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Summary of Contents for Congatec COM Express conga-TS570
- Page 1 COM Express™ conga-TS570 11th Generation Intel® Core™ i7, i5, i3, Celeron and Xeon processor with either QM580E, HM570E, or RM590E Chipset User’s Guide Revision 0.1 (Preliminary)
- Page 2 Revision History Revision Date (yyyy-mm-dd) Author Changes 2022-02-14 • Preliminary release Copyright © 2022 congatec GmbH TSTLm01 2/72...
- Page 3 DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software. OEM/ CGUTL BIOS BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You can find the specific details at https://www.congatec.com/en/licenses/.
- Page 4 The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice. congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing.
- Page 5 Copyright © 2022, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted without written permission from congatec GmbH. congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is supplied “as-is”.
- Page 6 (c) arising from course of performance, course of dealing, or usage of trade. congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause.
- Page 7 GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities and drivers, which have been made available to assist you.
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Page 8: Table Of Contents
Power Management ..............35 Supported Operating Systems ..........15 Mechanical Dimensions ............16 Additional Features ..............36 Supply Voltage Standard Power ..........16 congatec Board Controller (cBC) ..........36 2.4.1 Electrical Characteristics ............17 6.1.1 Board Information ..............36 2.4.2 Rise Time ................. - Page 9 BIOS Setup Description ............71 10.1 Navigating the BIOS Setup Menu ........... 71 10.2 BIOS Versions................71 10.3 Updating the BIOS ..............72 10.3.1 Updating from External Flash ..........72 10.4 Supported Flash Devices ............72 Copyright © 2022 congatec GmbH TSTLm01 9/72...
- Page 10 Table 33 Rapid Shutdown Signal Descriptions ........66 Table 34 Thermal Protection Signal Descriptions ........66 Table 35 SMBus Signal Description ............66 Table 36 General Purpose Serial Interface Signal Descriptions ....67 Copyright © 2022 congatec GmbH TSTLm01 10/72...
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Page 11: Introduction
Simply unplug one module and replace it with another; no redesign is necessary. Copyright © 2022 congatec GmbH TSTLm01... -
Page 12: Options Information
® ® ® TSN/TCC TSN/TCC TSN/TCC Intel ® TSN/TCC Processor TDP (cTDP down) 25 W 25 W 25 W Compatible Carrier Board conga-TEVAL/COMe 3.0 Evaluation Carrier Board for COM Express Type 6 modules Copyright © 2022 congatec GmbH TSTLm01 12/72... -
Page 13: Table 3 Industrial Variants
Intel TSN/TCC TSN/TCC TSN/TCC TSN/TCC ® Processor TDP (cTDP down) 45 (35) W 45 (35) W 45 (35) W Compatible Carrier Board conga-TEVAL/COMe 3.0 Evaluation Carrier Board for COM Express Type 6 modules Copyright © 2022 congatec GmbH TSTLm01 13/72... -
Page 14: Specifications
GPIOs BIOS AMI Aptio V UEFI 2.6 firmware ® 32 MB serial SPI flash with congatec Embedded BIOS features Power ACPI 5.0a compliant with battery support. S5e mode (see section 6.1.7 “Enhanced Soft-Off State”) Management Deep Sx and Suspend to RAM (S3) -
Page 15: Supported Operating Systems
Module) as part of the UEFI firmware are not supported anymore. 2. For Windows 10 installation, we recommend a minimum storage capacity of 20 GB. congatec will not offer technical support for systems with less than 20 GB storage space. -
Page 16: Mechanical Dimensions
All dimensions in millimeter Supply Voltage Standard Power • 12V DC ± 5% The dynamic range shall not exceed the static range. 12.60V Absolute Maximum Dynamic Range 12.10V Nominal Static Range 11.90V 11.40V Absolute Minimum Copyright © 2022 congatec GmbH TSTLm01 16/72... -
Page 17: Electrical Characteristics
10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive. Power Consumption The power consumption values were measured with the following setup: • conga-TS570 COM • modified congatec carrier board • conga-TS570 cooling solution • Microsoft Windows 10 (64 bit) Note... -
Page 18: Table 5 Measurement Description
