Special Handling Of Static-Sensitive Devices; Performance Verification; Environment Conditions; Recommended Test Equipment - Keithley 7174A Instruction Manual

8×12 low current matrix card
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4.5
Special handling of static-sensitive
devices
CMOS and other high-impedance devices are subject to pos-
sible static discharge damage because of the high-impedance
levels involved. When handling such devices, use the precau-
tions listed below.
NOTE
In order to prevent damage, assume that all
parts are static sensitive.
1. Such devices should be transported and handled only in
containers specially designed to prevent or dissipate
static build-up. Typically, these devices will be received
in anti-static containers made of plastic or foam. Keep
these parts in their original containers until ready for in-
stallation or use.
2. Remove the devices from their protective containers
only at a properly-grounded work station. Also ground
yourself with an appropriate wrist strap while working
with these devices.
3. Handle the devices only by the body; do not touch the
pins or terminals.
4. Any printed circuit board into which the device is to be
inserted must first be grounded to the bench or table.
5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.
Table 4-3
Recommended verification equipment
Qty.
Description
1
Model 617 Electrometer
1
Model 196 6½ Digit DMM
1
Model 707A Switching Matrix
4
Model 7078-TRX-10 triax cables*
2
Model 7078-TRX-3 triax cables
1
Model 6172 2-slot male to 3-lug female triaxial adapter
3
Model 7078-TRX-T triax tee adapter
5
Banana plugs (part #BG-10-2*)
1
Model 263 Calibrator/Source
1
BNC to Right-angle SMB Cable (part #CA-93-1)
1
BNC to Dual Banana Adapter (Pomona part #1269)
*These items are used to construct special cables; see text and Figure 4-9.
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4.6
Performance verification
The following paragraphs discuss performance verification
procedures for the Model 7174A, including relay testing,
contact resistance, contact potential, path isolation, and leak-
age current.

4.6.1 Environment conditions

All verification measurements except for path isolation and
offset current should be made at an ambient temperature of
21°C-25°C and a relative humidity of less than 0% R.H. Path
isolation and offset current verification must be performed at
an ambient temperature of 23°C and a relative humidity of
less than 60% R.H. If the card has been subjected to temper-
atures or humidities outside of this range for even a short
time, allow it to stabilize within these ranges for at least one
hour before performing any tests.

4.6.2 Recommended test equipment

Table 4-3 summarizes the equipment necessary to make the
performance verification tests, along with the application for
each item.
Application
Offset current; path isolation
Path resistance; electrometer
All tests
Offset current; path resistance
Path isolation; offset current; electrometer
Offset current; electrometer
Path resistance
Path isolation and resistance
Electrometer
Electrometer
Electrometer
Service Information
4-5

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