Table Of Contents - HP Deskpro EX Technical Reference Manual

CHAPTER 1 INTRODUCTION ..................................................................................................................
1.1 ABOUT THIS GUIDE ................................................................................................................1-1
1.1.1 USING THIS GUIDE ..........................................................................................................1-1
1.1.2 ADDITIONAL INFORMATION SOURCES .....................................................................1-1
1.2 MODEL NUMBERING CONVENTION ...................................................................................1-1
1.3 NOTATIONAL CONVENTIONS ..............................................................................................1-2
1.3.1 VALUES..............................................................................................................................1-2
1.3.2 RANGES..............................................................................................................................1-2
1.3.3 SIGNAL LABELS ...............................................................................................................1-2
1.3.4 REGISTER NOTATION AND USAGE .............................................................................1-2
1.3.5 BIT NOTATION .................................................................................................................1-2
1.4 COMMON ACRONYMS AND ABBREVIATIONS .................................................................1-3
CHAPTER 2 SYSTEM OVERVIEW ..........................................................................................................
2.1 INTRODUCTION .......................................................................................................................2-1
2.2 FEATURES AND OPTIONS ......................................................................................................2-2
2.2.1 STANDARD FEATURES...................................................................................................2-2
2.2.2 OPTIONS.............................................................................................................................2-3
2.3 MECHANICAL DESIGN............................................................................................................2-4
2.3.1 CABINET LAYOUTS.........................................................................................................2-5
2.3.2 CHASSIS LAYOUTS..........................................................................................................2-7
2.3.3 BOARD LAYOUT ..............................................................................................................2-9
2.4 SYSTEM ARCHITECTURE.....................................................................................................2-10
2.4.1 PROCESSORS...................................................................................................................2-12
2.4.2 CHIPSET ...........................................................................................................................2-14
2.4.3 SUPPORT COMPONENTS ..............................................................................................2-14
2.4.4 SYSTEM MEMORY.........................................................................................................2-15
2.4.5 MASS STORAGE .............................................................................................................2-15
2.4.6 SERIAL AND PARALLEL INTERFACES ......................................................................2-15
2.4.7 UNIVERSAL SERIAL BUS INTERFACE.......................................................................2-15
2.4.8 GRAPHICS SUBSYSTEM ...............................................................................................2-16
2.4.9 AUDIO SUBSYSTEM ......................................................................................................2-17
2.5 SPECIFICATIONS....................................................................................................................2-17
CHAPTER 3 PROCESSOR/MEMORY SUBSYSTEM.............................................................................
3.1 INTRODUCTION .......................................................................................................................3-1
3.2 PROCESSOR...............................................................................................................................3-2
3.2.1 CELERON PROCESSOR....................................................................................................3-2
3.2.2 PENTIUM III PROCESSOR ...............................................................................................3-3
3.2.3 PROCESSOR UPGRADING ..............................................................................................3-4
3.3 MEMORY SUBSYSTEM ...........................................................................................................3-5
3.4 SUBSYSTEM CONFIGURATION ............................................................................................3-8

TABLE OF CONTENTS

Compaq Deskpro EX Series of Personal Computers
First Edition - August 2000
Technical Reference Guide
iii