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Summary of Contents for Multitech mDot MTDOT-915 Series
- Page 1 mDot MTDOT Developer Guide...
- Page 2 Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage.
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Page 3: Table Of Contents
CONTENTS Contents Chapter 1 – Product Overview ..........................7 Overview ..................................7 What's New in Firmware Version 4.1 ........................... 7 Protected Settings Backup using OTP ......................... 7 LoRaWAN 1.0.4 Support and Regional Parameters RP2 1.0.3 ................. 7 FOTA Enhancements ..............................7 Changes to Wake Pin.............................. - Page 4 CONTENTS Battery Draw Down..............................27 Electrical and Timing Characteristics ........................28 Pin Information ................................29 SPI Flash ..................................30 Pull-Up/Down................................31 LoRa................................... 31 Crystals/Oscillator ..............................32 Route Pads ................................32 mDot Pinout Design Notes............................33 Serial Pinout Notes..............................33 LoRa .................................... 33 Throughput Rates..............................
- Page 5 CONTENTS Chapter 9 – Environmental Notices........................44 Waste Electrical and Electronic Equipment Statement ....................44 WEEE Directive................................44 Instructions for Disposal of WEEE by Users in the European Union ................ 44 REACH Statement ............................... 44 Registration of Substances............................44 Restriction of the Use of Hazardous Substances (RoHS) .................... 45 Information on HS/TS Substances According to Chinese Standards .................
- Page 6 CONTENTS Assembly Diagrams and Schematics ........................... 67 Assembly Diagrams ..............................67 Schematics ................................68 Chapter 16 – Chapter 14 Design Considerations..................... 73 Noise Suppression Design ............................73 PC Board Layout Guideline ............................73 Electromagnetic Interference ............................ 73 Electrostatic Discharge Control........................... 74 USB Design .................................
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Page 7: Chapter 1 - Product Overview
PRODUCT OVERVIEW Chapter 1 – Product Overview Overview The MultiConnect mDot is a programmable, long-range RF module that provides encrypted data connectivity to ™ sensors, industrial equipment, and remote appliances. By using LoRa Long Range Spread Spectrum technology, bi- directional data communication can be maintained for distances up to 5 miles/8 km line of sight, deep into buildings, or within noisy environments using unlicensed ISM bands. -
Page 8: Documentation Overview
The platform includes a standards-based C/C++ SDK, a microcontroller HDK, and supported development boards, an online compiler and online developer collaboration tools. Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's Conduit (MTCDT) with an MTAC-LORA accessory card installed. Programming the mDot Microcontroller With the mDot and the MTUDK2-ST-xx developer board, use the ARM mbed ecosystem to program the microcontroller. -
Page 9: General Mbed Links
PRODUCT OVERVIEW On the mDot mbed page, MultiTech supplies source code for non-RF portions of the mDot and MTAC-LORA cards. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries. MultiTech offers both development and stable release versions of the library. -
Page 10: Differential And Compressed Upgrade Files
PRODUCT OVERVIEW Redundancy In case of data loss or corruption, your device stores multiple copies of the configuration and can fall back to the last good copy. Wear Leveling Wear leveling writes across the entire flash sector and skips bad sections on write failure. Frequently saved session parameters have more flash space available to extend the expected life of the flash system on your device. - Page 11 PRODUCT OVERVIEW Product Description Quanity to Order MTDOT-915-AU-M1-UFL AU 915 MHz SMT LoRa U.FL 1 or 100 MTDOT-915-AU-M1-TRC AU 915 MHz SMT LoRa RF Pad 1 or 100 Developer Kits MTUDK2-ST-MDOT mDot Developer Kit MTMDK-ST-MDOT mDot Micro Developer Kit Note: The complete product code may end in .Rx.
