Texas Instruments DRV8833 Manual

Texas Instruments DRV8833 Manual

Dual h-bridge motor driver

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1 Features

Dual-H-Bridge Current-Control Motor Driver
1
– Can Drive Two DC Motors or One Stepper
Motor
– Low MOSFET ON-Resistance: HS + LS 360
Output Current (at V
M
– 1.5-A RMS, 2-A Peak per H-Bridge in PWP
and RTY Package Options
– 500-mA RMS, 2-A Peak per H-Bridge in PW
Package Option
Outputs can be in Parallel for
– 3-A RMS, 4-A Peak (PWP and RTY)
– 1-A RMS, 4-A Peak (PW)
Wide Power Supply Voltage Range:
2.7 to 10.8 V
PWM Winding Current Regulation and Current
Limiting
Thermally Enhanced Surface-Mount Packages

2 Applications

Battery-Powered Toys
POS Printers
Video Security Cameras
Office Automation Machines
Gaming Machines
Robotics
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Sample &
Product
Buy
Folder
DRV8833 Dual H-Bridge Motor Driver
= 5 V, 25°C)
Simplified Schematic
PWM
nSLEEP
nFAULT
Tools &
Technical
Software
Documents
SLVSAR1E – JANUARY 2011 – REVISED JULY 2015

3 Description

The DRV8833 device provides a dual bridge motor
driver
solution
mechatronic applications.
The device has two H-bridge drivers, and can drive
two DC brush motors, a bipolar stepper motor,
solenoids, or other inductive loads.
The output driver block of each H-bridge consists of
N-channel power MOSFETs configured as an H-
bridge to drive the motor windings. Each H-bridge
includes circuitry to regulate or limit the winding
current.
Internal shutdown functions with a fault output pin are
provided for overcurrent protection, short-circuit
protection,
overtemperature. A low-power sleep mode is also
provided.
The DRV8833 is packaged in a 16-pin WQFN
package with PowerPAD™ (Eco-friendly: RoHS & no
Sb/Br).
PART NUMBER
DRV8833
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2.7 to 10.8 V
DRV8833
1.5 A
Stepper or
Brushed DC
Motor Driver
1.5 A
Support &
Reference
Community
Design
for
toys,
printers,
undervoltage
lockout,
(1)
Device Information
PACKAGE
BODY SIZE (NOM)
TSSOP (16)
5.00 mm × 4.40 mm
HTSSOP (16)
5.00 mm × 4.40 mm
WQFN (16)
4.00 mm × 4.00 mm
M
+
J
DRV8833
and
other
and

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Summary of Contents for Texas Instruments DRV8833

  • Page 1: Features

    Folder Software Documents DRV8833 SLVSAR1E – JANUARY 2011 – REVISED JULY 2015 DRV8833 Dual H-Bridge Motor Driver 1 Features 3 Description The DRV8833 device provides a dual bridge motor • Dual-H-Bridge Current-Control Motor Driver driver solution toys, printers, other – Can Drive Two DC Motors or One Stepper mechatronic applications.
  • Page 2: Table Of Contents

    Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ....................Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 3: Pin Configuration And Functions

    Internal pulldown. (1) I = Input, O = Output, OZ = Tri-state output, OD = Open-drain output, IO = Input/output Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 4 Bridge A output 1 Connect to motor winding A AOUT2 Bridge A output 2 BOUT1 Bridge B output 1 Connect to motor winding B BOUT2 Bridge B output 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 5: Specifications

    Junction-to-case (bottom) thermal resistance °C/W θJC(bot) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 6: Electrical Characteristics

    Overcurrent protection trip level OCP Deglitch time µs Overcurrent protection period 1.35 Thermal shutdown temperature Die temperature °C (1) Internal dead time. External implementation is not necessary. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 7: Typical Characteristics

    10 20 30 40 50 60 70 80 10.8 Temperature (ƒC) V VM (V) C003 C004 Figure 3. R (HS + LS) Figure 4. R (HS + LS) DS(on) DS(on) Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 8: Functional Block Diagram

    7 Detailed Description 7.1 Overview The DRV8833 device is an integrated motor driver solution for brushed DC or bipolar stepper motors. The device integrates two NMOS H-bridges and current regulation circuitry. The DRV8833 can be powered with a supply voltage from 2.7 to 10.8 V and can provide an output current up to 1.5-A RMS.
  • Page 9: Feature Description

