Introduction - Xycom XVME-113 User Manual

Chapter 1 – Introduction
1.4 SPECIFICATIONS
Table 1-1 lists the XVME-113 Memory Module's Hardware Specifications.
Characteristic
Maximum Memory Capacity: 1 bank of 16 sites, 1 bank of 8 sites
Device Sizes Supported:
Device Speeds Supported:
Power Requirements:
Battery Rating:
Battery Life:
VMEbus COMPLIANCE
Complies with VMEbus Specifications, IEEE 1014, Rev C.1
1-4
Table 1-1. XVME-113 Memory Module Hardware Specifications
Specification
RAM 12 Mbytes Total
EPROM 24 Mbytes Total
FLASH 12 Mbytes Total
EEPROM 12 Mbytes Total
RAM 128K by 8 up to 512K by 8
EPROM 128K by 8 up to 1024K by 8
FLASH 128K by 8 up to 512K by 8
EEPROM 128K by 8 up to 512K by 8
50, 100, 150, 200 ns
+5 V @ .7A typ. .9 A max.
1.9 Amp hours
2.0 years typ. (using a 628128 Hitachi RAM or equivalent device)
A32/A24:D32/D16/D08(EO)DTB Slave for memory banks
A16:D16/D08(EO)DTB Slave for Real Time Clock and configuration port
4 BUS GRANT INs are connected to their respective BUS GRANT OUTs
IACKIN is connected to IACKOUT
DOUBLE - 6U Form Factor
Supports RMW as well as UAT for memory banks