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Summary of Contents for Texas Instruments ADC121S101EVM
- Page 1 ADC121S101EVM User's Guide User's Guide Literature Number: SNOU131 July 2014...
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Page 2: Table Of Contents
Launchpad Firmware Upgrade ......................Update USB Driver ..............ADC121S101 BoosterPack Setup and Operation ......................... Connections ....................Launching the Software ........................Board Layout ......................... Schematic ........................Bill Of Materials Contents SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... - Page 3 ...................... 4-5. Bottom Layer Routing .................... 5-1. ADC121S101EVM Schematic List of Tables ..................1-1. Device and Package Configurations .................... 6-1. ADC121S101 Bill of Materials SNOU131 – July 2014 List of Figures Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated...
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Page 4: Adc121S101 Boosterpack Components
Chapter 1 SNOU131 – July 2014 ADC121S101 BoosterPack Components Figure 1-1. ADC121S101EVM Evaluation Board Table 1-1. Device and Package Configurations DEVICE PACKAGE LM4120IM5-3.3 SOT-23 ADC121S101CIMF SOT-23 LMT84DCK SC70 LMV612MA SOIC-8 ADC121S101 BoosterPack Components SNOU131 – July 2014 Submit Documentation Feedback... -
Page 5: Software Installation
Graphical User Interface (GUI) To use the ADC121S101EVM, install the ADC12xS10x software: 1. If the ADC121S101EVM came from an FAE, the software GUI is in a .zip file. Otherwise, click on http://www.ti.com/product/adc121s101, scroll down to the Software section, and download the latest evaluation software. -
Page 6: Launchpad Firmware Upgrade
Application Only. Click Finish when done. Firmware upgrade: 1. If the ADC121S101EVM is from an FAE, the firmware is the text file adc12xs10x_fw-v0.92.txt. 2. Open the MSP430 USB Firmware Upgrade application. By default, the application is launched from Start >... -
Page 7: Update Usb Driver
6. Click on the Upgrade Firmware button to program the LaunchPad. Close the application when done. Update USB Driver 1. Before launching the ADC12xS10x software, connect the ADC121S101EVM board to a USB port of the PC. Go to the Device Manager and find MSP43-USB Example. Right click and select Update Driver Software. -
Page 8: Driver Not Installed
3. If prompted with a warning window, select Install this Driver Anyway. Close the installation window when done. The device manager now displays a TI_ADC_DAC_EVMs item followed by a COM port number. Software Installation SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 9: Driver Authentication Warning
Update USB Driver www.ti.com Figure 2-5. Driver Authentication Warning Figure 2-6. Driver Installed SNOU131 – July 2014 Software Installation Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 10: Adc121S101 Boosterpack Setup And Operation
Connections 1. Attach the ADC121S101EVM BoosterPack onto the MSP430 LaunchPad using connectors JA, JB, JC, JD. Align the Launchpad and ADC121S101EVM so that the text “LaunchPad” and “2013 TI” are in the same direction. Figure 3-1. ADC121S101EVM Attached to MSP430 2. -
Page 11: Part Select
• Single Read: Read a single conversion. • Continuous Read: Read conversion results continuously. • Zoom Out: – Checked: Graph zooms out. SNOU131 – July 2014 ADC121S101 BoosterPack Setup and Operation Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 12: Selectable Fields In Gui
– Unchecked: No data is saved. Figure 3-3. Selectable Fields in GUI 3. Test the ADC121S101 by placing a finger on U3 to observe the temperature change. ADC121S101 BoosterPack Setup and Operation SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 13: Testing The Part
Launching the Software www.ti.com Figure 3-4. Testing the Part SNOU131 – July 2014 ADC121S101 BoosterPack Setup and Operation Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 14: Board Layout
Chapter 4 SNOU131 – July 2014 Board Layout Figure 4-1. Top Assembly Layer Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 15: Top Layer Routing
Figure 4-2. Top Layer Routing SNOU131 – July 2014 Board Layout Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 16: Power Layer Routing
Figure 4-3. Power Layer Routing Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 17: Ground Layer Routing
Figure 4-4. Ground Layer Routing SNOU131 – July 2014 Board Layout Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 18: Bottom Layer Routing
Figure 4-5. Bottom Layer Routing Board Layout SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 19: Schematic
Chapter 5 SNOU131 – July 2014 Schematic Figure 5-1. ADC121S101EVM Schematic SNOU131 – July 2014 Schematic Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... -
Page 20: Bill Of Materials
DCK0005A Dual 1.4 MHz, low power general purpose, LMV612MA/NOPB Texas Instruments 1.8 V, D0008A Keystone VA-EXT Test point, TH, multipurpose, red 5010 Electronics Bill Of Materials SNOU131 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated... - Page 21 Quanti Designator Value Description Part Number Manufacturer CAP, CERM, xxxF, xxV, [TempCo], xx%, C9, C10 Used in BOM report Used in BOM report [PackageReference] SNOU131 – July 2014 Bill Of Materials Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated...
- Page 22 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.
- Page 23 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
- Page 24 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
- Page 25 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated...
- Page 26 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.
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