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Page 12: Chapter 2 - Getting Started
GETTING STARTED Chapter 2 – Getting Started Getting started depends on what you want to do. By default, mDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate mDot AT Command Reference Guide. To send commands to the mDot: Mount the mDot on the developer board. -
Page 13: Chapter 3 - Fota (Fuota) Overview
FOTA (FUOTA) OVERVIEW Chapter 3 – FOTA (FUOTA) Overview ® This requires mDot firmware Version 3.1 or higher and a Conduit with AEP (mPower) 1.6 or higher. Firmware Over the Air (FOTA) also known as Firmware Upgrade Over the Air (FUOTA) is a way to upgrade Dot end devices using multicast and file fragmentation packages defined in the LoRaWAN specification. - Page 14 FOTA (FUOTA) OVERVIEW Fragmentation setup is downlinked to the device. Device sends a fragmentation setup response from device. Fragmentation During this stage, the device should only send uplinks as necessary, too many can cause excessive fragment loss. Applications on the device should not perform heavy processing activities during FOTA. Doing so can cause fragments to overlap and excessive fragment loss.
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Page 15: Potential Problems
If AT+SLEEP is used during the FOTA session, the Dot will miss packets and the session will likely fail. The FOTA session sends down packets every 1.5 seconds (assuming no duty cycle) and parity packets every 3 seconds by default. For best results, Multitech recommends users suspend all normal Dot operations until the FOTA session is complete. -
Page 16: Troubleshooting Fota On The Conduit
FOTA (FUOTA) OVERVIEW Troubleshooting: If the Dot misses too many packets, the FOTA session cannot be completed. If the Dot was able to reconstruct the file using parity fragments, it sends a CRC check to the Conduit. Check the Dot debug log for Sending CRC. If the Dot does not receive a response or the Conduit responds with CRC not correct, the Dot discards the file. - Page 17 FOTA (FUOTA) OVERVIEW Also send 'rm -r -f ~/.fota/'. Devices may be in Class C or Class A depending on the FOTA session status before it ended. Make sure to change the devices back to their appropriate class. Make sure the FOTA daemon is running by '/etc/init.d/fotad restart'.
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Page 18: Chapter 4 - Mechanical Drawings With Pinouts
MECHANICAL DRAWINGS WITH PINOUTS Chapter 4 – Mechanical Drawings with Pinouts MTDOT-xxx-X1P-SMA mDot MTDOT Developer Guide... -
Page 19: Mtdot-Xxx-X1-Sma
MECHANICAL DRAWINGS WITH PINOUTS MTDOT-xxx-X1-SMA mDot MTDOT Developer Guide... -
Page 20: Mtdot-Xxx-X1-Ufl
MECHANICAL DRAWINGS WITH PINOUTS MTDOT-xxx-X1-UFL mDot MTDOT Developer Guide... -
Page 21: Mtdot-Xxx-M1-Ufl
MECHANICAL DRAWINGS WITH PINOUTS MTDOT-xxx-M1-UFL mDot MTDOT Developer Guide... -
Page 22: Mtdot-Xxx-M1-Trc
MECHANICAL DRAWINGS WITH PINOUTS MTDOT-xxx-M1-TRC mDot MTDOT Developer Guide... -
Page 23: Chapter 5 - Specifications And Pin Information
SPECIFICATIONS AND PIN INFORMATION Chapter 5 – Specifications and Pin Information MTDOT Specifications Category Description General Compatibility LoRaWAN 1.0.4 specifications Interfaces Note that pin functions are multiplexed. Up to 21 digital I/O Up to 11 analog inputs UART (RX, TX, RTS, CTS) CPU Performance STM32 Max Clock... - Page 24 SPECIFICATIONS AND PIN INFORMATION Category Description Certifications and Compliance EMC Compliance EN 300 220-2 V2.4.1:2012 EN 301 489-03 V1.6.1:2013 Radio Compliance FCC 15.247:2015 FCC 15.109:2015 FCC 15.107:2015 RSS 247:2015 ICES-003:2012 CISPR 22:2008 EN 300 220-2 V2.4.1:2012 Safety Compliance UL 60950-1 2nd ED cUL 60950-1 2nd ED IEC 60950-1 2nd ED AM1 + AM2 AS/NZS 60950.1...
