Hewlett Packard Enterprise HPE ProLiant XL225n Gen10 Plus Maintenance And Service Manual
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Hewlett Packard Enterprise HPE ProLiant XL225n Gen10 Plus Maintenance And Service Manual

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HPE ProLiant XL225n Gen10 Plus Server Maintenance
and Service Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. Hewlett Packard
Enterprise assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products with
hazardous energy levels, and are familiar with the weight and stability precautions for rack installations.
Part Number: P26173-003
Published: November 2020
Edition: 3

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Summary of Contents for Hewlett Packard Enterprise HPE ProLiant XL225n Gen10 Plus

  • Page 1 HPE ProLiant XL225n Gen10 Plus Server Maintenance and Service Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products with hazardous energy levels, and are familiar with the weight and stability precautions for rack installations.
  • Page 2 Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

  • Page 3: Table Of Contents

    Contents Illustrated parts catalog......................6 Mechanical components.........................................6 Air baffle spare part.........................................6 DIMM-processor cooling loop mechanical spare parts........................6 Repair tool spare parts for the cooling loop..............................7 System components..........................................7 Server-to-DLC manifold interconnect tube set spare parts......................8 System board spare part...................................... 9 AMD EPYC 7002 Series processor spare parts............................9 Heatsink spare parts......................................10 DIMM-processor cooling loop spare part..............................
  • Page 4 Removing and replacing a transceiver..................................37 Removing and replacing a tube set....................................38 Removing and replacing the air baffle..................................39 Removing the air baffle...................................... 39 Replacing the air baffle.......................................39 Removing and replacing the primary riser board..............................40 Removing and replacing the secondary riser board............................41 Removing and replacing an expansion card................................44 Removing and replacing a storage controller cable............................46 Removing and replacing an OCP NIC 3.0 adapter...............................49...
  • Page 5 Pump-cold plate signal cabling: DIMM-processor cooling loop....................119 Specifications........................121 Environmental specifications......................................121 Limited system operating temperature requirements........................121 Mechanical specifications........................................121 Websites..........................122 Support and other resources....................123 Accessing Hewlett Packard Enterprise Support..............................123 Accessing updates..........................................123 Remote support.............................................124 Warranty information.........................................124 Regulatory information........................................124 Documentation feedback.........................................125...

  • Page 6: Illustrated Parts Catalog

    Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported spare parts information, see the Hewlett Packard Enterprise PartSurfer website: https://www.hpe.com/info/partssurfer Item Description DIMM release tool spare part DIMM bezel spare part...

  • Page 7: Repair Tool Spare Parts For The Cooling Loop

    Spare part number Drainer tube P37369-001 Flow meter P37372-001 Priming pump P37373-001 System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported spare parts information, see the Hewlett Packard Enterprise PartSurfer website: https://www.hpe.com/info/partssurfer Illustrated parts catalog...

  • Page 8: Server-To-Dlc Manifold Interconnect Tube Set Spare Parts

    Item Description Server-to-DLC manifold interconnect tube set spare parts System board spare part AMD EPYC 7002 Series processor spare parts Heatsink spare parts DIMM-processor cooling loop spare part Processor cooling loop spare part DIMM spare parts System battery spare part Power riser board spare part Node power button cable spare part Server coolant refill...

  • Page 9: System Board Spare Part

    For more information on the removal and replacement procedures, see Removing and replacing a tube set. System board spare part Customer self repair: optional Description Spare part number System board P25447-001 For more information on the removal and replacement procedures, see Removing and replacing the system board. AMD EPYC 7002 Series processor spare parts Customer self repair: optional Description...

  • Page 10: Heatsink Spare Parts

    Description Spare part number AMD EPYC 7402P processor, 2.80 GHz, 24C, 180 W P17337-001 AMD EPYC 7502P processor, 2.50 GHz, 32C, 180 W P17335-001 AMD EPYC 7702P processor, 2.00 GHz, 64C, 200 W P17333-001 This processor is only supported in DLC configurations. For more information on the removal and replacement procedures, see Removing and replacing a processor.

  • Page 11: System Battery Spare Part

    Description Spare part number 32 GB, dual-rank x4 PC4-3200AA-R P20503-001 32 GB, dual-rank x8 PC4-3200AA-R P20502-001 64 GB, dual-rank x4 PC4-3200AA-R P20504-001 128 GB, quad-rank x4 PC4-3200AA-L P20505-001 For more information on the removal and replacement procedures, see Removing and replacing a DIMM. System battery spare part Customer self repair: mandatory Description...