1.9 / 4.4 050715 2 x 4 GB Windows 10 Intel Xeon W-11155MLE 1.8 / 3.1 ® ® Note With fast input voltage rise time, the inrush current may exceed the measured peak current. Copyright © 2022 congatec GmbH TSTLm01 18/72... -
Page 19: Supply Voltage Battery Power
Storage: 5% to 95% Caution The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating temperature refers to any measurable spot on the heatspreader’s surface. Humidity specifications are for non-condensing conditions. -
Page 20: Block Diagram
CM246 Series SPI0 for Intel ® Xeon ® E Processor eSPI eSPI to LPC MGMNT eSPI congatec Board GPIOs GPIOs (8x) Controller I2C Bus Generation LID/SLEEP/FAN LID# / SLEEP# / FAN UART SER0/1 Copyright © 2022 congatec GmbH TSTLm01 20/72... -
Page 21: Cooling Solutions
Cooling Solutions congatec GmbH offers the cooling solutions listed in table 8 for the conga-TS570. The dimensions of the cooling solutions are shown in the sub-sections. All measurements are in millimeters. Table 8 Cooling Solution Variants Cooling Solution Part No. -
Page 22: Csa Dimensions
CSA Dimensions 96.6 44.89 61.08 M2.5 threaded standoff for threaded version ø2.7 non-threaded standoff for borehole version A (2 : 1) 2.7 TYP. Copyright © 2022 congatec GmbH TSTLm01 22/72... -
Page 23: Csp Dimensions
CSP Dimensions 44.89 61.08 M2.5 threaded standoff for threaded version ø2.7 non-threaded standoff for borehole version A (2 : 1) 2.7 TYP. Copyright © 2022 congatec GmbH TSTLm01 23/72... -
Page 24: Hsp Dimensions
HSP Dimensions 44.89 61.08 M2.5 x 11 threaded standoff for threaded version ø2.7 x 11 non-threaded standoff for borehole version Copyright © 2022 congatec GmbH TSTLm01 24/72... -
Page 25: Heatspreader Thermal Imagery
Heatspreader Thermal Imagery Copyright © 2022 congatec GmbH TSTLm01 25/72... -
Page 26: Connector Rows
• a 2 x8 link or a 1 x8 + 2 x4 link configuration as option • graphics or non-graphics PCI Express devices • lane reversal Note The PEG lanes can not be linked together with the PCI Express lanes in section 5.1.1 “PCI Express™”. Copyright © 2022 congatec GmbH TSTLm01 26/72... -
Page 27: Peg Link Configuraton
LANE LANE LANE LANE LANE LANE LANE Single Link (1x16 Link) Link 1 Double Links (2x8 Links) Link 1 Link 2 Triple Links (1x8 + 2x4 Links) Link 1 Link 2 Link 3 Copyright © 2022 congatec GmbH TSTLm01 27/72... -
Page 28: Display Interface
• up to 4096x2304 resolutions at 60 Hz • Audio formats such as AC-3 Dolby Digital, Dolby Digital Plus, DTS-HD, LPCM, 192 KHz/24 bit, 8 channel, Dolby TrueHD, DTS-HD Master Audio (Lossless Blu-Ray Disc Audio Format) Copyright © 2022 congatec GmbH TSTLm01 28/72... -
Page 29: Lvds/Edp
Tiger Lake H chipset does not natively support VGA interface. However, the conga-TS570 commercial variants support this interface ® by integrating a DisplayPort to VGA adapter chip. Note For VGA support on industrial variants, you need a customized conga-TS570 variant. Copyright © 2022 congatec GmbH TSTLm01 29/72... -
Page 30: Sata
The USB ports are configured in the BIOS setup menu to operate by default in Gen 1 mode. Before you change the default setting to Gen 2, ensure the carrier board is designed for Gen 2 operation. For Gen 2 design considerations, contact congatec technical support center. -
Page 31: Gigabit Ethernet
The conga-TS570 provides an HDA interface on the A–B connector. 5.1.9 LPC Bus The conga-TS570 offers the LPC bus through through an eSPI to LPC bridge. For information about the decoded LPC addresses, see section 9 “System Resources”. Copyright © 2022 congatec GmbH TSTLm01 31/72... -
Page 32: I²C Bus
5.1.10 I²C Bus The I²C bus is implemented through the congatec Board Controller and accessed through the congatec CGOS driver and API. The controller provides a fast-mode multi-master I²C bus that has the maximum I²C bandwidth. 5.1.11 GPIOs The conga-TS570 offers General Purpose Input/Output signals on the A–B connector. The GPIO signals are controlled by the congatec Board controller. - Page 33 The module is kept in reset as long as the PWR_OK is driven by carrier board hardware. The conga-TS570 PWR_OK input circuitry is implemented as shown below: +V12.0_S0 R1%47kS02 R1%10kS02 R1%1k00S02 To Module Power Logic PWR_OK R1%20k0S02 R1%4k75S02 TBC847 Copyright © 2022 congatec GmbH TSTLm01 33/72...
