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SDI OUTPUT EXPANSION UNIT HKCU1005 MAINTENANCE MANUAL 1st Edition (Revised 3) Serial No. 10001 and Higher : HDCU3300 (UC) Serial No. 30001 and Higher : HDCU3300 (J) Serial No. 40001 and Higher : HDCU3300 (CE) Serial No. 50001 and Higher : HDCU3300 (E3)
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The use of optical instruments with this product will increase eye hazard. For safety, do not connect the connector for peripheral device wiring that might have excessive voltage to the following port(s). : Ethernet connector Follow the instructions for the above port(s). HDCU3300/MM (J,E)
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Plastikbeutel. 5. Install the equipment while taking the operating temperature of the equipment into consideration For the operating temperature of the equipment, refer For the customers in Taiwan only to the specifications of the Operation Manual. 1 (P) HDCU3300/MM (J,E)
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Hävitä käytetty paristo valmistajan ohjeiden Remplacer uniquement avec une batterie du même mukaisesti. type ou d’un type équivalent recommandé par le constructeur. Mettre au rebut les batteries usagées conformément aux instructions du fabricant. 2 (P) HDCU3300/MM (J,E)
Beside this Installation Manual, the following manuals are available for the unit. . Operation Manual (Supplied with HDCU3300) This manual describes how to operate the HDCU3300. . Installation Manual (Available on request) This manual is intended for use by trained system and service engineers, and describes the information regarding the installation of the unit and the information that premises the service based on components replacement.
Installation Manual Section 3 “Menu Settings”.) * : Menu “C11” changes to “C12” when the EN-159 board is installed. AT-167S board/CR2032: Sony part number (1-528-174- Ensure that the battery is installed with + and _ poles connected to the correct terminals. An incorrect connection may cause an explosion or leakage of fluid.
Isolation surface (blue) the flexible card wire. Three types of different-shaped connectors are used in HDCU3300. (Type A to type C) Because the direction of the flexible card wire is different depending on the shape of the connector, be careful when connecting the flexible card wire.
, IC215 V1.05 E_000_001_96_19 2. The standard software (PLD Download Tool) can be SDP-15 used. IC203, IC312, . The PLD internal data is controlled in the Sony Database IC307 CN301 V1.01 E_000_002_01_04 Server under the name Project file (E_xxx_xxx_xx_xx). OTR-1 .
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Equipment required . PLD download tool (Sony part number : J-7120-140-A) The cable to connect PC to HDCU3300. . PC A PC having parallel port. A PC in which the PLD Download Tool software is already installed. For the applicable OS and the operating environment, refer to “Download Tool Operating Instruction for...
! 1-533-817-21 Thermistors THP4 E1 (B side) ! 1-533-817-21 HDCU3300 is provided with positive thermistors for THP5 D5 (A side) ! 1-533-817-21 power circuit. If an overcurrent flows in a positive ther- mistor or it heats up to a certain degree with the increase of...
The AT-167S board has the built-in microprocessor (SH2- DSP). It controls various circuit boards inside the DPR-271A board HDCU3300 and the power supply. It also performs the The DPR-271A board performs the super motion output system setup including a camera.
HD/SD-SDI signals to external devices. It outputs two systems of the main-line system HD/SD- SDI signals sent from the DRX-5 board, and outputs one system of the monitor-system HD/SD-SDI signals. 1-7 (E) HDCU3300/MM (J,E)
159B board inserted in its front side. SD, and the composite signal whose external SC is locked can be output. VDA-64C board The VDA-64C board cannot be used in the HDCU3300. Rear board 1-6-4. HKCU1005 VDA-64A board The VDA-64A board outputs the SD analog signals (VBS, Front boards PIX, and WFM signals) to external devices.
: LEAD FREE MARK 2. Standardization of Parts Some repair parts supplied by Sony differ from those used for the unit. These are because of parts common- . Be sure to use the unleaded solder for the printed circuit ality and improvement.
J5, J6, and J7. bench. 5. Remove the switching regulator from HDCU3300 in . When delivering to the user, adjust the power supply the direction of the arrow.
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4. Remove the harnesses from the CN9002, CN9006 and 100V 115V 110-120V 220-240V CN9007 on the CN-3275 board. 5. Remove the power block assembly (A10) from HDCU3300 in the direction of the arrow. . CE, CN : 220V-240V CAMERA TRANS 100V 115V 110-120V 220-240V...
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(Refer to Section 2-1-2.) If the rating of the fuse doesn't adapt to the working PS panel power supply voltage. assembly 8. Install the power supply unit by reversing the steps of removal. Screws (P2.6 x 5) 2-3 (E) HDCU3300/MM (J, E)
Fuse (8 A, 250 V) Part No: ! 1-576-300-51 For 220 to 240 V setting Part: Fuse (6.3 A, 250 V) Part No: ! 1-576-233-51 CN-2700 board 8. Install the PS panel assembly to the unit. 2-4 (E) HDCU3300/MM (J, E)
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Fuse holder CAMERA fuse MAIN fuse Two fuse holders Power Block Assembly (A10) MAIN fuse Two fuse holders CAMERA fuse Fig. 1 Flat-blade Groove screwdriver Fig. 3 Fuse holder Fuse Fig. 2 Fuse holder Fuse holder 2-5 (E) HDCU3300/MM (J, E)
Replace the parts after turning off the power and cooling Wire clamp the inside. PSW3 x 6 The fans that are used in the rear panel of HDCU3300 are recommended replacement parts. PSW3 x 6 The lifespan of these fans is about 30,000 hours, which...
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A Power block assembly (A10) The labeled side face the front 6. Install the DC fan by reversing steps 4 to 5. Install the DC fan in the orientation shown in the figure above. 2-7 (E) HDCU3300/MM (J, E)
CN1 on the CN-2718 board. Be very careful in handling the optical cable when removing the rear panel and the OTR-1/SDP-15 board. CN-2718 board Screws (B3 x 5) MB-1073 board Rear panel Optical cable Harness OTR-1/ SDP-15 board 2-8 (E) HDCU3300/MM (J, E)
(PSW3 x 6) Hexagonal bolts Spacers CN1001/ CN103/ OTR-1 board SDP-15 board 12. Install the rear panel by reversing the steps of removal. SDP-15 board 4. Install the SDP-15 board by reversing the steps of removal. 2-9 (E) HDCU3300/MM (J, E)
6. Install the DC fan by reversing the steps of removal. on the MB-1073 board. Install the DC fan in the orientation shown in the figure above. Screw (B3 x 5) Ventilation guide (upper) Fan harness DC Fan CN33/ MB-1073 board 2-10 (E) HDCU3300/MM (J, E)
MB-1073 board Rear board fixing plate Hexagonal screws 4. Install the CNB-21G board by reversing the steps of Screws (PSW3 x 6) removal. MB-1073 board 14. Install the MB-1073 board by reversing the steps of removal. 2-12 (E) HDCU3300/MM (J, E)
5. Pull out the harness from the cable cover and notch and remove DC fan. Harness Cable cover Notch Notch Harness DC fan P2.6 x 6 P2.6 x 6 : Air flow 6. Install the DC fan by reversing the steps of removal. 2-13 (E) HDCU3300/MM (J, E)
75 % (EBU) (HKCU1001) . Frequency counter Advantest TR5821AK or equivalent . To adjust HDCU3300, extend each plug-in board. Before pulling out the boards, be sure to turn off the Related equipment main power. . HD color camera (HD super slow motion) .
3-1-3. Connection of Equipment Adjusting the HDCU3300 HD COLOR CAMERA HDC3300 HD CAMERA CONTROL UNIT OPTICAL FIBER Measure HDCU3300 CABLE MASTER SETUP UNIT MSU-900/950 CCA-5 CABLE (max. 200m) Adjusting the HKCU1001/1003 HD CAMERA CONTROL UNIT HDCU3300 SD ENCODER UNIT HD COLOR CAMERA...
