Table of Contents
Advertisement
Protocol —
Speed —
Flow Control —
Indicators —
Interface —
Connectors —
Processor —
Memory —
Translations —
Controls —
Environment —
MTBF —
Enclosure —
Power —
Size —
Weight —
Card Rack Specifications
Size —
Weight —
Rack Power
Supply Specs —
Card Capacity —
1.0 Specifications
Asynchronous only
45.5 bps to 38.4 Kbps
Hardware, X-ON/X-OFF, ENQ/ACK
RXD and TXD for Ports A and B; Power
RS-232/CCITT V.24 configured as DTE
(2) DB9 female
Z-80 CPU
32K RAM
Maximum memory available for translations is 8K. 256 bytes or
less for each match string or substitution string. Formula: MEMORY USAGE =
TOTAL LENGTH OF ALL MATCH AND SUBSTITUTION STRINGS + 10
BYTES OVERHEAD PER TRANSLATION. EXAMPLE: CONVERT 10 16-
CHARACTER STRINGS TO 4-CHARACTER STRINGS 10*16 + 10*4 + 10*10
(OVERHEAD) = 300 BYTES
Reset
Operating Temperature: 32° to 113° F (0° to 45° C)
Storage Temperature: -44° to 158° F (-20° to 70° C)
Humidity: 0 to 95% noncondensing
58,000 hours for a ground-benign environment
High-impact plastic
115 VAC, 50-60 Hz, 95 mA, 11 watts or 230 VAC, 50-60 Hz, 48 mA, 11 watts
1.8"H x 5.5"W x 8.5"D (4.6 x 14.0 x 21.6 cm)
2 lb. (0.9 kg)
5.2"H x 19"W x 9.3"D (13.2 x 48.3 x 23.6 cm)
9.5 lb. (4.3 kg), without cards
Primary: 115 VAC/60 Hz model or 230 VAC/50 Hz model
Output: 16 volts center-tap AC, 3.125 amps
Rack holds up to 12 Cards.
CHAPTER 1: Specifications
3
Advertisement
Table of Contents