  • Page 12: Server Options

    For procedure on installing the server coolant refill in the CDU reservoir, see the HPE Apollo Rack Mount Coolant Distribution Unit User and Maintenance Guide (https://www.hpe.com/support/apollo-cdu-umg). Server options Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported spare parts information, see the Hewlett Packard Enterprise PartSurfer website: https://www.hpe.com/info/partssurfer...

  • Page 13: Mezzanine Card Spare Part For An Internal Usb Device

    Item Description Expansion card For more information on the removal and replacement procedures, see Removing and replacing an expansion card. Transceiver For more information on the removal and replacement procedures, see Removing and replacing a transceiver. OCP NIC 3.0 adapter For more information on the removal and replacement procedures, see Removing and replacing an OCP NIC 3.0 adapter.

  • Page 14: Primary Riser Board Spare Part

    Primary riser board spare part Customer self repair: optional Description Spare part number Primary riser board P25442-001 For more information on the removal and replacement procedures, see Removing and replacing the primary riser board. Storage controller cable spare parts Customer self repair: optional Description Spare part number •...

  • Page 15: Customer Self Repair

    Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement. There are two categories of CSR parts: Mandatory—Parts for which customer self repair is mandatory.
  • Page 16 Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre Mainteneur Agrée local. Service de garantie "pièces seules" Votre garantie limitée Hewlett Packard Enterprise peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par Hewlett Packard Enterprise ne sont pas facturées.
  • Page 17 Si, durante la fase de diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
  • Page 18 NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.
  • Page 19 Hewlett Packard Enterprise (ou fornecedores/parceiros da Hewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao cliente. Há duas categorias de peças CSR: •...
  • Page 20 Hewlett Packard Enterprise fornece as peças de reposição sem cobrar nenhuma taxa. No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
  • Page 21 Customer self repair...
  • Page 22 Customer self repair...
  • Page 23 Customer self repair...

  • Page 24: Removal And Replacement Procedures

    Removal and replacement procedures Safety considerations Before performing service procedures, review all the safety information. Electrostatic discharge Be aware of the precautions you must follow when setting up the system or handling components. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the system or component.

  • Page 25: Server Warnings And Cautions

    This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

  • Page 26: Preparation Procedures

    Improper grounding can cause electrostatic discharge. CAUTION: To avoid data loss, Hewlett Packard Enterprise recommends that you back up all server data before installing or removing a hardware option, or performing a server maintenance or troubleshooting procedure.

  • Page 27: Remove The Server Blank

    • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters standby mode. • Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode. This method forces the server to enter standby mode without properly exiting applications and the OS.

  • Page 28: Remove The Server

    Remove the server CAUTION: To avoid accidentally dropping the server, observe the following: • Always support the bottom of the server when removing and sliding it into the server bay. • Do not use the release lever as a handle to carry the server. Procedure 1.

  • Page 29: Remove The Node Cover

    6. Place the server on a flat, level work surface. Remove the node cover WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.

  • Page 30: Remove The Air Baffle

    Remove the air baffle CAUTION: For proper cooling, do not operate the server without the baffles, expansion slot covers, or blanks installed. Procedure 1. Power down the server. 2. If installed, disconnect the tube set. 3. Disconnect all peripheral cables from the server. 4.

  • Page 31: Remove The Primary Riser

    Remove the primary riser CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or riser cage is installed. Prerequisites Before you perform this procedure, make sure that you have the following items available: •...

  • Page 32: Remove The Secondary Riser

    Remove the secondary riser CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless either riser blank or the riser cage is installed. Prerequisites Before you perform this procedure, make sure that you have a T-10 Torx screwdriver available. Procedure 1.
  • Page 33 8. Do one of the following: If a cooling loop is installed, disconnect the pump-cold plate signal cables from the riser. • If necessary, remove the DIMM adjacent to the riser to access the pump-cold plate signal connectors. If the onboard SATA cable is attached to the riser, disconnect it from the system board. •...

  • Page 34: Install The Air Baffle

    Install the air baffle Procedure 1. Make sure that the airflow arrow marker on the air baffle points towards the processor socket 1. 2. Align the guides on the air baffle with the pin on the heatsink numbering pointer at one end, and the notch on the server tray at the other end.

  • Page 35: Install The Server

    Install the server CAUTION: To avoid accidentally dropping the server, observe the following: • Always support the bottom of the server when removing and sliding it into the server bay. • Do not use the release lever as a handle to carry the server. Procedure 1.