→ OFF (Dark) WHITE button → OFF (Dark) BLACK button . Others → ON GAMMA OFF (Not highlighted) → 0 (0 dB) MASTER GAIN * : Press the function button and select it on the function menu display. 3-3 (E) HDCU3300/MM (J,E)
2. Measuring point : TP502 (G-3)/AVP-6 board Adjusting point : 1RV500 (F-3)/AVP-6 board AVP-6 board (A side) A = 1100 ± 50 mV p-p Specifications : 3. Remove the cable that is connected in step 1. 3-4 (E) HDCU3300/MM (J,E)
2-pin (X), 1-pin (Y) and 3-pin (G) of the INCOM connector on the HDCU front panel. Setting after Adjustment Audio oscillator After adjustment is completed, return the switches to the 600 Z original setting. 3-5 (E) HDCU3300/MM (J,E)
S104 S102 S103 S101 S410 After finishing the adjustment, return the switches to the original configuration. Reconnect the disconnected cables. S412 S405 S413 S404 S416 S420 S403 S402 S401 AT-167S board (A side and panel side) 3-6 (E) HDCU3300/MM (J,E)
After finishing the adjustment and waiting for 10 minutes at least, confirm that each specification is met. If the specifications are not met, perform the adjustment again. Setting after Adjustment After finishing the adjustment, reconnect the disconnected cables. TP251 DTX-5 board (A side) 3-7 (E) HDCU3300/MM (J,E)
Therefore, specified parts should be used in the case of replacement. 2. Standardization of Parts Some repair parts supplied by Sony differ from those used for the unit. These are because of parts common- ality and improvement. Parts list has the present standardized repair parts.
40001 through 40999 (HDCU3300: CE) 50001 through 50999 (HDCU3300: E3) 60001 through 60999 (HDCU3300: E2) *b: Model HDCU3300 is not provided with a power block assembly (A10) from the beginning. If replacement with the power block assembly (A10) has been made, refer to *b.
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A-1132-789-A s MOUNTED CIRCUIT BOARD, EN-159A (OPTION) A-1132-790-A s MOUNTED CIRCUIT BOARD, EN-159B (OPTION) A-1206-289-A s MOUNTED CIRCUIT BOARD, DPR-271A A-1206-290-A s MOUNTED CIRCUIT BOARD, DPR-271B A-1206-292-A s MOUNTED CIRCUIT BOARD, CPU-395 A-1207-222-A s MOUNTED CIRCUIT BOARD, AT-167S 3-725-295-21 s SCREW, (+) (B3) HDCU3300/MM (J,E)
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1-831-666-11 s CABLE, FLEXIBLE FLAT (15 CORE) 7-623-925-11 s WASHER 4.0, NYLON 7-682-174-01 s SCREW, +P 5X8 1-833-305-11 s CABLE ASSEMBLY, ENCAPSULAT (F) (LEMO) 7-682-648-01 s SCREW, +PS 3X8 1-833-440-11 s OPTICAL MULTI CABLE ASSEMBLY (TAJIMI) 7-688-003-03 s W 3, SMALL (LEMO) HDCU3300/MM (J,E)
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A-1161-082-A s MOUNTED CIRCUIT BOARD, CN-2674G 1-763-676-21 s FAN, DC A-1206-238-A s MOUNTED CIRCUIT BOARD, OTR-1 A-1206-286-A s MOUNTED CIRCUIT BOARD, MB-1073 7-682-947-01 s SCREW +PSW 3X6 A-1206-291-A s MOUNTED CIRCUIT BOARD, SDP-15 7-682-953-01 s SCREW +PSW 3X20 1-763-256-21 s FAN, DC HDCU3300/MM (J,E)
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Power Block Assemby (A10) PSW4 x 8 PSW4 x 8 PSW4 x 8 PSW3 x 30 PSW3 x 10 PSW3 x 6 HDCU3300/MM (J,E)
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4-171-340-01 s GUARD, SWITCH AC 4-191-694-01 s SHEET RADIATION,COIL(A10-T1.5) 4-382-854-51 s SCREW (M3X6), P, SW (+) A-1804-005-A s POWER UNIT (RP) 7-682-947-01 s SCREW +PSW 3X6 7-682-949-01 s SCREW +PSW 3X10 7-682-955-09 s SCREW +PSW 3X30 7-682-961-01 s SCREW +PSW 4X8 HDCU3300/MM (J,E)
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C113 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C117 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C118 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 HDCU3300/MM (J,E)
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1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005 C176 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C341 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C177 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C342 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216 HDCU3300/MM (J,E)
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1-165-989-91 s CAP, CERAMIC 10MF (2012) C704 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216 C767 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C705 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216 C768 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225) 4-10 HDCU3300/MM (J,E)
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1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 D408 8-719-024-81 s DIODE 1SS300-TE85L C836 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216 D409 8-719-074-31 s DIODE CL-196YG-CD-T C837 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 D410 8-719-077-09 s DIODE CL-196HR-CD-T 4-11 HDCU3300/MM (J,E)
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*2 6-707-947-01 s IC MB85R256PFTN-G-BNDE1 IC708 8-759-485-24 s IC MC74HC4046ADTR2 IC123 *1 6-707-947-01 s IC MB85R256PFTN-G-BNDE1 *2 6-707-947-01 s IC MB85R256PFTN-G-BNDE1 IC709 8-759-184-65 s IC TC4W66FU(TE12R) IC710 8-759-564-49 s IC TC7W53FU(TE12R) IC124 8-759-543-64 s IC NC7SZ08P5X IC711 8-759-564-49 s IC TC7W53FU(TE12R) 4-12 HDCU3300/MM (J,E)
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8-729-928-05 s TRANSISTOR 2SC4617TL-QR L111 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q101 8-729-928-05 s TRANSISTOR 2SC4617TL-QR L113 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q102 8-729-209-73 s TRANSISTOR 2SA1213Y-TE12L L114 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q301 8-729-928-05 s TRANSISTOR 2SC4617TL-QR 4-13 HDCU3300/MM (J,E)
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1-208-927-81 s RES, CHIP 47K (1005) R163 1-208-863-81 s RES, CHIP 100 (1005) 1-208-935-81 s RES, CHIP 100K (1005) R164 1-208-863-81 s RES, CHIP 100 (1005) 1-208-895-81 s RES, CHIP 2.2K (1005) R165 1-208-863-81 s RES, CHIP 100 (1005) 4-14 HDCU3300/MM (J,E)
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1-208-935-81 s RES, CHIP 100K (1005) R339 1-208-911-81 s RES, CHIP 10K (1005) R224 1-208-935-81 s RES, CHIP 100K (1005) R340 1-208-911-81 s RES, CHIP 10K (1005) R225 1-208-935-81 s RES, CHIP 100K (1005) R341 1-208-887-81 s RES, CHIP 1.0K (1005) 4-15 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R503 1-208-887-81 s RES, CHIP 1.0K (1005) R437 1-208-863-81 s RES, CHIP 100 (1005) R504 1-208-887-81 s RES, CHIP 1.0K (1005) R438 1-208-863-81 s RES, CHIP 100 (1005) R505 1-208-887-81 s RES, CHIP 1.0K (1005) 4-16 HDCU3300/MM (J,E)
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1-208-927-81 s RES, CHIP 47K (1005) R770 1-208-863-81 s RES, CHIP 100 (1005) R711 1-208-863-81 s RES, CHIP 100 (1005) R771 1-208-903-81 s RES, CHIP 4.7K (1005) R712 1-208-863-81 s RES, CHIP 100 (1005) R772 1-208-863-81 s RES, CHIP 100 (1005) 4-17 HDCU3300/MM (J,E)
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1-208-895-81 s RES, CHIP 2.2K (1005) R908 1-208-923-81 s RES, CHIP 33K (1005) R830 1-208-895-81 s RES, CHIP 2.2K (1005) R909 1-208-895-81 s RES, CHIP 2.2K (1005) R831 1-220-870-81 s RES, CHIP 10 (1005) R910 1-220-870-81 s RES, CHIP 10 (1005) 4-18 HDCU3300/MM (J,E)
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1-762-120-21 s SWITCH, TOGGLE RB103 1-233-810-21 s RES, NETWORK 100K (3216) S403 1-572-658-21 s SWITCH, ROTARY RB104 1-233-810-21 s RES, NETWORK 100K (3216) S404 1-572-658-21 s SWITCH, ROTARY RB105 1-233-810-21 s RES, NETWORK 100K (3216) S405 1-572-658-21 s SWITCH, ROTARY 4-19 HDCU3300/MM (J,E)
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8-759-168-19 s IC TA78L09F-TE12L 1-218-990-81 s CONDUCTOR, CHIP (1005) 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 4-20 HDCU3300/MM (J,E)
