Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E78-900M22S1A User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

Production guidance

5.

5.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Average ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature

5.2 Reflow soldering curve

Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase
line
Peak temp.
Average ramp-down rate
Time to peak temperature
for 25℃
E78-900M22S1A User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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