10. Production Guidance
10.1
Profile Feature
Solder Paste
Preheat Temperature min
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time tL Maintained Above TL
Peak temperature Tp
Average ramp-down rate Tp to Tsmax
Curve characteristics
Tsmin
Min preheating temp.
Max preheating temp.
Average ramp-up rate
Liquid phase temp.
Time above liquid phase line
Average ramp-down rate
Solder Paste
Preheating time
Peak temperature
Sn-Pb Assembly
Pb-Free Assembly
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
60-120 sec
60-90 sec
220-
60-120 sec
30-90 sec
230-