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8-759-422-21 s IC NJM4580V(TE2) 1-218-990-81 s CONDUCTOR, CHIP (1005) 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 1-414-404-41 s INDUCTOR (SMD) 100.0UH 4-21 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C155 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225 C156 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225 C157 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C158 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B 4-22 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C327 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C417 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005 C328 1-165-989-91 s CAP, CERAMIC 10MF (2012) C418 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005 4-23 HDCU3300/MM (J,E)
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1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7) C529 1-100-581-81 s CAP,CHIP CERAMIC0.0047MF B1005 C642 1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7) C530 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C643 1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7) 4-24 HDCU3300/MM (J,E)
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8-719-421-28 s DIODE MA728-TX IC106 6-704-976-01 s IC ADR381ARTZ-REEL7 D404 8-719-016-84 s DIODE 02DZ2.0-TPH3 IC107 8-759-471-96 s IC 74VHC08MTCX D405 8-719-016-84 s DIODE 02DZ2.0-TPH3 IC108 8-759-648-61 s IC LTC1387CG D406 8-719-421-28 s DIODE MA728-TX IC109 8-759-648-61 s IC LTC1387CG 4-25 HDCU3300/MM (J,E)
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8-729-928-05 s TRANSISTOR 2SC4617TL-QR IC611 8-759-422-21 s IC NJM4580V(TE2) Q108 8-729-928-05 s TRANSISTOR 2SC4617TL-QR IC612 8-759-422-21 s IC NJM4580V(TE2) IC613 8-759-278-58 s IC NJM4558V-TE2 Q109 8-729-928-05 s TRANSISTOR 2SC4617TL-QR IC614 8-759-278-58 s IC NJM4558V-TE2 Q110 8-729-928-05 s TRANSISTOR 2SC4617TL-QR 4-26 HDCU3300/MM (J,E)
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1-220-870-81 s RES, CHIP 10 (1005) R130 1-208-911-81 s RES, CHIP 10K (1005) R308 1-220-870-81 s RES, CHIP 10 (1005) R309 1-208-927-81 s RES, CHIP 47K (1005) R131 1-208-903-81 s RES, CHIP 4.7K (1005) R310 1-208-863-81 s RES, CHIP 100 (1005) 4-27 HDCU3300/MM (J,E)
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1-208-860-81 s RES, CHIP 75 (1005) R466 1-208-935-81 s RES, CHIP 100K (1005) R401 1-208-863-81 s RES, CHIP 100 (1005) R467 1-208-935-81 s RES, CHIP 100K (1005) R402 1-208-863-81 s RES, CHIP 100 (1005) R468 1-208-903-81 s RES, CHIP 4.7K (1005) 4-28 HDCU3300/MM (J,E)
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1-208-887-81 s RES, CHIP 1.0K (1005) R626 1-208-911-81 s RES, CHIP 10K (1005) R554 1-216-813-91 s RES, CHIP 220 (1608) R627 1-208-911-81 s RES, CHIP 10K (1005) R556 1-216-813-91 s RES, CHIP 220 (1608) R628 1-208-911-81 s RES, CHIP 10K (1005) 4-29 HDCU3300/MM (J,E)
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1-216-813-91 s RES, CHIP 220 (1608) R744 1-208-919-81 s RES, CHIP 22K (1005) R686 1-216-813-91 s RES, CHIP 220 (1608) R745 1-208-887-81 s RES, CHIP 1.0K (1005) R687 1-208-933-81 s RES, CHIP 82K (1005) R746 1-208-915-81 s RES, CHIP 15K (1005) 4-30 HDCU3300/MM (J,E)
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1-208-923-81 s RES, CHIP 33K (1005) RV501 1-225-793-21 s RES, ADJ, CERMET 20K R804 1-208-887-81 s RES, CHIP 1.0K (1005) RV600 1-241-264-41 s RES, ADJ, CERMET 10K R805 1-208-887-81 s RES, CHIP 1.0K (1005) RV601 1-241-264-41 s RES, ADJ, CERMET 10K 4-31 HDCU3300/MM (J,E)
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TP502 1-535-877-22 s CHIP, CHECKER TP503 1-535-877-22 s CHIP, CHECKER TP504 1-535-877-22 s CHIP, CHECKER TP505 1-535-877-22 s CHIP, CHECKER TP600 1-535-877-22 s CHIP, CHECKER TP601 1-535-877-22 s CHIP, CHECKER X300 1-813-253-12 s OSCILLATOR, CRYSTAL (VCXO) 5V 4-32 HDCU3300/MM (J,E)
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1-779-092-11 s PIN, CONNECTOR (PC BOARD) 10P CN9007 1-691-291-11 o PIN, CONNECTOR (PC BOARD) 5P FB16 1-414-445-21 s FERRITE, EMI (SMD) (1608) TP9001 1-780-318-11 s TERMINAL, LUG 1-457-217-21 o COMMON MODE CHOKE COIL TP9002 1-780-627-11 s TERMINAL, LUG 4-33 HDCU3300/MM (J,E)
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1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005 C217 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005 C218 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005 C219 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005 C220 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005 4-34 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C303 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C304 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C109 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C305 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-35 HDCU3300/MM (J,E)
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IC136 8-759-598-44 s IC TC7WH08FK(TE85R) 8-719-017-03 s DIODE 02DZ4.7-TPH3 8-719-074-31 s DIODE CL-196YG-CD-T IC137 8-759-598-44 s IC TC7WH08FK(TE85R) 8-719-017-03 s DIODE 02DZ4.7-TPH3 IC138 8-759-675-53 s IC TC7WH32FK(TE85R) D101 8-719-820-42 s DIODE 1SS302-TE85L IC140 8-759-669-44 s IC SN74LVC74APWR-12 4-36 HDCU3300/MM (J,E)
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1-208-911-81 s RES, CHIP 10K (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) R129 1-208-935-81 s RES, CHIP 100K (1005) 1-208-919-81 s RES, CHIP 22K (1005) R130 1-208-935-81 s RES, CHIP 100K (1005) R131 1-208-863-81 s RES, CHIP 100 (1005) 4-37 HDCU3300/MM (J,E)
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1-208-927-81 s RES, CHIP 47K (1005) R350 1-208-863-81 s RES, CHIP 100 (1005) R198 1-208-935-81 s RES, CHIP 100K (1005) R351 1-208-863-81 s RES, CHIP 100 (1005) R199 1-208-935-81 s RES, CHIP 100K (1005) R352 1-208-863-81 s RES, CHIP 100 (1005) 4-38 HDCU3300/MM (J,E)
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1-795-177-21 s OSCILLATOR, CRYSTAL RB12 1-234-372-21 s RES, NETWORK 100 (1005X4) RB13 1-234-372-21 s RES, NETWORK 100 (1005X4) RB14 1-234-372-21 s RES, NETWORK 100 (1005X4) RB15 1-234-372-21 s RES, NETWORK 100 (1005X4) RB16 1-234-381-21 s RES, NETWORK 100K (1005X4) 4-39 HDCU3300/MM (J,E)
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1-119-923-81 s CAP, CERAMIC 0.047MF B 1005 C601 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) C602 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 C603 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 4-40 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C661 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C751 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C662 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C752 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-41 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C810 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C878 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C811 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C901 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005 4-42 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) C959 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C1034 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C960 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C1035 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-43 HDCU3300/MM (J,E)
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8-719-074-31 s DIODE CL-196YG-CD-T C1098 1-100-506-91 s CAP, CERAMIC 1MF C (1005) D301 8-719-077-09 s DIODE CL-196HR-CD-T C1099 1-100-506-91 s CAP, CERAMIC 1MF C (1005) D1001 8-719-820-42 s DIODE 1SS302-TE85L C1100 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-44 HDCU3300/MM (J,E)
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1-416-948-21 s COIL, CHOKE 10UH FB1014 1-469-094-21 s FERRITE, EMI (SMD) (1608) 1-416-344-21 s COIL, CHOKE 10UH FB1015 1-469-094-21 s FERRITE, EMI (SMD) (1608) 1-416-344-21 s COIL, CHOKE 10UH FB1016 1-469-094-21 s FERRITE, EMI (SMD) (1608) 1-414-392-41 s INDUCTOR (SMD) 1.0UH 4-45 HDCU3300/MM (J,E)