  • Page 36: Connect The Tube Set

    4. Connect all peripheral cables to the server. 5. If removed, connect the tube set. 6. Power up the server. Connect the tube set Procedure 1. Push the female connector (jack) to the male connector (plug). 2. Rotate the female connector clockwise until it is fully engaged. Power up the server The Apollo n2000 Gen10 Plus series chassis firmware initiates an automatic power-up sequence when the servers are installed.

  • Page 37: Removing And Replacing A Transceiver

    • Use a virtual power button selection through iLO 5. • Press and release the Power On/Standby button. When the server goes from standby mode to full power mode, the server power LED changes from amber to green. Removing and replacing a transceiver WARNING: Fiber-optic transceivers and fiber-optic cables connected to transceivers emit laser light that can damage your eyes.

  • Page 38: Removing And Replacing A Tube Set

    To replace the component, reverse the removal procedure. Removing and replacing a tube set IMPORTANT: The cooling loop is prefilled with server coolant and sealed by drip-free quick connectors. In the unlikely event of a spill or leak of server coolant from the cooling loop, follow the recommended procedure listed in Appendix II: Spill response of the HPE Apollo Rack Mount Coolant Distribution Unit User and Maintenance Guide (https:// www.hpe.com/support/apollo-cdu-umg).

  • Page 39: Removing And Replacing The Air Baffle

    Removing and replacing the air baffle Removing the air baffle Prerequisites CAUTION: For proper cooling, do not operate the server without the baffles, expansion slot covers, or blanks installed. Procedure 1. Power down the server. 2. If installed, disconnect the tube set. 3.

  • Page 40: Removing And Replacing The Primary Riser Board

    Removing and replacing the primary riser board CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.

  • Page 41: Removing And Replacing The Secondary Riser Board

    10. If present, disconnect all cables from the riser board. 11. Remove the primary riser screws (callout 1), and then remove the riser board (callout 2). To replace the component, reverse the removal procedure. Removing and replacing the secondary riser board CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.
  • Page 42 Remove the secondary riser. If installed, remove the expansion card from the secondary riser. 10. If present, disconnect all cables from the riser board. 11. Remove the interconnect receptacle bracket. Removal and replacement procedures...
  • Page 43 12. Remove the riser board screws. 13. Remove the riser board: a. To release the board from the bracket spools, slide the board towards the direction of the interconnect receptacle. b. Separate the board from the bracket. Removal and replacement procedures...

  • Page 44: Removing And Replacing An Expansion Card

    14. If attached, remove the storage controller cable from the riser board: a. Disconnect the controller cable from the SlimSAS port (callout 1). b. Release the controller cable from the clip (callout 2). To replace the component, reverse the removal procedure. Removing and replacing an expansion card CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.
  • Page 45 • To remove an expansion card from the primary riser, proceed to step 8. • To remove an expansion card from the secondary riser, proceed to step 9. 8. Remove an expansion card from the primary riser: a. Remove the primary riser. b.

  • Page 46: Removing And Replacing A Storage Controller Cable

    To replace the component, reverse the removal procedure. If the replacement expansion card ships with a full-height bracket, replace the bracket with a low-profile one before installing the card. Removing and replacing a storage controller cable Prerequisites Before you perform this procedure, make sure that you have the following items available: •...
  • Page 47 Procedure Power down the server. If installed, disconnect the tube set. Disconnect all peripheral cables from the server. Remove the server. Place the server on a flat, level work surface. Remove the node cover. If installed, remove the air baffle. Remove the secondary riser.
  • Page 48 12. Remove the riser board screws. 13. Remove the riser board: a. To release the board from the bracket spools, slide the board towards the direction of the interconnect receptacle. b. Separate the board from the bracket. Removal and replacement procedures...

  • Page 49: Removing And Replacing An Ocp Nic 3.0 Adapter

    14. Remove the controller cable from the riser board: a. Disconnect the controller cable from the SlimSAS port (callout 1). b. Release the controller cable from the clip (callout 2). To replace the component, reverse the removal procedure. Removing and replacing an OCP NIC 3.0 adapter CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.

  • Page 50: Removing And Replacing The Dimm Cover

    To replace the component, reverse the removal procedure. Removing and replacing the DIMM cover Prerequisites Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available. Procedure 1. Power down the server. 2. Disconnect the tube set. 3.

