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Chengdu Ebyte Electronic Technology Co.,Ltd.
10. Production Guidance
10.1 Reflow soldering temperature
Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Average ramp-down rate（Tp to Tsmax）
10.2 Reflow soldering curve
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Curve characteristics
Solder Paste
Min preheating temp.
Max preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time above liquid phase line
Peak temperature
Average ramp-down rate
E28-2G4T27SX User Manual
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
60-120 sec
3℃/second max
3℃/second max
183℃
60-90 sec
220-235℃
230-250℃
6℃/second max
6℃/second max
150℃
200℃
217℃
30-90 sec
16
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