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1-208-923-81 s RES, CHIP 33K (1005) R204 1-208-871-81 s RES, CHIP 220 (1005) 1-208-911-81 s RES, CHIP 10K (1005) R205 1-220-870-81 s RES, CHIP 10 (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) R206 1-208-891-81 s RES, CHIP 1.5K (1005) 4-46 HDCU3300/MM (J,E)
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1-208-887-81 s RES, CHIP 1.0K (1005) R560 1-208-856-81 s RES, CHIP 51 (1005) R333 1-208-863-81 s RES, CHIP 100 (1005) R561 1-208-856-81 s RES, CHIP 51 (1005) R335 1-208-863-81 s RES, CHIP 100 (1005) R562 1-208-856-81 s RES, CHIP 51 (1005) 4-47 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R925 1-208-911-81 s RES, CHIP 10K (1005) R705 1-208-863-81 s RES, CHIP 100 (1005) R926 1-208-911-81 s RES, CHIP 10K (1005) R710 1-208-855-81 s RES, CHIP 47 (1005) R927 1-208-863-81 s RES, CHIP 100 (1005) 4-48 HDCU3300/MM (J,E)
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1-208-856-81 s RES, CHIP 51 (1005) RB207 1-234-372-21 s RES, NETWORK 100 (1005X4) R1088 1-208-856-81 s RES, CHIP 51 (1005) RB208 1-234-381-21 s RES, NETWORK 100K (1005X4) R1089 1-208-899-81 s RES, CHIP 3.3K (1005) RB209 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-49 HDCU3300/MM (J,E)
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1-234-369-21 s RES, NETWORK 10 (1005X4) RB921 1-234-371-21 s RES, NETWORK 47 (1005X4) RB507 1-234-375-21 s RES, NETWORK 1K (1005X4) RB922 1-234-371-21 s RES, NETWORK 47 (1005X4) RB508 1-234-375-21 s RES, NETWORK 1K (1005X4) RB923 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-50 HDCU3300/MM (J,E)
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1-234-371-21 s RES, NETWORK 47 (1005X4) RB978 1-234-371-21 s RES, NETWORK 47 (1005X4) RB979 1-234-371-21 s RES, NETWORK 47 (1005X4) RB980 1-234-371-21 s RES, NETWORK 47 (1005X4) RB981 1-234-371-21 s RES, NETWORK 47 (1005X4) RB982 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-51 HDCU3300/MM (J,E)
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1-119-923-81 s CAP, CERAMIC 0.047MF B 1005 C601 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) C602 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 C603 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 4-52 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C661 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C751 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C662 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C752 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-53 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C810 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C878 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C811 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C901 1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005 4-54 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) C959 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C1034 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C960 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C1035 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-55 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) D208 8-719-074-31 s DIODE CL-196YG-CD-T C1099 1-100-506-91 s CAP, CERAMIC 1MF C (1005) D209 8-719-074-31 s DIODE CL-196YG-CD-T C1100 1-100-506-91 s CAP, CERAMIC 1MF C (1005) D210 8-719-074-31 s DIODE CL-196YG-CD-T 4-56 HDCU3300/MM (J,E)
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1-469-094-21 s FERRITE, EMI (SMD) (1608) IC5004 6-700-804-01 s IC SN74LVC574APWR FB1011 1-469-094-21 s FERRITE, EMI (SMD) (1608) IC5005 6-700-804-01 s IC SN74LVC574APWR FB1012 1-469-094-21 s FERRITE, EMI (SMD) (1608) IC5006 6-700-804-01 s IC SN74LVC574APWR FB1013 1-469-094-21 s FERRITE, EMI (SMD) (1608) 4-57 HDCU3300/MM (J,E)
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1-218-957-81 s RES, CHIP 2.2K 1-208-923-81 s RES, CHIP 33K (1005) R188 1-218-957-81 s RES, CHIP 2.2K 1-208-923-81 s RES, CHIP 33K (1005) R189 1-218-973-81 s RES, CHIP 47K 1-208-919-81 s RES, CHIP 22K (1005) R190 1-218-957-81 s RES, CHIP 2.2K 4-58 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R556 1-208-856-81 s RES, CHIP 51 (1005) R328 1-208-863-81 s RES, CHIP 100 (1005) R557 1-208-856-81 s RES, CHIP 51 (1005) R330 1-208-863-81 s RES, CHIP 100 (1005) R558 1-208-856-81 s RES, CHIP 51 (1005) 4-59 HDCU3300/MM (J,E)
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1-208-911-81 s RES, CHIP 10K (1005) R1060 1-208-887-81 s RES, CHIP 1.0K (1005) R903 1-208-863-81 s RES, CHIP 100 (1005) R1061 1-208-887-81 s RES, CHIP 1.0K (1005) R904 1-208-863-81 s RES, CHIP 100 (1005) R1062 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-60 HDCU3300/MM (J,E)
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1-220-870-81 s RES, CHIP 10 (1005) R1130 1-208-887-81 s RES, CHIP 1.0K (1005) R5089 1-220-870-81 s RES, CHIP 10 (1005) R1132 1-218-990-81 s CONDUCTOR, CHIP (1005) R5090 1-220-870-81 s RES, CHIP 10 (1005) R1133 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-61 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB912 1-234-371-21 s RES, NETWORK 47 (1005X4) RB420 1-234-372-21 s RES, NETWORK 100 (1005X4) RB913 1-234-371-21 s RES, NETWORK 47 (1005X4) RB421 1-234-372-21 s RES, NETWORK 100 (1005X4) RB914 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-62 HDCU3300/MM (J,E)
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1-795-872-11 s OSCILLATOR RB969 1-234-371-21 s RES, NETWORK 47 (1005X4) RB970 1-234-371-21 s RES, NETWORK 47 (1005X4) RB971 1-234-371-21 s RES, NETWORK 47 (1005X4) RB972 1-234-371-21 s RES, NETWORK 47 (1005X4) RB973 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-63 HDCU3300/MM (J,E)
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1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 C158 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C159 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C160 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 4-64 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C416 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C523 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C417 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C601 1-165-989-91 s CAP, CERAMIC 10MF (2012) 4-65 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C727 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C925 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C728 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C926 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-66 HDCU3300/MM (J,E)
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8-759-472-43 s IC 74VHC245MTCX 8-759-327-01 s IC NJM062V(TE2) 6-704-976-01 s IC ADR381ARTZ-REEL7 1-218-990-81 s CONDUCTOR, CHIP (1005) 8-759-327-01 s IC NJM062V(TE2) 6-701-572-01 s IC TPS54610PWPR 1-416-344-21 s COIL, CHOKE 10UH 6-701-572-01 s IC TPS54610PWPR 1-416-344-21 s COIL, CHOKE 10UH 4-67 HDCU3300/MM (J,E)
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1-208-887-81 s RES, CHIP 1.0K (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-923-81 s RES, CHIP 33K (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-923-81 s RES, CHIP 33K (1005) 1-208-919-81 s RES, CHIP 22K (1005) 4-68 HDCU3300/MM (J,E)
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1-208-927-81 s RES, CHIP 47K (1005) R454 1-220-870-81 s RES, CHIP 10 (1005) R209 1-208-887-81 s RES, CHIP 1.0K (1005) R455 1-220-870-81 s RES, CHIP 10 (1005) R210 1-208-927-81 s RES, CHIP 47K (1005) R456 1-220-870-81 s RES, CHIP 10 (1005) 4-69 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) R725 1-208-863-81 s RES, CHIP 100 (1005) RB158 1-234-372-21 s RES, NETWORK 100 (1005X4) R726 1-208-863-81 s RES, CHIP 100 (1005) R727 1-208-863-81 s RES, CHIP 100 (1005) RB159 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-70 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB531 1-234-371-21 s RES, NETWORK 47 (1005X4) RB421 1-234-372-21 s RES, NETWORK 100 (1005X4) RB532 1-234-371-21 s RES, NETWORK 47 (1005X4) RB422 1-234-372-21 s RES, NETWORK 100 (1005X4) RB533 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-71 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB706 1-234-372-21 s RES, NETWORK 100 (1005X4) RB707 1-234-372-21 s RES, NETWORK 100 (1005X4) RB708 1-234-371-21 s RES, NETWORK 47 (1005X4) RB901 1-234-372-21 s RES, NETWORK 100 (1005X4) RB902 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-72 HDCU3300/MM (J,E)
