Electrical Parts List - Sony HDCU3300 Maintenance Manual

Hd camera control unit
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4-3. Electrical Parts List

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ADO-10G BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1161-078-A s MOUNTED CIRCUIT BOARD, ADO-10G
CN2
1-778-451-31 s CONNECTOR, FFC/FPC(ZIF) AN 50P
4-8
-----------------------------
AT-167S BOARD (suffix 13, 14)
-----------------------------
*1: Board No. suffix 13
*2: Board No. suffix 14
Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1207-222-A s MOUNTED CIRCUIT BOARD, AT-167S
! 1-528-174-11 s BATTERY, LITHIUM (CR2032 TYPE)
1pc
4pcs
7-682-947-01 s SCREW +PSW 3X6
BT101
1-756-076-21 s HOLDER, LITHIUM BATTERY
C1
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C2
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C3
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C4
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C5
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C6
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C7
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C8
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C9
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C10
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C11
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C12
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C13
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C14
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C15
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C16
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C18
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C19
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C20
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C21
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C22
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C23
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C24
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C25
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C26
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C28
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C29
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C30
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C31
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C33
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C34
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C35
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C37
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C38
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C39
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C41
1-126-391-21 s CAP, CHIP ELECT 47MF (5X5.7)
C101
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C102
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C103
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C104
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C105
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C107
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C108
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C109
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C110
1-104-905-11 s CAP, DOUBLE LAYERS 0.22F
C111
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C112
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C113
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C115
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C118
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HDCU3300/MM (J,E)

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