Cree XLamp XR Series Soldering & Handling

Cree Xlamp
®
inTroduCTion
This application note applies to XLamp
LeDs, which have order codes in the following fomat.
Xrxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp Xr family
LeDs and assemblies containing these LeDs should be
handled during manufacturing. Please read the entire
document to understand how to properly handle
XLamp Xr family LeDs.
Copyright © 2008-2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice.
the Cree logo and XLamp are registered trademarks of Cree, Inc. This document is provided for informational purposes only and
Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. ®
is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty
information, please contact Cree Sales at sales@cree.com. other trademarks, product and company names are the property of
their respective owners and do not imply specific product and/or vendor endorsement, sponsorship or association.
Xr Family leds
®
Xr family
®
soldering & handling

Table oF ConTenTs

Handling XLamp Xr Family LeDs .........................2
®
Circuit Board Preparation & Layouts ......................3
Case Temperature (T ) measurement Point .............3
s
XLamp XR Family LED Reflow Soldering
®
Characteristics ...................................................6
moisture Sensitivity ............................................7
Low Temperature operation .................................8
Chemicals & Conformal Coatings ..........................9
Assembly Storage & Handling ............................. 10
Tape and reel .................................................. 11
Packaging and Labels ........................................ 12
Cree, Inc.
,
®
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300