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1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 C156 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C157 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012) 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C158 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-73 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C414 1-165-989-91 s CAP, CERAMIC 10MF (2012) C521 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C415 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C522 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-74 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) C725 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C923 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C726 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C924 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-75 HDCU3300/MM (J,E)
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1-469-094-21 s FERRITE, EMI (SMD) (1608) IC812 8-759-592-49 s IC TC7SZ125FU(TE85R) FL501 1-233-891-21 s FILTER, LOW PASS IC813 8-759-592-49 s IC TC7SZ125FU(TE85R) IC814 8-759-592-49 s IC TC7SZ125FU(TE85R) 8-759-327-01 s IC NJM062V(TE2) IC901 8-759-472-43 s IC 74VHC245MTCX 6-704-976-01 s IC ADR381ARTZ-REEL7 4-76 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) 1-208-863-81 s RES, CHIP 100 (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) 1-208-863-81 s RES, CHIP 100 (1005) 1-208-863-81 s RES, CHIP 100 (1005) 1-218-953-81 s RES, CHIP 1.0K 4-77 HDCU3300/MM (J,E)
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1-208-871-81 s RES, CHIP 220 (1005) R419 1-208-863-81 s RES, CHIP 100 (1005) R205 1-220-870-81 s RES, CHIP 10 (1005) R420 1-220-870-81 s RES, CHIP 10 (1005) R206 1-208-895-81 s RES, CHIP 2.2K (1005) R450 1-220-870-81 s RES, CHIP 10 (1005) 4-78 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) R721 1-208-863-81 s RES, CHIP 100 (1005) R722 1-208-863-81 s RES, CHIP 100 (1005) RB110 1-234-372-21 s RES, NETWORK 100 (1005X4) R723 1-208-863-81 s RES, CHIP 100 (1005) RB155 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-79 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB527 1-234-371-21 s RES, NETWORK 47 (1005X4) RB417 1-234-372-21 s RES, NETWORK 100 (1005X4) RB528 1-234-371-21 s RES, NETWORK 47 (1005X4) RB418 1-234-372-21 s RES, NETWORK 100 (1005X4) RB529 1-234-371-21 s RES, NETWORK 47 (1005X4) 4-80 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB651 1-234-372-21 s RES, NETWORK 100 (1005X4) RB652 1-234-372-21 s RES, NETWORK 100 (1005X4) RB701 1-234-372-21 s RES, NETWORK 100 (1005X4) RB705 1-234-372-21 s RES, NETWORK 100 (1005X4) RB706 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-81 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C152 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225 C270 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C154 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C271 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-82 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C417 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C601 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C418 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C602 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-83 HDCU3300/MM (J,E)
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1-469-094-21 s FERRITE, EMI (SMD) (1608) L103 1-416-344-21 s COIL, CHOKE 10UH L104 1-416-344-21 s COIL, CHOKE 10UH FB207 1-469-094-21 s FERRITE, EMI (SMD) (1608) L201 1-414-459-21 s INDUCTOR, CHIP (S) 4.7NH FB208 *2 1-469-094-21 s FERRITE, EMI (SMD) (1608) 4-84 HDCU3300/MM (J,E)
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*2 1-208-871-81 s RES, CHIP 220 (1005) R102 1-208-871-81 s RES, CHIP 220 (1005) R159 *1 1-218-847-91 s RES, CHIP 1.0K (1608) R103 1-208-923-81 s RES, CHIP 33K (1005) *2 1-208-887-81 s RES, CHIP 1.0K (1005) R104 1-208-923-81 s RES, CHIP 33K (1005) 4-85 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R413 1-208-863-81 s RES, CHIP 100 (1005) R310 1-208-887-81 s RES, CHIP 1.0K (1005) R414 1-208-863-81 s RES, CHIP 100 (1005) R311 1-208-871-81 s RES, CHIP 220 (1005) R415 1-208-871-81 s RES, CHIP 220 (1005) 4-86 HDCU3300/MM (J,E)
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1-234-373-21 s RES, NETWORK 220 (1005X4) R606 1-208-927-81 s RES, CHIP 47K (1005) RB404 1-234-373-21 s RES, NETWORK 220 (1005X4) R607 1-208-927-81 s RES, CHIP 47K (1005) RB405 1-234-373-21 s RES, NETWORK 220 (1005X4) R608 1-208-927-81 s RES, CHIP 47K (1005) 4-87 HDCU3300/MM (J,E)
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1-234-381-21 s RES, NETWORK 100K (1005X4) RB630 1-234-375-21 s RES, NETWORK 1K (1005X4) RB631 1-234-372-21 s RES, NETWORK 100 (1005X4) RB632 1-234-372-21 s RES, NETWORK 100 (1005X4) RB633 1-234-372-21 s RES, NETWORK 100 (1005X4) RB634 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-88 HDCU3300/MM (J,E)
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1-115-340-91 s CAP, CERAMIC 0.22MF B (2012) C326 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C328 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C158 1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7) C329 1-165-989-91 s CAP, CERAMIC 10MF (2012) 4-89 HDCU3300/MM (J,E)
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1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C386 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C387 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B CN501 1-764-093-21 o PIN, CONNECTOR (PC BOARD) 8P C388 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B 4-90 HDCU3300/MM (J,E)
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1-218-855-91 s RES, CHIP 2.2K (1608) IC319 8-759-561-46 s IC AD8014ARTZ-REEL7 R107 1-218-891-91 s RES, CHIP 68K (1608) R108 1-218-891-91 s RES, CHIP 68K (1608) IC320 8-759-561-46 s IC AD8014ARTZ-REEL7 R109 1-218-875-91 s RES, CHIP 15K (1608) 4-91 HDCU3300/MM (J,E)
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1-218-895-91 s RES, CHIP 100K (1608) R319 1-211-985-91 s RES, CHIP 47 (1608) R175 1-218-895-91 s RES, CHIP 100K (1608) R320 1-218-871-91 s RES, CHIP 10K (1608) R176 1-218-847-91 s RES, CHIP 1.0K (1608) R321 1-218-871-91 s RES, CHIP 10K (1608) 4-92 HDCU3300/MM (J,E)
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1-218-831-91 s RES, CHIP 220 (1608) R393 1-218-823-91 s RES, CHIP 100 (1608) R455 1-218-831-91 s RES, CHIP 220 (1608) R394 1-218-823-91 s RES, CHIP 100 (1608) R456 1-218-831-91 s RES, CHIP 220 (1608) R457 1-218-831-91 s RES, CHIP 220 (1608) 4-93 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB313 1-234-373-21 s RES, NETWORK 220 (1005X4) RB122 1-234-372-21 s RES, NETWORK 100 (1005X4) RB314 1-234-371-21 s RES, NETWORK 47 (1005X4) RB123 1-234-372-21 s RES, NETWORK 100 (1005X4) RB315 1-234-373-21 s RES, NETWORK 220 (1005X4) 4-94 HDCU3300/MM (J,E)
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1-115-340-91 s CAP, CERAMIC 0.22MF B (2012) C157 1-115-340-91 s CAP, CERAMIC 0.22MF B (2012) TP304 1-535-877-22 s CHIP, CHECKER TP305 1-535-877-22 s CHIP, CHECKER C158 1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7) TP306 1-535-877-22 s CHIP, CHECKER TP307 1-535-877-22 s CHIP, CHECKER 4-95 HDCU3300/MM (J,E)