- Page 34 0.8 V when the 12 V is applied to the module. Actively driving PWR_OK high is compliant to the COM Express specification but this can cause back driving. Therefore, congatec recommends driving the PWR_OK low to keep the module in reset and tri-state PWR_OK when the carrier board hardware is ready to boot.
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Page 35: Power Management
S3 state, then the resume path will place system back into S3. S5e Power State The conga-TS570 features a congatec proprietary Enhanced Soft-Off power state. See section 6.1.7 “Enhanced Soft-Off State” for more information. Copyright © 2022 congatec GmbH... -
Page 36: Additional Features
Board Controller (cBC) The conga-TS570 is equipped with Microchip microcontroller. This onboard microcontroller plays an important role for most of the congatec embedded/industrial PC features. It fully isolates some of the embedded features such as system monitoring or the I²C bus from the x86 core architecture, which results in higher embedded feature performance and more reliability, even when the x86 processor is in a low power mode. -
Page 37: Power Loss Control
OEM BIOS Customization The conga-TS570 is equipped with congatec Embedded BIOS, which is based on American Megatrends Inc. Aptio UEFI firmware. The congatec Embedded BIOS allows system designers to modify the BIOS. For more information about customizing the congatec Embedded BIOS, refer to the congatec System Utility user’s guide CGUTLm1x.pdf on the congatec website at www.congatec.com or contact technical support. -
Page 38: Oem Default Settings
OEM POST Logo This feature allows system designers to replace the congatec POST logo displayed in the upper left corner of the screen during BIOS POST with their own BIOS POST logo. Use the congatec system utility CGUTIL 1.5.4 or later to replace/add the OEM POST logo. -
Page 39: Api Support (Cgos)
The architecture of the CGOS API driver provides the ability to write application software that runs unmodified on all congatec CPU modules. All the hardware related code is contained within the congatec embedded BIOS on the module. See section 1.1 of the CGOS API software developers guide, available on the congatec website. -
Page 40: Conga Tech Notes
3. To ensure that the TCC is active for only short periods of time, thus reducing the impact on processor performance to a minimum, use a properly designed thermal solution. The Intel ® Xeon, Core™ i7/i5/i3 and Celeron ® processor’s respective datasheet can provide you with more information about this subject. Copyright © 2022 congatec GmbH TSTLm01 40/72... -
Page 41: Processor Performance Control
Any of the following can set the upper limit of Intel Turbo Boost Technology on a given workload: ® • Number of active cores • Estimated current consumption • Estimated power consumption • Processor temperature Copyright © 2022 congatec GmbH TSTLm01 41/72... -
Page 42: Intel Virtualization Technology
