Table of Contents
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3
3.1
Introduction ........................................................................................................................................................ 3-1
3.2
CV measurements ............................................................................................................................................... 3-1
3.2.1
Stand alone system configuration ............................................................................................................... 3-1
3.2.2
Computerized system configuration ........................................................................................................... 3-1
3.2.3
Optimizing CV measurement accuracy ...................................................................................................... 3-3
3.2.4
Basic CV test procedure ............................................................................................................................. 3-3
3.2.5
Typical CV curves ...................................................................................................................................... 3-3
3.3
Semiconductor test matrix ................................................................................................................................. 3-5
3.3.1
System configuration .................................................................................................................................. 3-5
3.3.2
Testing common-source characteristic of FETs ......................................................................................... 3-6
3.4
Resistivity measurements ................................................................................................................................... 3-7
3.4.1
Test configuration ....................................................................................................................................... 3-7
3.4.2
Test procedure ............................................................................................................................................ 3-7
3.4.3
Resistivity calculations ............................................................................................................................... 3-9
3.5
Semiconductor IV characterization .................................................................................................................... 3-9
3.5.1
Test configuration ....................................................................................................................................... 3-9
3.5.2
Cable connections ..................................................................................................................................... 3-10
4
4.1
Introduction ........................................................................................................................................................ 4-1
4.2
Handling and cleaning precautions .................................................................................................................... 4-1
4.3
Principles of operation ........................................................................................................................................ 4-2
4.3.1
Block diagram ............................................................................................................................................ 4-2
4.3.2
ID data circuits ........................................................................................................................................... 4-2
4.3.3
Relay control .............................................................................................................................................. 4-3
4.3.4
Power-on sequence ..................................................................................................................................... 4-3
4.3.5
Isolator relays ............................................................................................................................................. 4-4
4.4
Troubleshooting .................................................................................................................................................. 4-4
4.4.1
Recommended equipment .......................................................................................................................... 4-4
4.4.2
Gaining circuit access ................................................................................................................................. 4-4
4.4.3
Troubleshooting procedure ......................................................................................................................... 4-4
4.5
Special handling of static-sensitive devices ....................................................................................................... 4-5
4.6
Performance verification .................................................................................................................................... 4-5
4.6.1
Environment conditions .............................................................................................................................. 4-5
4.6.2
Recommended test equipment .................................................................................................................... 4-5
4.6.3
Offset current verification .......................................................................................................................... 4-6
4.6.4
Path isolation verification ........................................................................................................................... 4-7
4.6.5
Path resistance verification ......................................................................................................................... 4-9
4.7
Reed pack replacement...................................................................................................................................... 4-11
5
5.1
Introduction ........................................................................................................................................................ 5-1
5.2
Parts list .............................................................................................................................................................. 5-1
5.3
Ordering information .......................................................................................................................................... 5-1
5.4
Factory service .................................................................................................................................................... 5-1
5.5
Component layout and schematic diagram ......................................................................................................... 5-1
ii
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