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Page 25: Lora Transmission Output Power
SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America/Australia Typical EMEA Typical Sensitivity Sensitivity -116 dBm -124 dBm -119 dBm -127 dBm -122 dBm -130 dBm -125 dBm -133 dBm Not Applicable -135 dBm Not Applicable -137 dBm Using the Pulse Electronics W1063 antenna, described in the Chapter 4, Antennas. - Page 26 SPECIFICATIONS AND PIN INFORMATION Power Frequency On Power-up (dBm) 18 Hours After Bandwidth Power-up (dBm) 923.3 MHz 26.58 25.88 500 kHz 925.1 MHz 26.76 26.34 500 kHz 927.5 MHz 27.22 26.8 500 kHz mDot MTDOT Developer Guide...
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Page 27: Battery Draw Down
SPECIFICATIONS AND PIN INFORMATION Battery Draw Down mDot battery life depends on many variables, including transmit power, data rate, sleep usage, and duty cycle. The following figure represents the current consumption in one possible application. Use the current consumption values from the following Electrical Characteristics table when calculating average power consumption. -
Page 28: Electrical And Timing Characteristics
SPECIFICATIONS AND PIN INFORMATION Electrical and Timing Characteristics Note: All measurements taken at VDD = 3.3 V and 25 degrees Celsius ambient temperature unless otherwise specified. Refer to the ST Micro STM32F411RE datasheet for more detailed processor IO characteristics. The STM32F411RE and other onboard ICs are powered by an internal 3.0V voltage regulator. Signal Description Conditions... -
Page 29: Pin Information
SPECIFICATIONS AND PIN INFORMATION Pin Information Note: Using the mbed platform with the Cortex-M4 processor expands your pin functionality options. mDot MTDOT Developer Guide... -
Page 30: Spi Flash
SPECIFICATIONS AND PIN INFORMATION mDot Pin STM32411 (Where SW Name Notes applicable) 3.3 V to 5 V input UART_TX GPIO UART_RX GPIO SPI1_MISO NRST Reset nReset input I2C_SCL I2C clock I2C_SDA I2C Serial data PA12 GPIO PA11 SLEEPRQ GPIO VSSA/VSS_3/VSS_4 Ground for VCC SPI1_MOSI PA0-WKUP... -
Page 31: Pull-Up/Down
SPECIFICATIONS AND PIN INFORMATION Function Description PC_12 SPI3_MOSI SPI serial data PC_11 SPI3_MISO SPI serial data PC_10 SPI3_SCK SPI clock PC_6 SPI3_CS SPI chip select PC_7 FLASH_HOLD# Use the HOLD# signal to pause any serial communications with the device without deselecting the device PC_8 FLASH_WP#... -
Page 32: Crystals/Oscillator
SPECIFICATIONS AND PIN INFORMATION Crystals/Oscillator Description PC14 Real-time clock PC15 Real-time clock PH0-OSC_IN High speed system clock PH1-OSC_OUT High speed system clock Route Pads For U.FL models, use the U.FL connector or route pads as follows. These are also available on trace models. Pads Function Description... -
Page 33: Mdot Pinout Design Notes
SPECIFICATIONS AND PIN INFORMATION mDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. All pins that go to connectors are directly connected to the processor. Reset is the only pin with pull up. I/O is 5V tolerant. mDots allow you to program pins depending on your application: Serial: Available out of the box. - Page 34 SPECIFICATIONS AND PIN INFORMATION Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models TX Power TX Antenna Gain RX Sensitivity -120 -120 RX Antenna Gain Fade Margin Distance 8.14 Miles 5.41 Distance 13.08 8.70 RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm.