VT-x) added hardware support in the processor to improve the ® ® ® ® virtualization performance and robustness. RTS Real-Time Hypervisor supports Intel VT and is verified on all current congatec x86 hardware. Note congatec supports RTS Hypervisor. Copyright © 2022 congatec GmbH TSTLm01 42/72... -
Page 43: Thermal Management
See section 7.1 “Adaptive Thermal Monitor and Catastrophic Thermal Protection” for more information. The congatec board controller supports active cooling solution. The board controller controls the fan’s speed based on the temperature readings of the CPU. This feature does not require ACPI OS support. The only software-controlled thermal trip point on conga-TS570 is the Critical Trip Point. -
Page 44: Sodimm Population Rules
– POST code “53” indicates that no memory module is detected. • Use same DIMMs (same part numbers) in channel 0 (top, upper slot and bottom slot). Mixing DIMMs in this channel will reduce the speed to 2933 Mhz. Copyright © 2022 congatec GmbH TSTLm01 44/72... -
Page 45: Table 11 Memory Population Compatibility
Bottom Slot Result Channel 0, DIMM 0 Channel 1, DIMM 0 Channel 0, DIMM 1 – – – – – – – – Boot error (POST Code 53) – Boot error (POST Code 53) Copyright © 2022 congatec GmbH TSTLm01 45/72... -
Page 46: Signal Descriptions And Pinout Tables
The table below describes the terminology used in this section. The PU/PD column indicates if a pull-up or pull-down resistor has been used. If the field entry area in this column for the signal is empty, then no pull-up or pull-down resistor has been implemented by congatec. -
Page 47: Connector Signal Descriptions
SATA2_TX- SATA3_TX- LVDS_A3+ LVDS_B3- SUS_S5# PWR_OK LVDS_A3- eDP_BKLT_EN/LVDS_BKLT_EN SATA2_RX+ SATA3_RX+ GND (FIXED) GND (FIXED) SATA2_RX- SATA3_RX- eDP_TX3+/LVDS_A_CK+ LVDS_B_CK+ BATLOW# eDP_TX3-/LVDS_A_CK- LVDS_B_CK- (S)ATA_ACT# HDA_SDIN2 eDP_AUX+/LVDS_I2C_CK eDP/LVDS_BKLT_CTRL HDA_SYNC HDA_SDIN1 eDP_AUX-/LVDS_I2C_DAT VCC_5V_SBY HDA_RST# HDA_SDIN0 GPI3 VCC_5V_SBY Copyright © 2022 congatec GmbH TSTLm01 47/72... - Page 48 PCIE_TX5+ PCIE_RX5+ A107 VCC_12V B107 VCC_12V PCIE_TX5- PCIE_RX5- A108 VCC_12V B108 VCC_12V GPI0 GPO1 A109 VCC_12V B109 VCC_12V PCIE_TX4+ PCIE_RX4+ A110 GND (FIXED) B110 GND (FIXED) Note Not connected Not supported Bootstrap signals Copyright © 2022 congatec GmbH TSTLm01 48/72...
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Page 49: Table 14 Connector C-D Pinout
PEG_TX8- DDI1_PAIR4+ RSVD GND (FIXED) GND (FIXED) DDI1_PAIR4- DDI1_PAIR0+ PEG_RX9+ PEG_TX9+ RSVD DDI1_PAIR0- PEG_RX9- PEG_TX9- RSVD RSVD RSVD RSVD DDI1_PAIR5+ DDI1_PAIR1+ DDI1_PAIR5- DDI1_PAIR1- PEG_RX10+ PEG_TX10+ GND (FIXED) GND (FIXED) PEG_RX10- PEG_TX10- DDI2_CTRLCLK_AUX+ DDI1_PAIR2+ Copyright © 2022 congatec GmbH TSTLm01 49/72... - Page 50 PEG_RX0+ PEG_TX0+ C107 VCC_12V D107 VCC_12V PEG_RX0- PEG_TX0- C108 VCC_12V D108 VCC_12V TYPE0# PEG_LANE_RV# C109 VCC_12V D109 VCC_12V PEG_RX1+ PEG_TX1+ C110 GND (FIXED) D110 GND (FIXED) Note Not connected Not supported Bootstrap signals Copyright © 2022 congatec GmbH TSTLm01 50/72...