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1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7) C249 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C341 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012) C250 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B C342 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B 4-96 HDCU3300/MM (J,E)
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1-162-923-91 s CAP, CERAMIC 47PF CH 1608 C400 1-162-915-91 s CAP, CERAMIC 10PF CH 1608 C538 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 C401 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 C539 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 4-97 HDCU3300/MM (J,E)
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6-704-976-01 s IC ADR381ARTZ-REEL7 C596 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 C597 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B IC107 8-759-472-43 s IC 74VHC245MTCX C598 1-107-826-91 s CAP, CHIP CERAMIC 100000PF B IC108 8-759-472-43 s IC 74VHC245MTCX 4-98 HDCU3300/MM (J,E)
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1-414-398-41 s INDUCTOR (SMD) 10.0UH L517 1-414-398-41 s INDUCTOR (SMD) 10.0UH L101 1-416-344-21 s COIL, CHOKE 10UH L518 1-412-955-21 s INDUCTOR, SMALL TYPE 22UH 2520 L102 1-416-344-21 s COIL, CHOKE 10UH L519 1-414-398-41 s INDUCTOR (SMD) 10.0UH 4-99 HDCU3300/MM (J,E)
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1-218-879-91 s RES, CHIP 22K (1608) R223 1-211-985-91 s RES, CHIP 47 (1608) R134 1-218-859-91 s RES, CHIP 3.3K (1608) R224 1-211-985-91 s RES, CHIP 47 (1608) R135 1-218-871-91 s RES, CHIP 10K (1608) R225 1-211-985-91 s RES, CHIP 47 (1608) 4-100 HDCU3300/MM (J,E)
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1-218-823-91 s RES, CHIP 100 (1608) R353 1-218-871-91 s RES, CHIP 10K (1608) R284 1-218-831-91 s RES, CHIP 220 (1608) R354 1-218-863-91 s RES, CHIP 4.7K (1608) R285 1-218-871-91 s RES, CHIP 10K (1608) R355 1-218-847-91 s RES, CHIP 1.0K (1608) 4-101 HDCU3300/MM (J,E)
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1-218-903-91 s RES, CHIP 220K (1608) R521 1-218-855-91 s RES, CHIP 2.2K (1608) R422 1-218-887-91 s RES, CHIP 47K (1608) R522 1-218-835-91 s RES, CHIP 330 (1608) R423 1-218-903-91 s RES, CHIP 220K (1608) R523 1-218-835-91 s RES, CHIP 330 (1608) 4-102 HDCU3300/MM (J,E)
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1-218-859-91 s RES, CHIP 3.3K (1608) R639 1-211-989-91 s RES, CHIP 68 (1608) R581 1-218-855-91 s RES, CHIP 2.2K (1608) R640 1-218-843-91 s RES, CHIP 680 (1608) R582 1-218-847-91 s RES, CHIP 1.0K (1608) R641 1-218-823-91 s RES, CHIP 100 (1608) 4-103 HDCU3300/MM (J,E)
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1-234-373-21 s RES, NETWORK 220 (1005X4) RB115 1-234-372-21 s RES, NETWORK 100 (1005X4) RB246 1-234-373-21 s RES, NETWORK 220 (1005X4) RB247 1-234-373-21 s RES, NETWORK 220 (1005X4) RB116 1-234-372-21 s RES, NETWORK 100 (1005X4) RB248 1-234-373-21 s RES, NETWORK 220 (1005X4) 4-104 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) RB518 1-234-373-21 s RES, NETWORK 220 (1005X4) RB519 1-234-372-21 s RES, NETWORK 100 (1005X4) RB520 1-234-373-21 s RES, NETWORK 220 (1005X4) RB521 1-234-373-21 s RES, NETWORK 220 (1005X4) RB522 1-234-373-21 s RES, NETWORK 220 (1005X4) 4-105 HDCU3300/MM (J,E)
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8-729-928-05 s TRANSISTOR 2SC4617TL-QR 1-208-871-81 s RES, CHIP 220 (1005) 1-208-879-81 s RES, CHIP 470 (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-907-81 s RES, CHIP 6.8K (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-919-81 s RES, CHIP 22K (1005) 4-106 HDCU3300/MM (J,E)
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8-729-928-05 s TRANSISTOR 2SC4617TL-QR 1-208-871-81 s RES, CHIP 220 (1005) 1-208-879-81 s RES, CHIP 470 (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-907-81 s RES, CHIP 6.8K (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-919-81 s RES, CHIP 22K (1005) 4-107 HDCU3300/MM (J,E)
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1-208-871-81 s RES, CHIP 220 (1005) 1-208-879-81 s RES, CHIP 470 (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-907-81 s RES, CHIP 6.8K (1005) 1-208-871-81 s RES, CHIP 220 (1005) 1-208-919-81 s RES, CHIP 22K (1005) 1-208-927-81 s RES, CHIP 47K (1005) 4-108 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) C113 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C114 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-109 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) C572 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C817 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C573 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) C818 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-110 HDCU3300/MM (J,E)
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1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005 C931 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C990 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C932 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C991 1-100-506-91 s CAP, CERAMIC 1MF C (1005) 4-111 HDCU3300/MM (J,E)
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8-719-077-09 s DIODE CL-196HR-CD-T C1146 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C1147 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 1-535-877-22 s CHIP, CHECKER C1148 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 1-535-877-22 s CHIP, CHECKER 4-112 HDCU3300/MM (J,E)
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1-469-094-21 s FERRITE, EMI (SMD) (1608) L701 1-414-392-41 s INDUCTOR (SMD) 1.0UH FB803 1-469-094-21 s FERRITE, EMI (SMD) (1608) L801 1-414-392-41 s INDUCTOR (SMD) 1.0UH FB804 1-469-094-21 s FERRITE, EMI (SMD) (1608) L802 1-414-392-41 s INDUCTOR (SMD) 1.0UH 4-113 HDCU3300/MM (J,E)
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1-208-860-81 s RES, CHIP 75 (1005) Q815 8-729-928-25 s TRANSISTOR 2SA1774TL-QR R418 1-220-884-81 s RES, CHIP 39 (1005) R419 1-208-860-81 s RES, CHIP 75 (1005) Q816 8-729-928-25 s TRANSISTOR 2SA1774TL-QR Q1101 8-729-928-82 s TRANSISTOR DTC144EE-TL R420 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-114 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R736 1-208-887-81 s RES, CHIP 1.0K (1005) R605 1-208-863-81 s RES, CHIP 100 (1005) R737 1-208-887-81 s RES, CHIP 1.0K (1005) R606 1-208-863-81 s RES, CHIP 100 (1005) R738 1-208-863-81 s RES, CHIP 100 (1005) 4-115 HDCU3300/MM (J,E)
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1-208-911-81 s RES, CHIP 10K (1005) R881 1-218-990-81 s CONDUCTOR, CHIP (1005) R823 1-208-887-81 s RES, CHIP 1.0K (1005) R882 1-218-990-81 s CONDUCTOR, CHIP (1005) R824 1-208-887-81 s RES, CHIP 1.0K (1005) R883 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-116 HDCU3300/MM (J,E)
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1-218-990-81 s CONDUCTOR, CHIP (1005) R1125 1-208-891-81 s RES, CHIP 1.5K (1005) R949 1-218-990-81 s CONDUCTOR, CHIP (1005) R1126 1-208-891-81 s RES, CHIP 1.5K (1005) R950 1-218-990-81 s CONDUCTOR, CHIP (1005) R1127 1-208-887-81 s RES, CHIP 1.0K (1005) 4-117 HDCU3300/MM (J,E)
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1-116-381-11 s CAP, CERAMIC X7R 0.47MF C3010 1-116-381-11 s CAP, CERAMIC X7R 0.47MF C3011 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C3012 1-165-629-91 s CAP, CERAMIC 1000000PF B(3225) C3013 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 4-118 HDCU3300/MM (J,E)
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8-719-069-28 s DI 1SS400FJTE61 R128 1-218-871-91 s RES, CHIP 10K (1608) D3014 8-719-069-28 s DI 1SS400FJTE61 R129 1-220-230-91 s RES,SQUARE TYPE CHIP 2.2(3225) D3015 6-502-642-01 s DI RF101L4STE25 R131 1-218-875-91 s RES, CHIP 15K (1608) D3016 8-719-069-57 s DI UDZSUSTE-176.8B 4-119 HDCU3300/MM (J,E)