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Page 35: Resetting The Mdot
SPECIFICATIONS AND PIN INFORMATION Resetting the mDot To reset the mDot Drive the RESET signal low for at least T NRESET Select either: Allow RESET to float. The internal pull-up resistor pulls it up. Drive the RESET line high. The processor starts executing code after the RESET line is high. mDot MTDOT Developer Guide... -
Page 36: Chapter 6 - Antennas
U.FL connector. Use the RF pin for this connection. LoRa Antenna Manufacturer: Pulse Electronics Description: 868-928 MHz RP-SMA Antenna, 8" Model Number: W1063 MultiTech ordering information: Ordering Part Number Quantity AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA LoRa Antenna Specifications Category... -
Page 37: Oem Integration
ANTENNAS Category Description VSWR < 2.0 Gain 3.0 dBi Radiation Omni Polarization Vertical OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 3, Dec 2010; 7.1.2 and 7.1.3 FCC Grant Notes The OEM should follow all the grant notes listed below. -
Page 38: Chapter 7 - Safety Information
SAFETY INFORMATION Chapter 7 – Safety Information Handling Precautions To avoid damage due to the accumulation of static charge use proper precautions, such as an ESD strap, when handling any cellular device to avoid exposure to electronic discharge during handling and mounting the device. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment. -
Page 39: Interference With Pacemakers And Other Medical Devices
SAFETY INFORMATION Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted cardiac pacemakers and defibrillators from cellular devices. -
Page 40: User Responsibility
SAFETY INFORMATION Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with MultiTech's accessory specifications may invalidate the warranty. If the device is not working properly, contact MultiTech Technical Support. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. -
Page 41: Chapter 8 - Regulatory Information
Council Directive 2014/53/EU on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. MultiTech declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. The declaration of conformity may be requested at https://www.multitech.com/landing-... -
Page 42: Fcc Grant
US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS-210:2010) This device is open development based product that contains a sub GHz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 &... -
Page 43: Industry Canada
REGULATORY INFORMATION This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions: the device may not cause interference, and this device must accept any interference, including interference that may cause undesired operation of the device. -
Page 44: Chapter 9 - Environmental Notices
Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. -
Page 45: Restriction Of The Use Of Hazardous Substances (Rohs)
2015/863 of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS 3). These MultiTech products do not contain the following banned chemicals Lead, [Pb] < 1000 PPM Mercury, [Hg] <... -
Page 46: Information On Hs/Ts Substances According To Chinese Standards
ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. -
Page 47: Information On Hs/Ts Substances According To Chinese Standards (In Chinese)
ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依 依 照 照 中 中 国 国 标 标 准 准 的 的 有 有 毒 毒 有 有 害 害 物 物 质 质 信 信 息 息 根据中华人民共和国信息产业部... -
Page 48: Chapter 10 - Labels
Chapter 10 – Labels Approvals and Certification In most cases, when integrated and used with an antenna system that was part of the MultiTech modem certification, additional approvals or certifications are not required for the device you develop as long as the following are met. - Page 49 LABELS Example Australia Package Label Australia Device Label mDot MTDOT Developer Guide...
