUTM headers of the DRV2605LDGSEVM-M.
- Page 4 OUTM OUTP VBAT VBAT 1µF OUTP OUT+ OUTM VDD/NC OUT- 3.3k 3.3k VREG IN/TRIG 1µF DRV2605LDGS Figure 4. Schematic for the DRV2605LDGSEVM-M DRV2605LDGS Haptic Driver Mini Board SLOU396 – August 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated...
- Page 5 Layout www.ti.com Layout Figure 5. Top Silkscreen (Yellow), Top (Red), and Bottom (Blue) Layers SLOU396 – August 2014 DRV2605LDGS Haptic Driver Mini Board Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated...
- Page 6 ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1.
- Page 7 RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries.
- Page 8 Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated spacer Important Notice for Users of EVMs Considered “Radio Frequency Products”...
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Page 9: Important Notice
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. -
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