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Table of Contents
Related Manuals for Renesas BP-272
Summary of Contents for Renesas BP-272
- Page 1 On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.
- Page 2 Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific”...
- Page 3 SH7058 Group BP-272 User System Interface Board HS7058ECB61H User’s Manual Renesas Microcomputer Development Environment System SuperH™ Family/SH7050 Series Rev.3.0 2004.03...
- Page 4 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.
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Page 5: Important Information
Renesas) pursues a policy of continuing improvement in design, performance, functions, and safety of the user system interface board. Renesas reserves the right to change, wholly or partially, the specifications, design, user's manual, and other documentation at any time without notice. -
Page 6: Limited Warranty
User system interface boards are wearing parts which Renesas will not repair or replace if damaged and/or worn through use. The foregoing shall constitute the sole remedy for any breach of Renesas’... - Page 7 This user's manual and user system interface board are copyrighted and all rights are reserved by Renesas. No part of this user's manual, all or part, may be reproduced or duplicated in any form, in hard-copy or machine-readable form, by any means available without Renesas’ prior written consent.
- Page 8 • READ this user's manual before using this user system interface board. • KEEP the user's manual handy for future reference. Do not attempt to use the user system interface board until you fully understand its mechanism. DEFINITION OF SIGNAL WORDS This is the safety alert symbol.
- Page 9 Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST. 1. Do not repair or remodel the emulator product by yourself for electric shock prevention and quality assurance.
- Page 10 Preface The HS7058ECB61H is a user system interface board that connects a user system for the SH7058 BP-272 package to the SH7058 E6000H emulator (HS7058EPH60H).
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Page 11: Table Of Contents
Section 1 Configuration...1 Section 2 Connection Procedures ...3 Connecting User System Interface Board to User System ... 3 2.1.1 Installing IC Socket... 3 2.1.2 Fastening IC Socket Connector... 6 Exchanging the Spacer of the EV-Chip Board... 7 Connecting User System Interface Board to EV-Chip Board ... 8 Recommended Dimensions for User System Mount Pad (Footprint) ... -
Page 12: Section 1 Configuration
Section 1 Configuration Figure 1 and table 1 show the configuration and components of the user system interface board for the BP-272 package. Please make sure you have all of these components when unpacking. EV-chip board Spacer Screws (M2 x 8 mm) - Page 13 Use a TQPACK256RD socket and CSPACK256Z202H01 (manufactured by Tokyo Eletech Corporation) for the BP-272 package IC socket and IC socket connector on the user system. Table 1 HS7058ECB61H Components No. Component Board IC socket Spacer Cover Screws (M2 x 8 mm)
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Page 14: Section 2 Connection Procedures
2.1.1 Installing IC Socket Install the socket for BP-272 packaged ICs on the user system. (1) Gently apply solder to the BGA pads of the user system. Be careful to keep the thickness of the solder within 100 to 150 m. Too much solder will cause short-circuiting of the pins. - Page 15 (4) Notes on soldering the IC socket a) The IC socket is larger than the actual IC package; therefore, refer to figure 4 for the installation of other components. b) Do not install components that occupy large volume close to the IC socket. Such components will prevent the convective flow of heat during reflow.
- Page 16 1. Never dip the IC socket in flux or use wash to clean the IC socket. This is because flux may remain inside the IC socket due to the IC socket’s structure. When using the IC socket with other DIP products, never clean the other DIP products with flux because the flux may enter the connector through the guide pins of the IC socket.
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Page 17: Fastening Ic Socket Connector
2.1.2 Fastening IC Socket Connector 1. Check the location of pin 1 before inserting. 2. Use a provided screwdriver. 3. Stop tightening when the force required to turn the screw becomes significantly greater than that needed when first tightening. If a screw is tightened too much, the screw head may break or an IC socket contact error may be caused by a crack in the IC socket solder. -
Page 18: Exchanging The Spacer Of The Ev-Chip Board
Exchanging the Spacer of the EV-Chip Board While the user system interface board is connected to the user system, force must not applied to the user system. Exchange the spacer (2.6MP x 10 mm) of the EV-chip board with another spacer (2.6MP x 25 mm) provided for the user system interface board. -
Page 19: Connecting User System Interface Board To Ev-Chip Board
Connecting User System Interface Board to EV-Chip Board Observe the precautions listed below. Failure to do so will result in a FIRE HAZARD and will damage the user system and the emulator product or will result in PERSONAL INJURY. The USER PROGRAM will be LOST. - Page 20 EV-chip board Figure 4 Connecting User System Interface Board to EV-Chip Board Connector No. EV-Chip Board Connector No. UCN1 UCN2 Board Board Connector No. UCN1 UCN2...
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Page 21: Recommended Dimensions For User System Mount Pad (Footprint)
Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of the actual chip's mount pad. -
Page 22: Dimensions For Ev-Chip Board And User System Interface Board
Dimensions for EV-Chip Board and User System Interface Board The dimensions for the EV-chip board and the user system interface board are shown in figure 6. Spacer Figure 6 Dimensions for EV-Chip Board and User System Interface Board 120.0 EV-chip board 100.0 84.0 50.0... -
Page 23: Resulting Dimensions After Connecting User System Interface Board
Resulting Dimensions after Connecting User System Interface Board The resulting dimensions, after connecting the user system interface board to the user system, are shown in figure 7. EV-chip board IC socket (Tokyo Eletech Corporation CSPACK256Z2021H01) User system Spacer ( 6.0) Unit: mm Tolerance: ±1.0 mm Figure 7 Resulting Dimensions after Connecting User System Interface Board... -
Page 24: Section 3 Verifying Operation
Section 3 Verifying Operation 1. Turn on the emulator according to the procedures described in the SH7058 E6000H Emulator User's Manual (HS7058EPH60HE). 2. Verify the user system interface cable connections by checking the pin states with the extended monitor and checking the bus states with the FILL command (emulator command). If an error is detected, recheck the soldered IC socket and the location of pin 1. - Page 25 To use the crystal oscillator mounted on the EV-chip board Install a crystal oscillator into the crystal oscillator terminals on the EV-chip board. Crystal oscillator terminals Figure 9 Installing the Clock Oscillator Enlarged view Crystal oscillator EV-chip board...
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Page 26: Section 4 Notice
The MCU cannot be installed directly into the IC socket provided for connecting this user system interface board. Before connecting any parts or cables, make sure that pin 1 on the both sides are correctly aligned. Do not apply excessive force to the user system interface board while it is connected to the user system. - Page 27 Publication Date: Rev.2.00, November 20, 2003 Rev.3.00, March 1, 2004 Published by: Sales Strategic Planning Div. Renesas Technology Corp. Edited by: Technical Documentation & Information Department Renesas Kodaira Semiconductor Co., Ltd. 2003, 2004 Renesas Technology Corp. All rights reserved. Printed in Japan.
- Page 28 SH7058 Group BP-272 User System Interface Board HS7058ECB61H User’s Manual 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8668 Japan REJ10B0088-0300H...