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Page 50: Chapter 11 - Developer Kit Overview
Chapter 11 – Developer Kit Overview Developer Board Overview MultiTech offers two Developer Kits for prototyping and developing with the mDot: MTUDK2-ST-MDOT is a scaled down version of the developer board and kit for the mDot. MTMDK-ST-MDOT is a mini developer board exclusively for the mDot. If using the Micro DK, go to Chapter 13 Micro Developer Kit for details on this developer board. -
Page 51: Chapter 12 - Board Components
BOARD COMPONENTS Chapter 12 – Board Components Developer Board mDot MTDOT Developer Guide... -
Page 52: Developer Board Connectors
BOARD COMPONENTS Developer Board Connectors Note: The development board derives power from the USB connection. The Power Jack connects to the Arduino shield socket. If the Arduino shield needs 5 V, use a 5 V power supply. A 9 V supply will not be regulated down to 5 V. -
Page 53: Led Indicators
BOARD COMPONENTS Label Description Arduino Shield Connector. Arduino Shield Connector. Arduino Shield Connector. Arduino Shield Connector. MTDOT Connector. MTDOT Connector. MTDOT Programming Header. CAUTION: Take care when connecting or disconnecting USB cables to avoid detaching the connector from the board. LED Indicators Label Location... -
Page 54: Chapter 13 - Chapter 11 Developer Board Installation
CHAPTER 11 DEVELOPER BOARD INSTALLATION Chapter 13 – Chapter 11 Developer Board Installation Installing an mDot on the Developer Board To install an mDot on the Developer Board: Align the mDot with the developer board as shown. Gently press the mDot into the connectors. mDot MTDOT Developer Guide... -
Page 55: Arduino Shield
CHAPTER 11 DEVELOPER BOARD INSTALLATION Arduino Shield mDot Arduino Pins Installing an Arduino Shield with an mDot Note: When using an Arduino Shield with an mDot, install the mDot on the developer board before installing the Arduino shield. To use an Arduino Shield with an mDot: Disable the developer card’s serial port by removing jumper from JP95. -
Page 56: Rsma To U.fl Cables
CHAPTER 11 DEVELOPER BOARD INSTALLATION RSMA to U.FL Cables The developer kit includes one 4.5" RSMA to U.FL cables which is preinstalled on the developer board. Connecting an Antenna through the Developer Board Connectors Depending on the device model, you can either connect antennas directly to the device or through the RSMA-to- U.FL antenna cable on the developer board. -
Page 57: Chapter 14 - Chapter 12 Developer Board Schematics
CHAPTER 12 DEVELOPER BOARD SCHEMATICS Chapter 14 – Chapter 12 Developer Board Schematics About Schematics The following schematics are for the fully populated MTUDK2 developer board and contain components not included on the MTUDK2-ST-MDOT model. mDot MTDOT Developer Guide... -
Page 58: Block Diagram
CHAPTER 12 DEVELOPER BOARD SCHEMATICS Block Diagram mDot MTDOT Developer Guide... -
Page 59: Schematics
CHAPTER 12 DEVELOPER BOARD SCHEMATICS Schematics mDot MTDOT Developer Guide... - Page 60 CHAPTER 12 DEVELOPER BOARD SCHEMATICS mDot MTDOT Developer Guide...
- Page 61 CHAPTER 12 DEVELOPER BOARD SCHEMATICS mDot MTDOT Developer Guide...
- Page 62 CHAPTER 12 DEVELOPER BOARD SCHEMATICS mDot MTDOT Developer Guide...
- Page 63 CHAPTER 12 DEVELOPER BOARD SCHEMATICS mDot MTDOT Developer Guide...
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Page 64: Chapter 15 - Chapter 13 Micro Developer Kit
CHAPTER 13 MICRO DEVELOPER KIT Chapter 15 – Chapter 13 Micro Developer Kit Micro Developer Kit Designed specifically for mDot development, the Micro DK plugs directly into a USB port on your computer making it easy to use the developer kit for testing, programming, and evaluating your application. Note: To work with the developer board, you need an X1P mDot model which includes a programming header. -
Page 65: Micro Dk Mechanical Drawings
CHAPTER 13 MICRO DEVELOPER KIT Micro DK Mechanical Drawings mDot MTDOT Developer Guide... -
Page 66: Micro Developer Board Components
CHAPTER 13 MICRO DEVELOPER KIT Micro Developer Board Components Note: The Reset Button resets the mDot processor. Description STAT LED1 Status, red light that blinks when device powers up. LED2 Communication, green light that shows when device is communicating. LED3 Power, blue lights when the board has power. RSSI LED4 Received Signal Strength Indicator. -
Page 67: Assembly Diagrams And Schematics
CHAPTER 13 MICRO DEVELOPER KIT Assembly Diagrams and Schematics Assembly Diagrams mDot MTDOT Developer Guide... -
Page 68: Schematics
CHAPTER 13 MICRO DEVELOPER KIT Schematics mDot MTDOT Developer Guide... - Page 69 CHAPTER 13 MICRO DEVELOPER KIT mDot MTDOT Developer Guide...