  • Page 51: Removing And Replacing A Dimm

    8. If you are removing a DIMM cover that is located on the side of the secondary riser,remove the riser. 9. Remove all DIMM covers: a. Press each side of the cover to release the latches (callout 1). b. Lift the cover off the DIMM bezel (callout 2). To replace the component, reverse the removal procedure.
  • Page 52 Procedure Power down the server. If installed, disconnect the tube set. Disconnect all peripheral cables from the server. Remove the server. Place the server on a flat, level work surface. Remove the node cover. If installed, remove the air baffle. Do one of the following: •...
  • Page 53 • In a DLC configuration with the DIMM-processor cooling loop, remove the following: ◦ DIMM release tool ◦ DIMM cover for the slot where the DIMM will be removed Removal and replacement procedures...
  • Page 54 If the DIMM-processor cooling loop is installed, use the shorter end of the DIMM release tool to open the DIMM slot latches. 10. Remove the DIMM. Removal and replacement procedures...

  • Page 55: Removing And Replacing A Heatsink

    To replace the component, reverse the removal procedure. For DIMM configuration information, see the HPE website (https://www.hpe.com/docs/amd-population-rules-Gen10Plus) Removing and replacing a heatsink Removing a heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
  • Page 56 7. Allow the existing heatsink to cool. 8. Remove the heatsink: CAUTION: To prevent mechanical damage or depositing oil on your hands or other contaminant to the heatsink contact surface, hold the heatsink only by the edge of its base plate. Do not touch the heatsink fins. CAUTION: Heatsink screws must be tightened and loosened in alternating sequence.

  • Page 57: Replacing A Heatsink

    Replacing a heatsink The heatsinks for processors 1 and 2 are not interchangeable. See the heatsink label to identify correct heatsink for the processor. Prerequisites Before you perform this procedure, make sure that you have the following items available: • T-20 Torx screwdriver •...

  • Page 58: Removing And Replacing The Processor Cooling Loop

    4. Install the air baffle. 5. Install the node cover. 6. Install the server. 7. Connect all peripheral cables to the server. 8. Power up the server. Removing and replacing the processor cooling loop Removing the processor cooling loop WARNING: To reduce the risk of personal injury from hot surfaces, allow the pump-cold plates to cool before touching them.
  • Page 59 Remove the node cover. Remove the air baffle between the pump-cold plates. Remove the primary riser. Remove the quick connector bracket from the primary riser: a. Remove the retainer bracket screw (callout 1). b. Remove the retainer bracket (callout 2). c.

  • Page 60: Replacing The Processor Cooling Loop

    15. Place the cooling loop on a flat work surface with the contact side of the pump-cold plates facing upward. Replacing the processor cooling loop Prerequisites Before you perform this procedure, make sure that you have the following items available: •...
  • Page 61 Install the quick connector bracket in the primary riser: a. Insert the quick connector bracket (callout 1). b. Install the retainer bracket (callout 2). c. Install the bracket screw (callout 3). Install the primary riser. Remove the thermal interface protective covers from the pump-cold plates of the new cooling loop. Install the pump-cold plates: CAUTION: To prevent thermal failure or component damage, do not move the pump-cold plates once the bottom of the plates touch the top of the processors.

  • Page 62: Removing And Replacing The Dimm-Processor Cooling Loop

    CAUTION: The pump-cold plate screws must be tightened and loosened in alternating sequence. Do not overtighten the screws as this might damage the system board or the processor socket. a. Position the pump-cold plates on top of the processors, ensuring that both cold plates are properly seated before securing the screws (callout 1).
  • Page 63 • T-10 Torx screwdriver • T-15 Torx screwdriver • Phillips No. 1 screwdriver Procedure Power down the server. Disconnect the tube set. Disconnect all peripheral cables from the server. Remove the server. Place the server on a flat, level work surface. Remove the node cover.
  • Page 64 Remove the secondary riser screws (callout 1), and then lift the riser off the system board (callout 2). At this point, the pump-cold plate signal cables are still connected to the secondary riser so lay the riser beside the server. 10.
  • Page 65 12. Remove all DIMM covers: a. Press each side of the cover to release the latches (callout 1). b. Lift the cover off the DIMM bezel (callout 2). 13. Allow the DIMM cold plates and the pump-cold plates to cool. 14.

