Sony HDCU3300 Maintenance Manual page 79
Hd camera control unit
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Also See for HDCU3300:
- Speci?cations (8 pages) ,
- Quick manual (52 pages) ,
- Installation manual (72 pages)
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CPU-395 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1206-292-A s MOUNTED CIRCUIT BOARD, CPU-395
4pcs
7-682-947-01 s SCREW +PSW 3X6
C1
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C2
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C3
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C4
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C5
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C6
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C7
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C8
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C9
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C11
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C12
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C13
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C14
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C15
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C16
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C17
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C18
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C19
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C20
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C21
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C22
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C23
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C24
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C25
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C26
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C27
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C28
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C29
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C30
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C31
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C32
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C33
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C34
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C35
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C36
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C37
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C38
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C39
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C40
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C41
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C42
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C43
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C44
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C45
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C46
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C47
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C48
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C101
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C102
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C103
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C104
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C105
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C106
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C107
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C108
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C109
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HDCU3300/MM (J,E)
(CPU-395 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C110
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C111
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C112
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C113
1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005
C114
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C115
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C118
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C119
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C120
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C121
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C124
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C125
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C126
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C127
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C128
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C129
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C130
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C131
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C132
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C133
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C135
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C136
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C137
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C138
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C139
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C140
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C141
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C142
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C143
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C144
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C146
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C147
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C148
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C150
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C151
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C152
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C153
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C154
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C155
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C157
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C160
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C161
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C162
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C163
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C164
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C301
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C302
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C303
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C304
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C305
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
4-35
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