Texas Instruments TPA2025D1 User Manual
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Texas Instruments TPA2025D1 User Manual

Audio power amplifier evaluation module
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TPA2025D1 Audio Power Amplifier Evaluation Module
This document describes the operation of the TPA2025D1 evaluation module that users may use to
evaluate the TPA2025D1 Audio Power Amplifier. Included are the TPA2025D1EVM schematic, board art,
and bill of materials.
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1.1
1.2
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2.1
2.2
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3.1
3.2
3.3
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TPA2025D1EVM Schematic
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TPA2025D1EVM Bill of Materials
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Introduction
This section provides an overview of the Texas Instruments (TI) TPA2025D1 audio power amplifier
evaluation module (EVM). It includes a brief description of the module and a list of specifications.
1.1

Description

The TPA2025D1 is a high-efficiency, class-D, audio power amplifier and an integrated boost converter. It
drives up to 2 W into a 4-Ω speaker from low supply voltages.
The TPA2025D1 audio power amplifier EVM is a complete, stand-alone audio amplifier. It contains the
TPA2025D1 WCSP (YZG) Class-D audio power amplifier with an integrated boost converter. All
components and the EVM are Pb-Free.
SLOU310 - September 2011
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Copyright © 2011, Texas Instruments Incorporated
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List of Figures
List of Tables
TPA2025D1 Audio Power Amplifier Evaluation Module
User's Guide
SLOU310 - September 2011
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Summary of Contents for Texas Instruments TPA2025D1

  • Page 1: Table Of Contents

    SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module This document describes the operation of the TPA2025D1 evaluation module that users may use to evaluate the TPA2025D1 Audio Power Amplifier. Included are the TPA2025D1EVM schematic, board art, and bill of materials.

  • Page 2: Tpa2025D1 Specifications

    Class-D amplifier without additional filtering.) Note that the user must provide the necessary resistors, R7 and R8 to complete the filters. The typical value for R7 and R8 is 1.0 kΩ. 5. The filtered output of the TPA2025D1 can be measured between test points FILT OUT– and FILT OUT+ 2.1.3...

  • Page 3: Boost Settings

    Working inductance decreases as inductor current increases. If the drop in working inductance is severe enough, it may cause the boost converter to become unstable, or cause the TPA2025D1 to reach its current limit at a lower output power than expected. Inductor vendors specify currents at which inductor values decrease by a specific percentage.

  • Page 4: Power Up

    Increase the inductance to reduce the ripple current. Note that making the inductance too large prevents the boost converter from responding to fast load changes properly. Typical inductor values for the TPA2025D1 are 2.2 μH to 4.7 μH.

  • Page 5: Reference

    FLT OUT- 4700pfd/50V 100K STANDOFF HARDWARE 0.5in 0.5in 0.5in 0.5in GND GND GND GND 0.5in 0.5in 0.5in 0.5in Figure 1. TPA2025D1EVM Schematic SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...

  • Page 6: Tpa2025D1Evm Pcb Layers

    Reference www.ti.com TPA2025D1EVM PCB Layers Figure 2. EVM Assembly Layer Spacer Figure 3. EVM Top Layer SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...

  • Page 7: Evm Layer

    Reference www.ti.com Figure 4. EVM Layer 2 Spacer Figure 5. EVM Layer 3 SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...

  • Page 8: Evm Bottom Layer

    Reference www.ti.com Figure 6. EVM Bottom Layer SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...

  • Page 9: Tpa2025D1Evm Bill Of Materials

    RDC=80mOHMS 2.3A DFE252012C ROHS MMSZ5235BT1 (0) DNP ZENER DIODE,6.8V,SMT SOD-123 FERRITE BEAD, 100 Ohms 4A 100MHz MPZ2012S101A FB1,FB2 445-1567-1 DIGI-KEY SM0805 ROHS SLOU310 – September 2011 TPA2025D1 Audio Power Amplifier Evaluation Module Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...
  • Page 10 COMPONENTS NOT ASSEMBLED R0603_DNP R7, R8 C0603_DNP C4, C6 Place Shunts Only On Pin2 of JP SE and on Pin3 of AGC TPA2025D1 Audio Power Amplifier Evaluation Module SLOU310 – September 2011 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated...
  • Page 11 Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards.
  • Page 12 Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization.
  • Page 13 FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
  • Page 14 Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp...
  • Page 15 FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated...
  • Page 16 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.

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