Table Of Contents; Servicing Notes - Sony HT-MT500 Service Manual

TABLE OF CONTENTS

1. SERVICING NOTES
2. DISASSEMBLY
2-1. Disassembly Flow ...........................................................
2-2. Grille Assy, HI-RES Label .............................................. 10
2-3. USB Cover ...................................................................... 10
2-4. Top Panel Block, Bottom Panel Block ........................... 11
2-5. Top Panel Assy Block ..................................................... 12
2-6. TOUCH Board ................................................................ 13
2-7. NFC Board ...................................................................... 14
2-8. Front Panel Block, Speaker Block .................................. 15
2-9. DISPLAY Board Block, Front Panel .............................. 16
2-10. Organic EL Indicator Element, DISPLAY Board ........... 17
2-11. Loudspeaker (L-ch, R-ch) ............................................... 18
2-12. BAR-AMP Board Block ................................................. 19
2-13. BAR-AMP Board ............................................................ 19
2-14. MB-1610 Board-1 ........................................................... 20
2-15. MB-1610 Board-2 ........................................................... 21
2-16. WLAN/BT Combo Card Block ...................................... 22
2-17. WLAN/BT Combo Card ................................................. 23
2-18. BTW Board ..................................................................... 24
2-19. USB-WSCHUKEI Board ............................................... 25
2-20. RF Modulator .................................................................. 26
3. TEST MODE
............................................................ 27
4. TROUBLESHOOTING
5. DIAGRAMS
5-1. Block Diagram - MAIN Section - ................................... 38
5-2. Block Diagram - AMP/HDMI Section - ......................... 39
5-3. Block Diagram
- PANEL/POWER SUPPLY Section - ............................ 40
5-4. Printed Wiring Board - MB-1610 Board (Side A) - ........ 42
5-5. Printed Wiring Board - MB-1610 Board (Side B) - ........ 43
5-6. Printed Wiring Board - BAR-AMP Board (Side A) - ..... 44
5-7. Printed Wiring Board - BAR-AMP Board (Side B) - ..... 45
5-8. Schematic Diagram - BAR-AMP Board (1/3) -.............. 46
5-9. Schematic Diagram - BAR-AMP Board (2/3) -.............. 47
5-10. Schematic Diagram - BAR-AMP Board (3/3) -.............. 48
5-11. Printed Wiring Board - USB-WSCHUKEI Board - ....... 49
5-12. Schematic Diagram - USB-WSCHUKEI Board - .......... 49
5-13. Printed Wiring Board - DISPLAY Board - ..................... 50
5-14. Schematic Diagram - DISPLAY Board - ........................ 50
5-15. Printed Wiring Board - BTW Board - ............................. 51
5-16. Schematic Diagram - BTW Board - ................................ 51
6. EXPLODED VIEWS
6-1. Overall Section ............................................................... 56
6-2. Top Panel Section ........................................................... 57
6-3. Speaker Section ............................................................... 58
6-4. BAR-AMP Board Section ............................................... 59
6-5. MB-1610 Board Section ................................................. 60
6-6. Bottom Panel Section ...................................................... 61
7. ELECTRICAL PARTS LIST
Accessories are given in the last of the electrical parts list.
.............................................
.......................................... 35
.............................. 62

SERVICING NOTES

The SERVICING NOTES contains important information for
servicing. Be sure to read this section before repairing the
unit.
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
9
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
ADVANCE PREPARATION WHEN CONFIRMING OP-
ERATION
All of the units included in the HT-MT500 (SA-MT500/SA-
WMT500/Remote control) or HT-MT501 (SA-MT501/SA-WMT501/
Remote control) are required to confi rming operation of SA-
MT500/MT501. Check in advance that you have all of the units.
NOTE OF PERFORMING THE OPERATION CHECK IN
THE STATE THAT HEAT SINK IS REMOVED
When performing the operation check in the state that this unit is
disassembled, it is possible to perform the operation check in the
state that heat sink is removed. However, don't perform the opera-
tion check in the long time, and perform the operation check in the
volume state as low as possible.
"PRTCT", "PUSH" AND "POWER" FLASH ALTER-
NATELY IN THE FRONT PANEL DISPLAY
Press (power) to turn off the
system. After the indicator
disappears, disconnect the AC power
cord (mains lead) and make sure
nothing is obstructing the ventilation
holes of the system.
HT-MT500/MT501
SECTION 1
3