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Infineon TLE4966 MS2GO Quick Start Manual
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Infineon TLE4966 MS2GO Quick Start Manual

Infineon TLE4966 MS2GO Quick Start Manual

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TLE4966 MS2GO
Quick Start
V1.0.0

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Summary of Contents for Infineon TLE4966 MS2GO

  • Page 1 TLE4966 MS2GO Quick Start V1.0.0...

  • Page 2: Document Contents

    Document Contents Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 3 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 4 The TLI4966 MS2GO Evaluationkit is a budgetary priced kit that › is enabling the evaluation of the TLE4966G lateral Hall latch and TLE4966V-1G vertical Hall latch. The TLE4966 MS2GO Evaluation kit is offered in one version › combining both sensors above mentioned. 2020-10-08...
  • Page 5 They provide a speed signal at Q2 for every magnetic pole pair and a direction information at Q1, which is provided before the speed signal. TLE4966G TLE4966V-1G 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 6 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 7 Evaluation board equipped with XMC1100 as target microcontroller, XMC4200 as debugger microcontroller, TLE4966G, TLE4966V-1G, TLI493D-W2BW as magnetic probe, auxiliary circuitry. – Ferrite block magnet FE-Q-07-07-05 for easy magnetic basic evaluation. – Paper container box 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 8 Content – Optional Mechanics TLE4966 MS2GO was designed to be compatible mechanical- › wise with Infineon Out-Of-Shaft 3D sensor control. The Out-Of- Shaft 3D sensor control is not included in the evaluation kit content, therefore has to be ordered separately.
  • Page 9 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 10 Use case 1: TLE4966 MS2GO–vertical placement – This use-case highlights the vertical Hall technology used in TLE4966V-1G sensor. – The magnet placement for this application is highlighted using as example the Out-Of-Shaft 3D Sensor control. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 11 Use case 2: TLE4966 MS2GO–lateral placement – This use-case highlights the lateral Hall technology used in TLE4966G sensor. – The magnet placement for this application is highlighted using as example the Out-Of-Shaft 3D Sensor control. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 12 PCB or to his own electrical setup. – In this use-case, the user loses connectivity to the 3D Sensor magnetic probe. – The side pin-header slots are directly connected to sensor outputs Cut across this line 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 13 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

  • Page 14: Pinout Description

    Pinout Description 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

  • Page 15: Hardware Description

    Hardware Description The TLE4966 MS2GO Evaluation Kit can be connected › directly to a PC via the micro-USB port (1). S1_Q1 S2_VDD S1_Q2 The TLE4966 MS2GO evaluation kit board consists of: › S2_Q2 S1_VDD S2_Q1 – One XMC4200 microcontroller running a SEGGER...
  • Page 16 Hardware design– schematic overview (1/2) 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 17 Hardware design – schematic overview (2/2) 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 18 Detailled schematic: Power supply 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 19 Detailled schematic: On-board Debugger 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 20 Detailled schematic: XMC1100 pins 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 21 Detailled schematic: Probe and PMOS 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 22 Detailled schematic: LEDs and connectors 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 23 Detailled schematic: Hall-sensors 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 24 Hardware design – layout Top layout & render Bottom layout & render 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 25 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 26 The installer is starting up by showing the ”Welcome” section. Please note that the software version can change over time with no notification. In order to proceed, please click ”Next”. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 27 “Licensing view”: in this view the user is prompted to read the license agreement and accept it. The “Next” button is only activated after accepting the license agreement by checking the highlighted box. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 28 Segger driver is mandatory. If you are certain that your Jlink Segger driver is newer than V6.56B, than you can close the installer pop-up launched by Segger Driver Installer. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 29 Evaluation Kit Software – Installation (4/6) “Confirm view”: in this view the user shall confirm the installation. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 30 Access Control (UAC) is providing installation permissions – therefore administration rights have to be provided. Please wait until the installation is finalized. Additional installation will be requested by Segger Jlink driver installer. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 31 Evaluation Kit Software – Installation (6/6) “Finish view”: the installation successfully finished. Press “Finish” button for closing the installer. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 32 Agenda Description Content Use-Cases Hardware description & design Software Installation Process Software features 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 33 USB cable. One XMC device should be discovered in your Device list. Press on the device in order to flash the correct firmware and to start the application. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 34 Q1(=Direction) and Q2(=Speed) of the lateral sensor synchronized with the 3D magnetic sensor readouts using the Z axis of the magnetic field. The readout is started by pressing “Start” button. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 35 Q1(=Direction) and Q2(=Speed) of the vertical sensor synchronized with the 3D magnetic sensor readouts using the X axis of the magnetic field. The readout is started by pressing “Start” button. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 36 The user may save the acquired set of data in CSV format for post-processing. 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.
  • Page 37 Evaluation Kit Software GUI – Explanatory Further explanation & hints can be discovered by pressing the “?” buttons 2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.