    DRV8833 www.ti.com SLVSAR1E – JANUARY 2011 – REVISED JULY 2015 7.3 Feature Description 7.3.1 Fixed-Frequency PWM Motor Drivers DRV8833 contains two identical H-bridge motor drivers with current-control PWM circuitry. Figure 5 shows a block diagram of the circuitry. VCP, VINT...
  • Page 10 FETs in the bridge. This state is held until the beginning of the next fixed-frequency PWM cycle. If current control is not needed, the xISEN pins should be connected directly to ground. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 11 7.4 Device Functional Modes The DRV8833 is active unless the nSLEEP pin is brought logic low. In sleep mode, the H-bridge FETs are disabled (Hi-Z). The DRV8833 is brought out of sleep mode automatically if nSLEEP is brought logic high.
  • Page 12: Application Information

    8.2 Typical Application The two H-bridges in the DRV8833 can be connected in parallel for double the current of a single H-bridge. The internal dead time in the DRV8833 prevents any risk of cross-conduction (shoot-through) between the two bridges due to timing differences between the two bridges.
  • Page 13 Because power resistors are larger and more expensive than standard resistors, the common practice is to use multiple standard resistors in parallel, between the sense node and ground. This distributes the current and heat dissipation. 8.2.3 Application Curve Figure 8. Current Regulation Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 14: Power Supply Recommendations

    There is no specific sequence for powering up the DRV8833. The presence of digital input signals is acceptable before VM is applied. After VM is applied to the DRV8833, the device begins operation based on the status of the control pins.
  • Page 15: Layout

    10.2 Layout Example nSLEEP AIN1 2.2 µF AOUT1 AIN2 AISEN VINT AOUT2 AISEN BOUT2 .01 µF BISEN BOUT1 BIN2 10 µF BISEN nFAULT BIN1 Figure 10. Recommended Layout Example Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: DRV8833...
  • Page 16: Thermal Considerations

    10.4 Power Dissipation Power dissipation in the DRV8833 is dominated by the DC power dissipated in the output FET resistance, or . There is additional power dissipated due to PWM switching losses, which are dependent on PWM DS(ON) frequency, rise and fall times, and VM supply voltages.
  • Page 17: Device And Documentation Support

    TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection.
  • Page 18 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 8833PW DRV8833PWP ACTIVE HTSSOP RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 DRV8833 DRV8833PWPR ACTIVE HTSSOP 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 DRV8833 DRV8833PWR ACTIVE TSSOP 2000 RoHS &...
  • Page 19 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
  • Page 20 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS B0 W Reel Diameter Cavity Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE...
  • Page 21 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) *All dimensions are nominal Device Package Type Package Drawing Pins Length (mm) Width (mm) Height (mm) DRV8833PWPR HTSSOP 2000 356.0 356.0 35.0 DRV8833PWR TSSOP 2000 356.0 356.0 35.0 DRV8833RTYR 3000 367.0...
  • Page 22 PACKAGE MATERIALS INFORMATION www.ti.com 3-Jun-2022 TUBE T - Tube height L - Tube length W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins L (mm) W (mm) T (µm) B (mm) DRV8833PW TSSOP 10.2...
  • Page 23 PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE 0.1 C PIN 1 INDEX AREA 14X 0.65 4.55 NOTE 3 0.30 1.2 MAX 0.19 C A B NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15...
  • Page 24 EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE SYMM 16X (1.5) (R0.05) TYP 16X (0.45) SYMM 14X (0.65) (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X METAL UNDER SOLDER MASK SOLDER MASK METAL SOLDER MASK OPENING OPENING EXPOSED METAL...
  • Page 25 EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 16X (0.45) SYMM 14X (0.65) (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
  • Page 27 2.46 TYPICAL 1.75 4224559/B 01/2019 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice.
  • Page 28 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
  • Page 29 EXAMPLE STENCIL DESIGN PWP0016C PowerPAD TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE (2.46) BASED ON 16X (1.5) METAL COVERED 0.125 THICK BY SOLDER MASK STENCIL 16X (0.45) (R0.05) TYP (2.31) SYMM BASED ON 0.125 THICK STENCIL 14X (0.65) SYMM SEE TABLE FOR DIFFERENT OPENINGS...
  • Page 33 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated...

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