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1-220-238-91 s RES, SQUARE TYPE CHIP 10(3225) R3077 1-218-871-91 s RES, CHIP 10K (1608) R1072 1-220-238-91 s RES, SQUARE TYPE CHIP 10(3225) R3078 1-218-859-91 s RES, CHIP 3.3K (1608) R1073 1-218-895-91 s RES, CHIP 100K (1608) R3079 1-216-864-91 s CONDUCTOR, CHIP (1608) 4-120 HDCU3300/MM (J,E)
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1-785-705-11 s PIN, CONNECTOR (PC BOARD) 9P CN402 1-691-960-11 o PIN, CONNECTOR (PC BOARD) 3P CN403 1-822-344-11 s HEADER ASSEMBLY FOR PWB 3P CN404 1-819-475-11 o HEADER ASSEMBLY FOR PWB 7P CN4001 1-691-960-11 o PIN, CONNECTOR (PC BOARD) 3P 4-121 HDCU3300/MM (J,E)
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R4005 1-218-831-91 s RES, CHIP 220 (1608) R421 1-216-829-91 s RES, CHIP 4.7K (1608) R4006 1-220-277-91 s RES,SQUARE TYPE CHIP 2.2K 3225 R422 1-218-875-91 s RES, CHIP 15K (1608) R4007 1-220-277-91 s RES,SQUARE TYPE CHIP 2.2K 3225 4-122 HDCU3300/MM (J,E)
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1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C7034 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C7035 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012) C7036 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216 C7037 1-165-875-91 s CAP, CHIP CERAMIC 10MF B 3216 4-123 HDCU3300/MM (J,E)
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1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) D8002 8-719-069-28 s DI 1SS400FJTE61 C8005 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005 D8012 8-719-938-77 s DIODE SB05-05C-TB-E C8006 1-100-597-91 s CAP, CHIP CERAMIC 0.1MF B 1608 D8013 8-719-051-04 s DIODE EC10QS04-TE12L5 4-124 HDCU3300/MM (J,E)
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1-208-850-91 s RES, CHIP 680K (2012) PH61 8-749-016-82 s PHOTO COUPLER PC123GY2J00F R6063 1-211-969-91 s RES, CHIP 10 (1608) PH62 8-749-016-82 s PHOTO COUPLER PC123GY2J00F R6064 1-218-990-81 s CONDUCTOR, CHIP (1005) PH63 8-749-016-82 s PHOTO COUPLER PC123GY2J00F 4-125 HDCU3300/MM (J,E)
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1-208-907-81 s RES, CHIP 6.8K (1005) R7138 1-208-715-11 s RES, CHIP 22K (1005) R7058 1-208-939-81 s RES, CHIP 150K (1005) R7139 1-208-911-81 s RES, CHIP 10K (1005) R7059 1-208-915-81 s RES, CHIP 15K (1005) R7140 1-208-715-11 s RES, CHIP 22K (1005) 4-126 HDCU3300/MM (J,E)
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1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012 C309 1-127-760-91 s CAP, CHIP CERAMIC 4.7MF B 2012 C310 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C316 *2 1-112-324-91 s CAP, CERAMIC 0.47MF C (1005) C401 1-165-989-91 s CAP, CERAMIC 10MF (2012) 4-127 HDCU3300/MM (J,E)
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1-208-919-81 s RES, CHIP 22K (1005) R221 1-208-931-81 s RES, CHIP 68K (1005) 1-208-927-81 s RES, CHIP 47K (1005) R222 1-208-915-81 s RES, CHIP 15K (1005) 1-208-927-81 s RES, CHIP 47K (1005) R223 1-208-911-81 s RES, CHIP 10K (1005) 4-128 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C208 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C209 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C210 1-100-506-91 s CAP, CERAMIC 1MF C (1005) C211 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005 4-129 HDCU3300/MM (J,E)
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1-793-324-11 o CONNECTOR, COAXIAL (BNC TYPE) CN105 1-793-324-11 o CONNECTOR, COAXIAL (BNC TYPE) L901 1-414-398-41 s INDUCTOR (SMD) 10.0UH CN108 1-778-647-31 s CONNECTOR, FFC/FPC(ZIF) ST 15P L902 1-414-398-41 s INDUCTOR (SMD) 10.0UH 8-719-017-03 s DIODE 02DZ4.7-TPH3 8-729-209-73 s TRANSISTOR 2SA1213Y-TE12L 4-130 HDCU3300/MM (J,E)
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8-729-928-82 s TRANSISTOR DTC144EE-TL R119 1-208-879-81 s RES, CHIP 470 (1005) Q801 8-729-928-05 s TRANSISTOR 2SC4617TL-QR R120 1-208-927-81 s RES, CHIP 47K (1005) Q802 8-729-928-05 s TRANSISTOR 2SC4617TL-QR Q803 8-729-928-25 s TRANSISTOR 2SA1774TL-QR R121 1-208-911-81 s RES, CHIP 10K (1005) 4-131 HDCU3300/MM (J,E)
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1-208-915-81 s RES, CHIP 15K (1005) R611 1-208-927-81 s RES, CHIP 47K (1005) R309 1-208-927-81 s RES, CHIP 47K (1005) R612 1-208-915-81 s RES, CHIP 15K (1005) R310 1-208-919-81 s RES, CHIP 22K (1005) R613 1-208-911-81 s RES, CHIP 10K (1005) 4-132 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C108 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C109 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608 C110 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C111 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-133 HDCU3300/MM (J,E)
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1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) C303 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C410 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) C305 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C412 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) 4-134 HDCU3300/MM (J,E)
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1-100-506-91 s CAP, CERAMIC 1MF C (1005) FB303 1-414-554-21 s FERRITE, EMI (SMD) (1608) C708 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) FB305 1-414-554-21 s FERRITE, EMI (SMD) (1608) C709 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) 4-135 HDCU3300/MM (J,E)
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8-729-928-28 s TRANSISTOR DTA144EE-TL IC310 8-759-471-96 s IC 74VHC08MTCX Q704 8-729-928-82 s TRANSISTOR DTC144EE-TL IC319 8-759-592-44 s IC TC7SZ04FU(TE85R) Q705 8-729-041-23 s TRANSISTOR NDS356AP IC320 8-759-592-44 s IC TC7SZ04FU(TE85R) Q706 8-729-041-23 s TRANSISTOR NDS356AP IC321 8-759-592-44 s IC TC7SZ04FU(TE85R) 4-136 HDCU3300/MM (J,E)
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1-208-927-81 s RES, CHIP 47K (1005) R149 1-208-863-81 s RES, CHIP 100 (1005) 1-208-931-81 s RES, CHIP 68K (1005) R150 1-208-927-81 s RES, CHIP 47K (1005) 1-208-911-81 s RES, CHIP 10K (1005) R151 1-208-863-81 s RES, CHIP 100 (1005) 4-137 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R352 1-208-863-81 s RES, CHIP 100 (1005) R281 1-208-863-81 s RES, CHIP 100 (1005) R353 1-208-863-81 s RES, CHIP 100 (1005) R282 1-208-911-81 s RES, CHIP 10K (1005) R354 1-208-863-81 s RES, CHIP 100 (1005) 4-138 HDCU3300/MM (J,E)
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R425 1-208-915-81 s RES, CHIP 15K (1005) R531 1-218-990-81 s CONDUCTOR, CHIP (1005) R428 1-218-990-81 s CONDUCTOR, CHIP (1005) R532 1-218-990-81 s CONDUCTOR, CHIP (1005) R429 1-218-990-81 s CONDUCTOR, CHIP (1005) R533 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-139 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) R742 1-208-887-81 s RES, CHIP 1.0K (1005) R744 1-218-990-81 s CONDUCTOR, CHIP (1005) RB414 1-234-372-21 s RES, NETWORK 100 (1005X4) R745 1-208-895-81 s RES, CHIP 2.2K (1005) RB415 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-140 HDCU3300/MM (J,E)
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1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C108 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C109 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608 C110 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C111 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 4-141 HDCU3300/MM (J,E)
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1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) C303 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C410 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) C305 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C412 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608) 4-142 HDCU3300/MM (J,E)
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FB208 1-414-554-21 s FERRITE, EMI (SMD) (1608) C705 1-100-506-91 s CAP, CERAMIC 1MF C (1005) FB209 1-414-554-21 s FERRITE, EMI (SMD) (1608) C706 1-100-506-91 s CAP, CERAMIC 1MF C (1005) FB210 1-414-554-21 s FERRITE, EMI (SMD) (1608) 4-143 HDCU3300/MM (J,E)