  • Page 66: Replacing The Dimm-Processor Cooling Loop

    15. Place the cooling loop on a flat work surface with the contact side of the pump-cold plates facing upward. Replacing the DIMM-processor cooling loop Prerequisites Before you perform this procedure, make sure that you have the following items available: •...
  • Page 67 Install the quick connector bracket in the primary riser: a. Insert the quick connector bracket (callout 1). b. Install the retainer bracket (callout 2). c. Install the bracket screw (callout 3). Install the primary riser. Remove the thermal interface protective covers from the pump-cold plates of the new cooling loop. Install the DIMM-processor cooling loop: CAUTION: To prevent thermal failure or component damage, do not move the pump-cold plates once the bottom of the plates touch the top of the processors.
  • Page 68 CAUTION: The pump-cold plate screws must be tightened and loosened in alternating sequence. Do not overtighten the screws as this might damage the system board or the processor socket. a. Route the pump-cold plate signal cable for processor 1. b. Position the DIMM cold plates and pump-cold plates (callout 1). Make sure the pump-cold plates are properly seated on top of the processors.

  • Page 69: Removing And Replacing The Dimm Bezel

    11. Install the node cover. 12. Install the server. 13. Connect all peripheral cables to the server. 14. Connect the tube set. 15. Power up the server. Removing and replacing the DIMM bezel WARNING: To reduce the risk of personal injury from hot surfaces, allow the DIMM cold plates and pump-cold plates to cool before touching them.
  • Page 70 Remove the primary riser screws (callout 1), and then release the riser off the system board (callout 2). At this point, the DIMM-processor cooling loop is still secured on the system board so lay the riser beside the server. Remove the secondary riser screws (callout 1), and then lift the riser off the system board (callout 2). At this point, the pump-cold plate signal cables are still connected to the secondary riser so lay the riser beside the server.
  • Page 71 10. Remove all DIMM covers: a. Press each side of the cover to release the latches (callout 1). b. Lift the cover off the DIMM bezel (callout 2). 11. Allow the DIMM cold plates and pump-cold plates to cool. 12. Remove the DIMM-processor cooling loop: CAUTION: The pump-cold plate screws must be tightened and loosened in alternating sequence.
  • Page 72 13. Place the cooling loop on a flat work surface with the contact side of the pump-cold plates facing upward. 14. Remove the DIMM bezel: a. Remove the DIMM bezel screws (callout 1). Retain the screws for installing the new DIMM bezel. b.

  • Page 73: Removing And Replacing A Processor

    CAUTION: If installing a processor with a faster speed, update the system ROM before installing the processor. To download firmware and view installation instructions, see the Hewlett Packard Enterprise Support Center website. CAUTION: THE CONTACTS ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the socket or processor, do not touch the contacts.
  • Page 74 Do one of the following: Remove the heatsink. • Remove the processor cooling loop. • • Remove the DIMM-processor cooling loop. Use an alcohol wipe to remove the existing thermal grease from the heatsink or the pump-cold plates, and the processor. Allow the alcohol to evaporate before continuing.

  • Page 75: Replacing A Processor

    Replacing a processor CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server. Prerequisites • Determine if the new processor requires a specific system operating temperature. For more information, see the HPE website: https://www.hpe.com/support/xl225ngen10plus-thermal Identify the processor and socket components.
  • Page 76 Close the force frame: CAUTION: Do not overtighten the screws as this might damage the system board or the processor socket. a. Pivot the spring loaded force frame downward and hold it down (callout 1). b. Use a T-20 Torx screwdriver to tighten the captive screws in the sequence shown in the following image (callouts 2– When using a torque wrench to tighten the screws, apply a torque of 1.58 N-m (14 lbf-in).

  • Page 77: Removing And Replacing An Internal Usb Device

    Do one of the following: Install the heatsink. • Install the processor cooling loop. • • Install the DIMM-processor cooling loop. If removed, install the air baffle. Install the node cover. Install the server. Connect all peripheral cables to the server. If removed, connect the tube set.

  • Page 78: Removing And Replacing The Mezzanine Card For An Internal Usb Device

    To replace the component, reverse the removal procedure. Removing and replacing the mezzanine card for an internal USB device CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot. Do not bend or flex circuit boards when reseating components.

  • Page 79: Removing And Replacing The Power Riser Board

    8. Remove the mezzanine card: a. Loosen the card thumbscrew (callout 1). b. Push the latch away from the edge of the card (callout 2). c. Remove the mezzanine card from the system board (callout 3). To replace the component, reverse the removal procedure. Removing and replacing the power riser board CAUTION: Before replacing a DIMM, expansion card, or other similar PCA components due to a perceived hardware error, make sure first that the component is firmly seated in the slot.
  • Page 80 Prerequisites Before you perform this procedure, make sure that you have a T-15 Torx screwdriver available. Procedure 1. Power down the server. 2. If installed, disconnect the tube set. 3. Disconnect all peripheral cables from the server. 4. Remove the server. 5.

