USB Port
LAN
Video Port
DIO Port
Audio
Expansion Bus
Environment & Mechanical
Operating Temp.
Storage Temp.
Relative Humidity
Vibration (with SSD)
Shock
Certifications
Patent No. (Taiwan)
Construction
Mounting
Weight
Dimensions
1.4 Power Consumption
Voltage
Power Status
S0 (
)
8.97A
Burn‐In Test
S0 (Idle)
3.73A
S3
0.32A
S5
0.27A
POE(120W)
23.39A
User's Manual
4 x USB 3.2 Gen 1x1 Ports
10 x RJ45 Ports for GbE (Optional 8 with M12 X coded connectors and 8 x
PoE total Max.120W)
3 x DP (Intel built‐in GPU), 2 x HDMI Ports (MXM graphics)
8 x DI (5~48VDC) and 4 x DO (5VDC, 100mA)
1 x Line‐out, 1 x Line‐in and 1 x Mic‐in
2 x Full Mini‐PCle Slots and 1 x Full Mini‐PCIe Slot w/ USB interface only for
WWAN sharing 2 x SIM Card Sockets with M.2 B Key 3042 slot
1x M.2 A‐E Key 2230 slot, 1 x M.2 B Key 3042 slot w/ 2 x SIM Card Sockets
for WWAN
‐40°C ~ 70°C w/ GTX 1650 (‐40ºC ~ 60ºC w/GTX 1060) w/0.6 m/S airflow
‐40°C ~ 80°C
10% RH – 90% RH (non‐condensing)
IEC60068‐2‐64, random, 2.5G@5~500Hz, 1hr/axis
MIL‐STD‐810G, Method 514.6, Procedure I, Cat.4, Operating
Operating: MIL‐STD‐810G, Method 516.6, Procedure I,
Trucks and semi‐trailers=15G (11ms) with SSD
CE, FCC Class A, E13, EN50155
M592609 ‐ Automatic SIM Card Detection
M565941 ‐ Thermal Cooling
M447854 ‐ Build‐in Battery
Aluminum Alloy
Wall‐mount
5300g (Barebone)
260(L) x 250(W) x 95(H) mm
Intel i9‐10900TE with GTX 1660
9V
80.73W
8.88A
33.57W
2.54A
2.8W
0.27A
2.43W
0.20A
210.51W
20.08A
Intel i9‐10900TE with GTX 1650
12V
24V
106.56W
4.31A
30.48W
1.36A
3.24W
0.21A
2.4W
0.20A
240.96W
9.94A
1.0 Product Introduction
48V
103.44W
2.06A
98.88W
32.64W
1.0A
48W
5.04W
0.11A
5.28W
4.8W
0.10A
4.8W
238.56W
4.68A
224.64W
Page 1-3