2.4
Recommended Dimensions for User System Mount Pad (Footprint)
Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system
with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo
Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of
the actual chip's mount pad.
Ø0.5
10
23.0 ± 0.03
21.3
1.0 x 19 = 19.0
1.0
Figure 5 Recommended Dimensions for Mount Pad
4-Ø1.3
Unit: mm
Through hole