Installation Site Examination; Temperature And Humidity Requirements; Cleanliness - H3C LSQM1WCMB0 Installation Manual

The accessories vary with the models. For the exact contents of the package, refer to
the packing list. If the contents do not match the packing list, contact your H3C
representative.
If the package is found to be rusted or water soaked, stop unpacking and contact your
H3C representative immediately.

Installation site examination

The installation environment for the access controller module must meet the
requirements described in this section.

Temperature and humidity requirements

Proper temperature and humidity must be maintained in the equipment room. Lasting
high relative humidity tends to cause poor insulation, electricity creepage, mechanical
property change of materials, and corrosion of metal parts, while lasting low relative
humidity can result in loose screws due to washer contraction, and even electrostatic
discharge (ESD) that causes failure of the complementary metal-oxide-semiconductor
(CMOS) circuitry. A proper temperature condition must also be maintained to prevent
premature material aging and degraded reliability accompanying high temperature
conditions.

Cleanliness

Dust is hazardous to the operation safety of the access controller module. Dust buildup
on the chassis may result in static adsorption, causing poor contact of metal
components or contact points. Electrostatic adsorption is more likely to happen when
the relative indoor humidity is low. This shortens the service life of your device and causes
communication failures.
Prevent dust from exceeding the concentration limits in the equipment room (see Table
3 ).
Table 3 Dust concentration limit in the equipment room
Substance
Dust particles
Note: Dust particle diameter ≥ 5 µm
Concentration limit (particles/m
≤ 3 x 10 (No visible dust on desk in three days)
4
10
)
3