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Page 51: Table 15 Pci Express Signal Descriptions (General Purpose)
O PCIE A PCI Express Gen2/3/4 compliant clock buffer chip must be PCIE_CLK_REF- and PCI Express Graphics Lanes used on the carrier board if the design involves more than one PCI Express device. Copyright © 2022 congatec GmbH TSTLm01 51/72... -
Page 52: Table 16 Pci Express Signal Descriptions (X16 Graphics)
PCIE_RX[16-31] + and - PEG_RX1+ PEG_RX1- PEG_RX2+ PEG_RX2- PEG_RX3+ PEG_RX3- PEG_RX4+ PEG_RX4- PEG_RX5+ PEG_RX5- PEG_RX6+ PEG_RX6- PEG_RX7+ PEG_RX7- PEG_RX8+ PEG_RX8- PEG_RX9+ PEG_RX9- PEG_RX10+ PEG_RX10- PEG_RX11+ PEG_RX11- PEG_RX12+ PEG_RX12- PEG_RX13+ PEG_RX13- PEG_RX14+ PEG_RX14- PEG_RX15+ C101 PEG_RX15- C102 Copyright © 2022 congatec GmbH TSTLm01 52/72... - Page 53 (see note below) Note This signal has special functionality during the reset process. It may bootstrap some basic important functions of the module. For more information refer to section 8.2 “Bootstrap Signals”. Copyright © 2022 congatec GmbH TSTLm01 53/72...
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Page 54: Table 17 Ddi Signal Description
Bootstrap signal (see note below). DP AUX- function if DDI2_DDC_AUX_SEL is no connect I/O DP 3.3 V Enable strap is already populated HDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high I/O OD 3.3 V Copyright © 2022 congatec GmbH TSTLm01 54/72... -
Page 55: Table 18 Tmds Signal Descriptions
TMDS differential pair O DP TMDS1_DATA0- Multiplexed with DDI1_PAIR2+ and DDI1_PAIR2- TMDS1_DATA1+ TMDS differential pair O DP TMDS1_DATA1- Multiplexed with DDI1_PAIR1+ and DDI1_PAIR1- TMDS1_DATA2+ TMDS differential pair O DP TMDS1_DATA2- Multiplexed with DDI1_PAIR0+ and DDI1_PAIR0- Copyright © 2022 congatec GmbH TSTLm01 55/72... - Page 56 8.2 “Bootstrap Signals”. 2. The conga-TS570 does not natively support TMDS. For TMDS support, a DP++ to TMDS converter (e.g PTN3360D) needs to be implemented on the carrier board. Copyright © 2022 congatec GmbH TSTLm01 56/72...
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Page 57: Table 19 Displayport (Dp) Signal Descriptions
EDID access 3.3 V DP enable strap already populated DP3_LANE3+ Uni-directional main link for the transport of isochronous streams and O DP DP3_LANE3- secondary data Multiplexed with DDI3_PAIR3+ and DDI3_PAIR3- Copyright © 2022 congatec GmbH TSTLm01 57/72... -
Page 58: Table 20 Embedded Displayport Signal Descriptions
AUX+ AC coupled off module eDP_AUX- eDP AUX- AC coupled off module eDP_HPD Detection of hot plug / unplug and notification of the link layer I 3.3 V PD 100 kΩ Copyright © 2022 congatec GmbH TSTLm01 58/72... -
Page 59: Table 21 Crt Signal Descriptions
DDC lines used for flat panel detection and control I/O 3.3 V PU 2k2 3.3V PU for LVDS support (default) LVDS_I2C_DAT DDC lines used for flat panel detection and control I/O 3.3 V PU 2k2 3.3V PU for LVDS support (default) Copyright © 2022 congatec GmbH TSTLm01 59/72... -
Page 60: Table 23 Serial Ata Signal Descriptions
USB 2.0 compliant. Backwards compatible to USB 1.1 USB7+ USB Port 7, data + or D+ USB 2.0 compliant. Backwards compatible to USB 1.1 USB7- USB Port 7, data - or D- USB 2.0 compliant. Backwards compatible to USB 1.1 Copyright © 2022 congatec GmbH TSTLm01 60/72... -
Page 61: Table 25 Usb 3.0 Signal Descriptions
Additional transmit signal differential pairs for the Superspeed USB data path USB_SSTX2- USB_SSRX3+ Additional receive signal differential pairs for the Superspeed USB data path USB_SSRX3- USB_SSTX3+ Additional transmit signal differential pairs for the Superspeed USB data path USB_SSTX3- Copyright © 2022 congatec GmbH TSTLm01 61/72... -
