Ber (Bit Error Rate) Is High; Production Guidance; Reflow Soldering Temperature - Ebyte E79-900DM2005S User Manual

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susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
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Please avoid using modules under too high or too low temperature.
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6.3 BER (Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
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channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
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The extension line and feeder quality are poor or too long, so the bit error rate is high;
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7.Production Guidance

7.1 Reflow Soldering Temperature

Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Average ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase
line
Peak temp.
Average ramp-down rate
Time to peak temperature
for 25℃
E79-900DM2005S User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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