  • Page 81: Removing And Replacing The System Battery

    Removing and replacing the system battery WARNING: The server contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery that provides power to the real-time clock. If this battery is not properly handled, a risk of the fire and burns exists. To reduce the risk of personal injury: •...

  • Page 82: Removing And Replacing The System Board

    10. Install the node cover. 11. Install the server. 12. Connect all peripheral cables to the server. 13. If removed, connect the tube set. 14. Power up the server. Properly dispose of the old battery. For more information about proper battery disposal, contact an authorized reseller or a service provider.
  • Page 83 Place the server on a flat, level work surface. Remove the node cover. If installed, remove the air baffle. If installed, remove the heatsink numbering pointer. If the DIMM-processor cooling loop is installed, remove the DIMM covers. Removal and replacement procedures...
  • Page 84 10. Remove all DIMMs. 11. If installed, remove the mezzanine card. 12. Remove the power riser board. 13. Disconnect all cables from the expansion cards, riser boards, and the system board. 14. Remove the primary riser. 15. Remove the secondary riser. 16.
  • Page 85 18. Use an alcohol wipe to remove the existing thermal grease from the heatsink or the pump-cold plates, and the processor. Allow the alcohol to evaporate before continuing. 19. Use a T-20 Torx screwdriver to loosen the three captive screws in the sequence shown in the following image, and then pivot the force frame upward.
  • Page 86 21. Remove the system board screws. 22. Remove the system board: a. Slide the system board away from the I/O bracket (callout 1). b. Lift the secondary riser connector side of the system board off the server tray (callout 2). c.

  • Page 87: Replacing The System Board

    23. Remove the right OCP NIC adapter rail: a. Remove the rail screws (callout 1). b. Remove the rail from the system board (callout 2). Replacing the system board Prerequisites Before you perform this procedure, make sure that you have the following items available: •...
  • Page 88 • T-20 Torx screwdriver • 1.0 gm (0.5 ml) or two 0.5 gm (0.25 ml) of thermal grease Procedure Install the right OCP NIC adapter rail: a. Attach the rail to the system board (callout 1). b. Install the rail screws (callout 2). Install the spare system board: a.
  • Page 89 Install the system board screws. Install the DIMM bezel: a. Position the bezel around DIMM slots (callout 1). b. Install the screws (callout 2 and 3). Removal and replacement procedures...
  • Page 90 NOTE: The length of callout 3 screw is longer than callout 2 screws. Use a T-20 Torx screwdriver to loosen the three captive screws in the sequence shown in the following image, and then pivot the force frame upward. Remove the external cap: a.
  • Page 91 Install the processor: a. Hold the processor by its carrier handle and slide the processor into the rail frame until it engages with a click sound. b. Remove the pin field cover cap. CAUTION: To prevent the risk of damaging the pins in the processor socket, do not reinstall the pin field cover cap after removing it.

  • Page 92: Re-Entering The Server Serial Number And Product Id

    a. Pivot the spring loaded force frame downward and hold it down (callout 1). b. Use a T-20 Torx screwdriver to tighten the captive screws in the sequence shown in the following image (callouts 2– When using a torque wrench to tighten the screws, apply a torque of 1.58 N⋅m (14 lbf-in). Do one of the following: Install the heatsink.

  • Page 93: Removing And Replacing The Node Power Button Cable

    The following alert appears: The serial number is modified by qualified service personnel and must match the serial number located on the chassis. 4. Click OK. 5. Type the serial number and press Enter. 6. Select the Product ID field and press Enter. The following alert appears: Product ID is modified only by qualified personnel.
  • Page 94 Release the node power button cable from the left OCP NIC adapter rail. 10. Remove the node power button cable screw. Removal and replacement procedures...
  • Page 95 11. Using a small flat-bladed screwdriver, push the latches forward to pry the front end of the cable from the bracket. 12. Remove the node power button cable from its bracket. Removal and replacement procedures...

  • Page 96: Hpe Trusted Platform Module 2.0 Gen10 Plus Option

    If you suspect a TPM board failure, leave the TPM installed and remove the system board (remove the system board). Contact a Hewlett Packard Enterprise authorized service provider for a replacement system board and TPM module. Removal and replacement procedures...

  • Page 97: Troubleshooting

    Integrated Management Log Messages and Troubleshooting Guide for HPE ProLiant Gen10 and Gen10 Plus servers and HPE Synergy provides IML messages and associated troubleshooting information to resolve critical and cautionary IML events. To access troubleshooting resources for your product, see the Hewlett Packard Enterprise Information Library: • For Gen10 servers, see https://www.hpe.com/info/gen10-troubleshooting.