- Page 70 CHAPTER 13 MICRO DEVELOPER KIT mDot MTDOT Developer Guide...
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Page 73: Chapter 16 - Chapter 14 Design Considerations
CHAPTER 14 DESIGN CONSIDERATIONS Chapter 16 – Chapter 14 Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. -
Page 74: Electrostatic Discharge Control
Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers. -
Page 75: Appendix A - Appendix A Release Note Archive
APPENDIX A RELEASE NOTE ARCHIVE Appendix A – Appendix A Release Note Archive What's New in Firmware Version 4.0 The new release includes the following changes: Configuration Persistence Sleep FOTA Enhancements New and updated AT Commands Configuration Persistence To safeguard your configuration, the device offers configuration persistence in the form of configuration redundancy and wear leveling. -
Page 76: What's New In Firmware Version 3.3
APPENDIX A RELEASE NOTE ARCHIVE Added AT+CTO - Class C timeout 0-120s For an archive of release notes, go to Appendix A. What's New in Firmware Version 3.3 The new release includes the following changes: LoRaWAN Version 1.0.4 changes Pin Output changes New and updated AT Commands LoRaWAN Version 1.0.4 Changes MAX FCNT GAP check removed with mandatory 32-bit FCNT. -
Page 77: What's New In Firmware Version 3.2
APPENDIX A RELEASE NOTE ARCHIVE Changed AT+NA/NSK/DSK/DLC - support for modifying mulitcast sessions. Changed AT+BLS - Beacon lock status (includes setup example for a class B device). Changed AT+ACK – now accepts 0-15 as input. Changed AT&WP - Save Protected settings available in all firmware. Changed AT+DI - Protected DeviceEUI can be changed. -
Page 78: What's New In Firmware Version 3.1
APPENDIX A RELEASE NOTE ARCHIVE What's New in Firmware Version 3.1 The new release includes the following changes: Firmware over the Air Power Optimization Other Enhancements Firmware over the Air (FOTA) This release features a new AT command, +FOTA, for wireless firmware updates. When you deploy Release 3.1, FOTA will be enabled by default. -
Page 79: Listen Before Talk
APPENDIX A RELEASE NOTE ARCHIVE Listen Before Talk Listen before talk (LBT) is required in Japan and South Korea. This feature is automatically configured by the channel plan. For Japan, the AS923-1 has LBT enabled by default. For all other AS923-1 countries, LBT is disabled by default. For South Korea, KR920 has LBT enabled by default. -
Page 80: Index
INDEX Index schematics ESD ................74 Micro Developer Board .........67 EUI ...................9 antenna .................36 connecting ...............56 grant notes...............37 Arduino Shield...............55 FCC certification ............42 assembly diagrams FCC Notice Micro Developer Board..........67 Class B ..............41 firmware upgrade over the air........13 firmware upgrade troubleshooting ......15 FOTA.................13 15 battery draw down ............27 block diagram..............58... - Page 81 INDEX RoHS................45 RSMA to U.FL cable............56 maintenance ..............39 mbed ................8 mechanical drawings ........18 19 20 21 22 Micro Developer Board..........65 safety MTAC-LORA..............8 RF interference ............38 MTCDT................8 safety standards............73 MultiConnect ..............8 schematics..............59 SMA to U.FL..............56 specifications..............23 static................38 networking ..............9 STmicro processor............8 noise suppression............73 sécurité...
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