HP Deskpro EX Technical Reference Manual page 211

INDEX
I.
3D effects ...................................................... D-2
abbreviations .................................................. 1-3
AC97 link bus............................................... 5-26
Accelerated Graphics Port (AGP) ................ 4-10
acronyms......................................................... 1-3
AGP .............................................................. 4-10
Alert-On-LAN .............................................. 5-30
AOL.............................................................. 5-30
AOL requirements ............................... 5-31, 5-33
APIC............................................................. 4-16
APM BIOS support ...................................... 8-19
arbitration, PCI bus master ............................. 4-6
ASCII character set.........................................B-1
audio ............................................................. 5-24
audio controller (AC97) ............................... 5-26
audio subsystem............................................ 2-17
backplane........................................................ 2-7
battery replacement....................................... 4-23
BIOS, ROM.................................................... 8-1
blinking LED .................................................. 7-3
boot block ROM............................................. 8-2
cable lock...................................................... 4-34
CAS latency.................................................... 3-5
Celeron processor .........................2-12, 2-13, 3-2
chipsets ......................................................... 2-14
Client Management....................................... 8-12
CMOS........................................................... 4-23
CMOS, archive ............................................. 4-24
CMOS, clearing............................................ 4-23
CMOS, restoring........................................... 4-24
codec, audio.................................................. 5-27
Configuration Cycle........................................ 4-4
configuration cycle (PCI) ............................... 4-4
configuration memory................................... 4-23
configuration space (PCI) ............................... 4-5
Connector
AGP bus ................................................... 4-14
Audio, CD................................................. 5-25
audio, headphones out .............................. 5-24
audio, line in ............................................. 5-24
audio, line out ........................................... 5-24
Audio, Mic In ........................................... 5-24
Audio, Speaker ......................................... 5-25
diskette drive interface................................ 5-7
display (VGA monitor)................... 6-6, D-5, 5
IDE interface............................................... 5-3
IDE/diskette drive power ............................ 7-5
keyboard/pointing device interface........... 5-19
Multimedia Interface...................................E-6
parallel interface ....................................... 5-13
PCI bus ....................................................... 4-9
serial interface (RS-232)............................. 5-8
Universal Serial Bus interface .................. 5-23
cooling .................................................4-36, 4-37
core voltage ......................................3-2, 3-3, 7-7
DIMM............................................................. 3-5
DIMM detection ............................................. 8-5
DIMM support ..............................................
diskette drive interface.................................... 5-4
display modes ................................................ D-3
display modes, 815E-based............................. 6-4
DMA............................................................. 4-19
DMI .............................................................. 8-16
drive fault prediction..................................... 8-15
East Access keys...........................................C-10
Easy Access keyboards ...................................C-7
effects, 3D...................................................... D-2
EIDE interface ................................................ 5-1
Enhanced Parallel Port (EPP) ....................... 5-11
events, wake up............................................... 7-4
expansion card cage........................................ 2-7
Extended Capabilities Port (ECP) ................ 5-11
FC-PGA370 (package) ................................... 3-4
features, standard ............................................ 2-2
flash ROM ...................................................... 8-2
flip-chip package ............................................ 3-4
general purpose I/O ...................................... 4-39
GPIO...............................................3-2, 3-3, 4-39
I/O controller ............................................ 4-41
graphics card, NVIDIA M64 ..........................E-1
graphics card, NVIDIA Vanta LT ................. D-1
graphics subsystem ................................2-16, 6-1
graphics, 3D................................................... D-2
graphics, 815E-based...................................... 6-2
Hard drive activity indicator ......................... 4-42
Hub link bus.................................................... 4-7
I/O controller (LPC47B34x)......................... 4-40
I/O map ......................................................... 4-38
IDE interface................................................... 5-1
IDSEL............................................................. 4-4
8-15