Page 62: Table 26 Gigabit Ethernet Signal Descriptions
The LINK1000# output is active during 2.5 Gb connection. The Intel i225-IT Ethernet controller supports 2.5 Gb mode at temperature range of -40°C to 70°C and 1 Gb mode at temperature range of -40°C to 85°C Copyright © 2022 congatec GmbH TSTLm01 62/72... -
Page 63: Table 27 High Definition Audio Link Signals Descriptions
GND on the carrier, eSPI mode is selected. This signal is pulled to a logic high on the module through a resistor. The carrier should only float this line or pull it low. Note The conga-TS570 does not support ESPI mode. Copyright © 2022 congatec GmbH TSTLm01 63/72... -
Page 64: Table 29 Spi Bios Flash Interface Signal Descriptions
This signal has special function during the reset process. For more information, see section 9.2 “Bootstrap Signals”. Pins are protected on the module by a series schotty diode. Therefore, pull-down resistor is required on the carrier board for proper logic level. Copyright © 2022 congatec GmbH TSTLm01 64/72... -
Page 65: Table 31 General Purpose I/O Signal Descriptions
Battery low input. This signal may be driven low by external circuitry to signal that the system I 3.3 VSB PU 10 kΩ battery is low, or may be used to signal some other external power-management event 3.3 VSB Copyright © 2022 congatec GmbH TSTLm01 65/72... -
Page 66: Table 33 Rapid Shutdown Signal Descriptions
I/O OD 3.3 VSB PU 2k2 3.3 VSB SMB_ALERT# System Management Bus Alert – active low input can be used to generate an I 3.3 VSB PU 2k2 3.3 VSB SMI# (System Management Interrupt) or to wake the system Copyright © 2022 congatec GmbH TSTLm01 66/72... -
Page 67: Table 37 Module Type Definition Signal Description
Types 1-6. A carrier can detect a R1.0 module by the presence of 12 V on this pin. R2.0 module Types 1-6 will no-connect this pin. Type 10 modules shall pull this pin to ground through a 4.7 kΩ resistor Copyright © 2022 congatec GmbH TSTLm01... -
Page 68: Table 38 Power And Gnd Signal Descriptions
C76, C80, C84, C87, C90, C93, C96, C100, C103, C110, D1, D2, D5, D8, D11, D14, D21, D31, D41, D51, D60, D67, D70, D73, D76, D80, D84, D87, D90, D93, D96, D100, D103, D110 Copyright © 2022 congatec GmbH TSTLm01 68/72... -
Page 69: Bootstrap Signals
2. No external DC loads or external pull-up or pull-down resistors should change the configuration of the signals listed in the above table. External resistors may override the internal strap states and cause the COM Express™ module to malfunction and/or cause irreparable damage to the module. Copyright © 2022 congatec GmbH TSTLm01 69/72... -
Page 70: System Resources
System Resources Copyright © 2022 congatec GmbH TSTLm01 70/72... -
Page 71: Bios Setup Description
Navigating the BIOS Setup Menu The BIOS setup menu shows the features and options supported in the congatec BIOS. To access and navigate the BIOS setup menu, press the <DEL> or <F2> key during POST. The right frame displays the key legend. Above the key legend is an area reserved for text messages. These text messages explain the options and the possible impacts when changing the selected option in the left frame. -
Page 72: Updating The Bios
AMI AptioEFI firmware on an onboard flash ROM chip. You can update the firmware with the congatec System Utility. The utility has five versions— UEFI shell, DOS based command line , Win32 command line, Win32 GUI, and Linux version.
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