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4.1
Introduction
WARNING
The service procedures in this section
are intended for use only by qualified
service personnel. Do not perform these
procedures unless qualified to do so.
Failure to recognize and observe normal
safety precautions could result in per-
sonal injury or death.
This section contains information necessary to service the
Model 7174A Low Current Matrix Card and is arranged as
follows:
4.2
Handling and cleaning precautions — Discusses
handling precautions and methods to clean the card
should it become contaminated.
4.3
Principles of operation — Briefly discusses circuit
operation.
4.4
Troubleshooting — Presents some troubleshooting
tips for the Model 7174A.
4.5
Special handling of static-sensitive devices —
Reviews precautions necessary when handling static-
sensitive devices.
4.6
Performance verification — Describes conditions
and provides references to determine if the card is op-
erating properly.
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Service Information
4.7
Reed pack replacement — Provides a procedure for
replacing faulty reed packs.
4.2
Handling and cleaning precautions
Because of the high-impedance circuits on the Model
7174A, care should be taken when handling or servicing the
card to prevent possible contamination. The following pre-
cautions should be taken when servicing the card.
1. Handle the card only by the edges and handle (do not
touch the edge connectors). Do not touch any board sur-
faces or components not associated with the repair.
2. Do not store or operate the card in an environment
where dust could settle on the circuit board. Use dry ni-
trogen gas to clean dust off the board if necessary.
3. When making repairs on the circuit board, use aqua core
solder and OA-based (organic activated) flux. Use warm
deionized water along with clean cotton swabs or a
clean, soft brush to remove the flux. Take care not to
spread the flux to other areas of the circuit board. Once
the flux has been removed, blow dry the board with dry
nitrogen gas.
Removal of skin oils and other non-
organic contaminants can be done with
methanol or an HCFC.
4. After cleaning, the card should be placed in a 50°C low-
humidity environment for several hours before use.
4
NOTE
4-1
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