  • Page 98: Diagnostic Tools

    Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (https://www.hpe.com/info/qs). UEFI System Utilities The UEFI System Utilities is embedded in the system ROM. Its features enable you to perform a wide range of configuration activities, including: •...

  • Page 99: Secure Boot

    Using the System Utilities options described in the following sections. • • Using the iLO RESTful API to clear and restore certificates. For more information, see the Hewlett Packard Enterprise website (https://www.hpe.com/info/redfish). • Using the secboot command in the Embedded UEFI Shell to display Secure Boot databases, keys, and security reports.

  • Page 100: Ilo Service Port

    Prerequisites Embedded UEFI Shell is set to Enabled. Procedure 1. From the System Utilities screen, select Embedded Applications > Embedded UEFI Shell. The Embedded UEFI Shell screen appears. 2. Press any key to acknowledge that you are physically present. This step ensures that certain features, such as disabling Secure Boot or managing the Secure Boot certificates using third-party UEFI tools, are not restricted.

  • Page 101: Hpe Insight Remote Support

    For more information, see Insight Remote Support and Insight Online Setup Guide for ProLiant Servers and BladeSystem c- Class Enclosures on the Hewlett Packard Enterprise website. Insight Remote Support is available as part of Hewlett Packard Enterprise Warranty, HPE support services, or Hewlett Packard Enterprise contractual support agreement.

  • Page 102: Usb Support

    USB support Hewlett Packard Enterprise Gen10 and Gen10 Plus servers support all USB operating speeds depending on the device that is connected to the server. External USB functionality Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures.

  • Page 103: Component Identification

    Component identification Server node numbering 1U system: Server node numbering Server node orientation The server node cover facilitates smooth node entry and ejection from the bay. When installing the server into the bay, observe the correct node orientation. • Left side—The node cover must be facing down with the release lever on the top side of the bay. •...

  • Page 104: Selecting The Nic Port For The Ilo Interface

    Item Description USB 3.2 Gen 1 Type-A port NIC/shared iLO network port SUV port OCP 3.0 NIC adapter slot Information pull tab When the P2 secondary riser is installed, PCIe Gen4 devices installed in the riser will only operate in PCIe Gen3 speed (8 GT/s transfer rate). To specify the NIC port for the iLO interface, use the Network Options menu in the UEFI System Utilities.

  • Page 105: Rear Panel Leds And Button

    Item Description Default iLO account information QR code label Server serial number and the customer asset tag label Use a mobile device to scan the QR code label to display the server mobile product page (https://www.hpe.com/qref/ xl225ngen10plus). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting resources, and other useful product links.

  • Page 106: Front Panel Led Power Fault Codes

    Item Description Status Definition Do not remove LED Flashing white Do not remove the server. Removing the server might terminate the current operation and cause data loss. The server can be removed. NIC link LED Solid green Network link No network link NIC status LED Flashing green Network active...

  • Page 107: Dimm Slot Locations

    Item Description Mezzanine card connector System battery Secondary PCIe4 x16 riser connector 5 (P2) Secondary PCIe4 x8 (P1), x16 (P2) riser connector 4 SATA 6GB/s port Secondary riser connector 3 Secondary PCIe4 x16 riser connector 2 (P1) OCP NIC 3.0 slot (P1) Node power button cable connector TPM connector Primary PCIe4 x16 riser connector 1 (P1)
  • Page 108 AA = CAS 26-22-22 (for 3DS LRDIMM) DIMM type R = RDIMM (registered) L = LRDIMM (load reduced) For more information about product features, specifications, options, configurations, and compatibility, see the HPE DDR4 SmartMemory QuickSpecs on the Hewlett Packard Enterprise website (https://www.hpe.com/support/ DDR4SmartMemoryQS). Component identification...

  • Page 109: Processor And Socket Components

    Processor and socket components Item Description Pin field Rail frame Carrier frame Processor Force frame Captive screws (Torx T-20) System maintenance switch descriptions Position Default Function Off = iLO 5 security is enabled. On = iLO 5 security is disabled. Reserved Reserved Reserved...

  • Page 110: Riser Board Components

    For more information, see Secure Boot. Riser board components The HPE ProLiant XL225n Gen10 Plus Server supports both primary and secondary riser board options. These riser options support the installation of half-height, half-length (low profile) expansion cards. Primary riser board components...
  • Page 111 Item Description Riser interconnect receptacle Pump-cold plate signal connector for processor 2 Pump-cold plate signal connector for processor 1 Storage controller backup power connector Slot 2 PCIe4 x16 (16, 8, 4, 2, 1) This port is not used in this server. This port is not used in this server.