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8-759-592-44 s IC TC7SZ04FU(TE85R) Q405 8-729-928-05 s TRANSISTOR 2SC4617TL-QR IC305 8-759-472-43 s IC 74VHC245MTCX Q406 8-729-928-28 s TRANSISTOR DTA144EE-TL IC306 8-759-669-43 s IC SN74LVC157APWR-12 Q407 8-729-928-82 s TRANSISTOR DTC144EE-TL IC307 6-707-945-01 s IC EPC4QC100N Q408 8-729-928-82 s TRANSISTOR DTC144EE-TL 4-144 HDCU3300/MM (J,E)
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1-208-907-81 s RES, CHIP 6.8K (1005) R143 1-208-911-81 s RES, CHIP 10K (1005) 1-208-919-81 s RES, CHIP 22K (1005) R144 1-208-911-81 s RES, CHIP 10K (1005) 1-208-911-81 s RES, CHIP 10K (1005) R145 1-208-887-81 s RES, CHIP 1.0K (1005) 4-145 HDCU3300/MM (J,E)
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1-208-863-81 s RES, CHIP 100 (1005) R346 1-208-863-81 s RES, CHIP 100 (1005) R274 1-208-863-81 s RES, CHIP 100 (1005) R347 1-208-863-81 s RES, CHIP 100 (1005) R275 1-208-863-81 s RES, CHIP 100 (1005) R348 1-208-863-81 s RES, CHIP 100 (1005) 4-146 HDCU3300/MM (J,E)
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1-208-907-81 s RES, CHIP 6.8K (1005) R524 1-218-990-81 s CONDUCTOR, CHIP (1005) R416 1-208-891-81 s RES, CHIP 1.5K (1005) R525 1-218-990-81 s CONDUCTOR, CHIP (1005) R417 1-208-927-81 s RES, CHIP 47K (1005) R526 1-218-990-81 s CONDUCTOR, CHIP (1005) 4-147 HDCU3300/MM (J,E)
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1-234-372-21 s RES, NETWORK 100 (1005X4) R728 1-208-903-81 s RES, CHIP 4.7K (1005) RB326 1-234-372-21 s RES, NETWORK 100 (1005X4) R729 1-208-863-81 s RES, CHIP 100 (1005) R731 1-208-863-81 s RES, CHIP 100 (1005) RB327 1-234-372-21 s RES, NETWORK 100 (1005X4) 4-148 HDCU3300/MM (J,E)
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1-414-398-41 s INDUCTOR (SMD) 10.0UH 1-414-398-41 s INDUCTOR (SMD) 10.0UH L101 1-414-398-41 s INDUCTOR (SMD) 10.0UH L102 1-414-398-41 s INDUCTOR (SMD) 10.0UH L103 1-414-398-41 s INDUCTOR (SMD) 10.0UH L104 1-414-398-41 s INDUCTOR (SMD) 10.0UH L201 1-414-398-41 s INDUCTOR (SMD) 10.0UH 4-149 HDCU3300/MM (J,E)
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1-218-831-91 s RES, CHIP 220 (1608) R210 1-218-831-91 s RES, CHIP 220 (1608) R212 1-218-839-91 s RES, CHIP 470 (1608) R214 1-218-839-91 s RES, CHIP 470 (1608) R215 1-216-864-91 s CONDUCTOR, CHIP (1608) R216 1-216-864-91 s CONDUCTOR, CHIP (1608) 4-150 HDCU3300/MM (J,E)
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1-414-398-41 s INDUCTOR (SMD) 10.0UH R145 1-218-887-91 s RES, CHIP 47K (1608) L104 1-414-398-41 s INDUCTOR (SMD) 10.0UH L105 1-414-398-41 s INDUCTOR (SMD) 10.0UH R146 1-211-977-91 s RES, CHIP 22 (1608) R202 1-218-823-91 s RES, CHIP 100 (1608) 4-151 HDCU3300/MM (J,E)
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1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012) C121 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012) C122 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) 1-778-451-31 s CONNECTOR, FFC/FPC(ZIF) AN 50P 1-770-161-21 s PIN, CONNECTOR (PC BOARD) 6P 4-152 HDCU3300/MM (J,E)
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8-719-421-28 s DIODE MA728-TX 1-414-398-41 s INDUCTOR (SMD) 10.0UH 8-719-421-28 s DIODE MA728-TX 1-414-398-41 s INDUCTOR (SMD) 10.0UH 8-719-421-28 s DIODE MA728-TX 1-414-398-41 s INDUCTOR (SMD) 10.0UH L101 1-414-398-41 s INDUCTOR (SMD) 10.0UH 8-719-421-28 s DIODE MA728-TX 4-153 HDCU3300/MM (J,E)
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1-208-923-81 s RES, CHIP 33K (1005) R126 1-208-863-81 s RES, CHIP 100 (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) R128 1-208-887-81 s RES, CHIP 1.0K (1005) 1-208-887-81 s RES, CHIP 1.0K (1005) R129 1-208-875-81 s RES, CHIP 330 (1005) 4-154 HDCU3300/MM (J,E)
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1-233-578-21 s RES, CHIP NETWORK 47K (3216) RB51 1-233-577-21 s RES, CHIP NETWORK 470 (3216) RB52 1-233-578-21 s RES, CHIP NETWORK 47K (3216) RB53 1-233-577-21 s RES, CHIP NETWORK 470 (3216) RB54 1-233-578-21 s RES, CHIP NETWORK 47K (3216) 4-155 HDCU3300/MM (J,E)
J-7120-140-A o PLD DOWNLOAD JIG 60001 through 60999 (HDCU3300: E2) *2: Serial No.40001 through 40999 (HDCU3300: CE) 50001 through 50999 (HDCU3300: E3) *3: Power block assembly (A10) is used. (HDCU3300: UC) (HDCU3300: J) (HDCU3300: E2) *4: Power block assembly (A10) is used. (HDCU3300: CE) (HDCU3300: E3) Ref.
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In addition, for semiconductors with ID Nos., refer to the separate CD-ROM titled “Semiconductor Pin Assignments” (Sony Part No. 9-968-546-xx) that allows searching for parts by semiconductor type or ID No. The semiconductors in the manual or on the CD-ROM are listed by equivalent types.
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AU-302 AU-302 D1-4 MAIN POWER CAM POWER CABLE OPEN CABLE SHORT D5-22 R/G/Y TALLY S1 MIC ON S3 PGM ON PROD PRIV DYNAMIC INCOM LEVEL CARBON MIC AMP UNBAL ON/OFF FRONT INTERCOM INTERFACE AU-302 HDCU3300/MM (J,E)
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IRQ2-1 CN902 IC302 IRQ3-1 DPR-CPU-CLK-out WAI-2 IC1,4(2/2),Q3 CN901 +5.5V c23,d23,e23 IC120 IC4(1/2),Q4 CN103 -5.5V d24,e24 CPU CLK TXD2 For PC I/F +3.8V a6,b6,c6,d6,e6 +3.3V IC3(2/2),Q1 +3.3V IC136 RXD2 +1.5V LEVEL CHECK PWR OK/NG POWER CPU UNIT CPU-395 (1/2) HDCU3300/MM (J,E)
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FORMAT 1 AT-ADDR(2) IC13 FORMAT 2 AT-ADDR(3) BUFF FORMAT 3 AT-ADDR(4) S1(2/2) AT-ADDR(5) FRAME/FIELD AT-ADDR(6) IC11 AT-ADDR(7) AT-A6-7 CHIP CN901 SELECT REAR-CS-in CS-PLD fr AT CN902 MST-RESET-in RESET fr AT AT-WR BUFF AT-WR AT-RD AT-RD CPU UNIT CPU-395 (2/2) HDCU3300/MM (J,E)
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CS1 CS2 74M-6 IC205 IC306 IC302 IC303 IC304 IC305 IC301 ROM1 ROM2 ROM3 ROM4 ROM5 BUFF IC211 CN301 ADRS CPU DATA BUS IC201 BUFF CPU ADRS BUS IC202 BUFF CPU CONTROL BUS IC203 BUFF VIDEO PROCESSOR UNIT DPR-271A HDCU3300/MM (J,E)
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74M-6 IC205 IC302 IC303 IC304 IC305 IC306 IC301 ROM1 ROM2 ROM3 ROM4 ROM5 BUFF IC211 CN301 ADRS CPU DATA BUS IC201 BUFF CPU ADRS BUS IC202 BUFF CPU CONTROL BUS IC203 BUFF VIDEO PROCESSOR UNIT DPR-271B 6-10 6-10 HDCU3300/MM (J,E)
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IC215 IC214 IC213 MIC1/2, 3/4, LRCK, 64FS IC216 IC211 BUFF IC901 ADRS BUFF MIC1/2, 3/4, LRCK, 64FS CPU DATA BUS IC201 BUFF CPU ADRS BUS CPU-IF IC202 BUFF VIDEO PROCESSOR CPU CONTROL BUS IC203 DRX-5 BUFF 6-11 6-11 HDCU3300/MM (J,E)
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IC103(1/2 ) CONDITION +3.3V-2 DC DC D606 CONVERTER CL105 THP106(1A) DOWN IC104 +1.8V DC DC S601 CN501 CONVERTER D103 JTAG CL106 IC504 POWER BUFFER THP101(1A) IC105 S602 DC DC +1.5V CONVERTER ROTTERY HD/SD/VBS RETURN SIGNAL CONVERTER DTX-5 6-12 6-12 HDCU3300/MM (J,E)
IC101 Q101 SPARE MONI CXD1095BR RECALL RECALL AUX Q108 SYNC/MONI SEL I/O PORT-2 WFM / MIC IC107(1/2) IC102 STAIR CASE1 STAIR CASE BUFFER FOR TOKUREN IC107(2/2) STAIR CASE2 AUX TRUNK(MARU12P) Q102-105 AUX TRUNK(D-SUB9P) CONNECTOR INTERFACE VIF-34G 6-18 6-18 HDCU3300/MM (J,E)
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PHOTO- LOW VOLTAGE PROTECTION PH64 SWITCH COUPLER ERROR SIGNAL PHOTOCOUPLER PH61 FAN STOP SIGNAL (two minutes after all system stop ) CN8006 PHOTOCOUPLER CN8001 POWER SWITCH RE-276 (CAMERA) POWER BLOCK ASSEMBLY (A10) CN-3275 PS-780 PS-781 RE-276 6-19 6-19 HDCU3300/MM (J,E)
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60001 - 60999 (E2) *2 If replacement with the power block assembly (A10) has been made, refer to *2 CN1(DSUB25) CN2(DSUB15) CN3(DSUB15) CN4(DSUB9) CN5(DSUB15) INCOM/TALLY/PGM MIC REMOTE WF REMOTE TRUNK LINE I/O PORT MIC 1 MIC 2 Frame Wiring 7-153 7-153 HDCU3300/MM (J,E)
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20 V AC range are suitable. (See Fig. A) To Exposed Metal Parts on Set 0.15 µ F 1.5 k Z voltmeter (5.25V) Earth Ground Fig A. Using an AC voltmeter to check AC leakage. HDCU3300/MM (J,E)