  • Page 112: Pcie4 Slot Description

    Item Description Pump-cold plate signal connector for processor 1 Storage controller backup power connector Slot 2 PCIe4 x16 (16, 8, 4, 2, 1) PCIe4 slot description Item Description Definition Each PCIe version corresponds to a specific data transfer rate PCI Express version between the processor and peripheral devices.

  • Page 113: Server-To-Dlc Manifold Interconnect Tube Set

    level by reducing the required fan speed. This energy saving leads to a more efficient facility cooling in the data center. This efficiency reduces the overall cooling costs while enabling higher density server deployment. The Direct Liquid Cooling System has three main components: •...

  • Page 114: Processor Cooling Loop Components

    Item Component Description Supply tube connector Delivers cooled liquid to the server. (blue) Return tube connector Returns heated liquid from the server to the heat exchanger in the CDU for heat (red) rejection into the facility liquid. Processor cooling loop components IMPORTANT: The cooling loop is prefilled with server coolant and sealed by drip-free quick connectors.
  • Page 115 Item Description DIMM release tool DIMM covers DIMM cold plates for the DIMM slots 5-8 Pump-cold plate for processor 2 DIMM bezels Pump-cold plate signal cables DIMM cold plates for the DIMM slots 1-4 Pump-cold plate for processor 1 Return loop Supply loop Return loop quick connector (red) Supply loop quick connector (blue)

  • Page 116: Cabling

    Cabling Cabling guidelines The cable colors in the cabling diagrams used in this chapter are for illustration purposes only. Most of the system cables are black. Observe the following guidelines when working with system cables. Before connecting cables • Note the port labels on the PCA components. Not all of these components are used by all systems: ◦...

  • Page 117: Node Power Button Cabling

    • Remove cables that are no longer being used. Retaining them inside the system can restrict airflow. If you intend to use the removed cables later, label and store them for future use. Node power button cabling Storage cabling Cabling...

  • Page 118: Onboard Sata Controller Cabling

    Onboard SATA controller cabling HPE Smart Array type-p controller cabling Cabling...

  • Page 119: Storage Controller Backup Power Cabling

    Storage controller backup power cabling Pump-cold plate signal cabling Pump-cold plate signal cabling: Processor cooling loop Item Description Orange Pump-cold plate signal cable for processor 1 Blue Pump-cold plate signal cable for processor 2 Pump-cold plate signal cabling: DIMM-processor cooling loop Cabling...
  • Page 120 Item Description Orange Pump-cold plate signal cable for processor 1 Blue Pump-cold plate signal cable for processor 2 Cabling...

  • Page 121: Specifications

    Specifications Environmental specifications Specification Value Temperature range — Operating 10°C to 35°C (50°F to 95°F) Nonoperating –30°C to 60°C (–22°F to 140°F) Relative humidity (noncondensing) — Operating 8% to 90% 28°C (82.4°F), maximum wet bulb temperature Nonoperating 5% to 95% 38.7°C (101.7°F), maximum wet bulb temperature All temperature ratings shown are for sea level.

  • Page 122: Websites

    Storage white papers and analyst reports https://www.hpe.com/storage/whitepapers For additional websites, see Support and other resources. Product websites HPE ProLiant XL225n Gen10 Plus Server product page https://www.hpe.com/servers/apollo2000 HPE ProLiant XL225n Gen10 Plus Server support page https://www.hpe.com/support/apollo2000gen10plus HPE ProLiant XL225n Gen10 Plus Server user documents https://www.hpe.com/info/apollo2000gen10plus-docs...

  • Page 123: Support And Other Resources

    • For live assistance, go to the Contact Hewlett Packard Enterprise Worldwide website: https://www.hpe.com/info/assistance • To access documentation and support services, go to the Hewlett Packard Enterprise Support Center website: https://www.hpe.com/support/hpesc Information to collect • Technical support registration number (if applicable) •...

  • Page 124: Remote Support

    Hewlett Packard Enterprise, which will initiate a fast and accurate resolution based on your product's service level. Hewlett Packard Enterprise strongly recommends that you register your device for remote support.

  • Page 125: Documentation Feedback

    Additional regulatory information Hewlett Packard Enterprise is committed to providing our customers with information about the chemical substances in our products as needed to comply with legal requirements such as REACH (Regulation EC No 1907/2006 of the European Parliament and the Council). A chemical information report for this product can be found at: https://www.hpe.com/info/reach...

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